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특허 상세정보

Electronic device structures joined using shrinking and expanding attachment structures

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01R-004/72    G06F-001/18   
출원번호 US-0295051 (2014-06-03)
등록번호 US-9454188 (2016-09-27)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Treyz Law Group, P.C.
인용정보 피인용 횟수 : 1  인용 특허 : 19

An electronic device has structures that are assembled using attachment structures. The attachment structures change shape to help join the electronic device structures together. Structures that may be joined together can include electronic device housing structures, display structures, internal device components, electrical components, and other portions of an electronic device. The attachment structures can include heat-activated attachment structures, structures that are activated using other types of applied energy, and structures that change shape d...


1. Apparatus, comprising: a first electronic device structure;a second electronic device structure; anda shrinkable attachment structure that draws the first electronic device structure into contact with the second electronic device structure, wherein the second electronic device structure has a stop structure with a surface that arrests motion of the first electronic device structure relative to the second electronic device structure due to shrinking the shrinkable attachment structure. 2. The apparatus defined in claim 1 wherein the first electronic de...

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