Aspects of the invention include a sensor that senses the absolute temperature of a device, such as an integrated circuit (“IC”). The sensor may be embodied in the IC and have first and second pieces of electrically conductive material each having an intrinsic Seebeck coefficient and a pair of conta
Aspects of the invention include a sensor that senses the absolute temperature of a device, such as an integrated circuit (“IC”). The sensor may be embodied in the IC and have first and second pieces of electrically conductive material each having an intrinsic Seebeck coefficient and a pair of contacts located at proximal and distal ends of the pieces of material. The intrinsic Seebeck coefficients differ between the two pieces of material. At least one heater is disposed at the proximal ends of the first and second pieces material and radiates heat which causes a temperature difference to form across each of the first and second pieces of material, thereby causing a voltage to form across first and second pieces of material. A measure circuit measures the voltage formed across each of the first and second pieces of material and determines an absolute temperature from at least the measured voltages.
대표청구항▼
1. A sensor comprising: a first piece of electrically conductive material having an intrinsic Seebeck coefficient, the first piece of electrically conductive material having a pair of contacts, a first one of the contacts located at a proximal end of the first piece of electrically conductive materi
1. A sensor comprising: a first piece of electrically conductive material having an intrinsic Seebeck coefficient, the first piece of electrically conductive material having a pair of contacts, a first one of the contacts located at a proximal end of the first piece of electrically conductive material, a second one of the contacts located at a distal end of the first piece of electrically conductive material;a second piece of electrically conductive material having an intrinsic Seebeck coefficient that is different than the intrinsic Seebeck coefficient of the first piece of electrically conductive material, the second piece of electrically conductive material having a pair of contacts, a first one of the contacts located at a proximal end of the second piece of electrically conductive material, a second one of the contacts located at a distal end of the second piece of electrically conductive material;at least one heater disposed adjacent to, or abutting, or on top of the proximal ends of the first and second pieces of electrically conductive material, the heater configured to radiate heat wherein the radiated heat causes a temperature difference to form across each of the first and second pieces of electrically conductive material, thereby causing a voltage to form across each of the first and second pieces of electrically conductive material; anda measure circuit that measures the voltage formed across each of the first and second pieces of electrically conductive material and determines an absolute temperature from at least the measured voltages. 2. The sensor of claim 1 wherein the first and second pieces of electrically conductive material comprise a semiconductor or a metal material. 3. The sensor of claim 1 wherein the measure circuit measures the voltage formed across each of the first and second pieces of electrically conductive material at the corresponding proximal and distal contacts of the first and second pieces of electrically conductive material. 4. The sensor of claim 1 wherein the Seebeck coefficients of the first and second pieces of electrically conductive material are independent of any dimensions of the first and second pieces of electrically conductive material. 5. The sensor of claim 1 wherein at least one of the first and second pieces of electrically conductive material has a temperature dependence on the Seebeck coefficient of the at least one of the first and second pieces of electrically conductive material. 6. The sensor of claim 1 wherein the pair of contacts of the first piece of electrically conductive material and the pair of contacts of the second piece of electrically conductive material comprise a material having a Seebeck coefficient. 7. The sensor of claim 1 wherein the voltage formed across each of the first and second pieces of electrically conductive material comprises a Seebeck voltage, wherein a ratio of the Seebeck voltage formed across the first piece of electrically conductive material and the Seebeck voltage formed across the second piece of electrically conductive material is independent of the temperature difference formed across each of the first and second pieces of electrically conductive material. 8. The sensor of claim 1 wherein the sensor is implemented within an integrated circuit. 9. A method comprising: providing a first piece of electrically conductive material having an intrinsic Seebeck coefficient, the first piece of electrically conductive material having a pair of contacts, a first one of the contacts located at a proximal end of the first piece of electrically conductive material, a second one of the contacts located at a distal end of the first piece of electrically conductive material;providing a second piece of electrically conductive material having an intrinsic Seebeck coefficient that is different than the intrinsic Seebeck coefficient of the first piece of electrically conductive material, the second piece of electrically conductive material having a pair of contacts, a first one of the contacts located at a proximal end of the second piece of electrically conductive material, a second one of the contacts located at a distal end of the second piece of electrically conductive material;providing at least one heater disposed adjacent to, or abutting, or on top of the proximal ends of the first and second pieces of electrically conductive material, the heater configured to radiate heat wherein the radiated heat causes a temperature difference to form across each of the first and second pieces of electrically conductive material, thereby causing a voltage to form across each of the first and second pieces of electrically conductive material; andproviding a measure circuit that measures the voltage formed across each of the first and second pieces of electrically conductive material and determines an absolute temperature from at least the measured voltages. 10. The method of claim 9 wherein the measure circuit measures the voltage formed across each of the first and second pieces of electrically conductive material at the corresponding proximal and distal contacts of the first and second pieces of electrically conductive material. 11. The method of claim 9 wherein the Seebeck coefficients of the first and second pieces of electrically conductive material are independent of any dimensions of the first and second pieces of electrically conductive material. 12. The method of claim 9 wherein at least one of the first and second pieces of electrically conductive material has a temperature dependence on the Seebeck coefficient of the at least one of the first and second pieces of electrically conductive material. 13. A sensor comprising: a first piece of electrically conductive material having an intrinsic Seebeck coefficient, the first piece of electrically conductive material having a pair of contacts, a first one of the contacts located at a proximal end of the first piece of electrically conductive material, a second one of the contacts located at a distal end of the first piece of electrically conductive material;a second piece of electrically conductive material having an intrinsic Seebeck coefficient that is different than the intrinsic Seebeck coefficient of the first piece of electrically conductive material, the second piece of electrically conductive material having a pair of contacts, a first one of the contacts located at a proximal end of the second piece of electrically conductive material, a second one of the contacts located at a distal end of the second piece of electrically conductive material;at least one heater disposed adjacent to, or abutting, or on top of the proximal ends of the first and second pieces of electrically conductive material, the heater configured to radiate heat wherein the radiated heat causes a temperature difference to form across each of the first and second pieces of electrically conductive material, thereby causing a voltage to form across each of the first and second pieces of electrically conductive material, wherein the voltage formed across each of the first and second pieces of electrically conductive material is indicative of an absolute temperature value provided by the sensor. 14. The sensor of claim 13 further comprising: a plurality of the first pieces of the electrically conductive material, the plurality the first pieces of electrically conductive material being connected in series; anda plurality of the second pieces of electrically conductive material, the plurality of the second pieces of electrically conductive material being connected in series. 15. The sensor of claim 13 wherein the first and second pieces of electrically conductive material comprise a semiconductor or a metal material. 16. The sensor of claim 13 wherein the Seebeck coefficients of the first and second pieces of electrically conductive material are independent of any dimensions of the first and second pieces of electrically conductive material. 17. The sensor of claim 13 wherein the voltage formed across each of the first and second pieces of electrically conductive material comprises a Seebeck voltage, wherein a ratio of the Seebeck voltage formed across the first piece of electrically conductive material and the Seebeck voltage formed across the second piece of electrically conductive material is independent of the temperature difference formed across each of the first and second pieces of electrically conductive material. 18. The sensor of claim 13 wherein the sensor is implemented within an integrated circuit. 19. The sensor of claim 13 further comprising a measure circuit that measures the voltage formed across each of the first and second pieces of electrically conductive material and determines the absolute temperature value provided by the sensor from at least the measured voltages. 20. The sensor of claim 19 wherein the measure circuit measures the voltage formed across each of the first and second pieces of electrically conductive material at the corresponding proximal and distal contacts of the first and second pieces of electrically conductive material.
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이 특허에 인용된 특허 (3)
Grayson, Matthew A.; Memik, Seda; Long, Jieyi; Zhou, Chuanle; Klock, Andrea Grace, Bimetallic integrated on-chip thermocouple array.
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