Fan out package structure and methods of forming
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-023/532
H01L-023/00
H01L-021/768
H01L-021/56
H01L-023/522
H01L-023/528
H01L-023/525
H01L-023/31
출원번호
US-0961183
(2015-12-07)
등록번호
US-9472516
(2016-10-18)
발명자
/ 주소
Wang, Pu
Shih, Ying-Ching
Lu, Szu-Wei
Lin, Jing-Cheng
출원인 / 주소
Taiwan Semiconductor Manufacturing Company, Ltd.
대리인 / 주소
Slater Matsil, LLP
인용정보
피인용 횟수 :
0인용 특허 :
2
초록▼
An embodiment is a structure comprising a die having a pad on a surface and an encapsulant at least laterally encapsulating the die. The pad is exposed through the encapsulant. The structure further includes a first dielectric layer over the encapsulant and the die, a first conductive pattern over t
An embodiment is a structure comprising a die having a pad on a surface and an encapsulant at least laterally encapsulating the die. The pad is exposed through the encapsulant. The structure further includes a first dielectric layer over the encapsulant and the die, a first conductive pattern over the first dielectric layer, and a second dielectric layer over the first conductive pattern and the first dielectric layer. The first dielectric layer and the second dielectric layer have a first opening to the pad of the die. The structure further includes a second conductive pattern over the second dielectric layer and in the first opening. The second conductive pattern adjoins a sidewall of the first dielectric layer in the first opening and a sidewall of the second dielectric layer in the first opening.
대표청구항▼
1. A structure comprising: a die having a pad on a surface;an encapsulant at least laterally encapsulating the die, the pad being exposed through the encapsulant;a first dielectric layer over the encapsulant and the die;a first conductive pattern over the first dielectric layer;a second dielectric l
1. A structure comprising: a die having a pad on a surface;an encapsulant at least laterally encapsulating the die, the pad being exposed through the encapsulant;a first dielectric layer over the encapsulant and the die;a first conductive pattern over the first dielectric layer;a second dielectric layer over the first conductive pattern and the first dielectric layer, the first dielectric layer and the second dielectric layer having a first opening to the pad of the die; anda second conductive pattern over the second dielectric layer and in the first opening, the second conductive pattern adjoining a sidewall of the first dielectric layer in the first opening and a sidewall of the second dielectric layer in the first opening. 2. The structure of claim 1, wherein the first conductive pattern comprises a connecting portion, the connecting portion having a second opening, the second opening defining the first opening in the first dielectric layer, a sidewall of the connecting portion adjoining the second conductive pattern in the first opening. 3. The structure of claim 2, wherein the connecting portion comprises a ring having the second opening. 4. The structure of claim 2, wherein the connecting portion comprises a rectangular shape, a triangular shape, a hexagonal shape, an octagonal shape, or a combination thereof. 5. The structure of claim 2, wherein the connecting portion has a continuous portion enclosing the second opening. 6. The structure of claim 2, wherein the connecting portion has discontinuous portions around the second opening. 7. The structure of claim 1, wherein the second conductive pattern comprises a seed layer and a main layer over the seed layer. 8. The structure of claim 1 further comprising: an external electrical connector on the second conductive pattern; anda bracing material over the second dielectric layer and the second conductive pattern and around at least a portion of the external electrical connector. 9. A structure comprising: a package comprising: a die comprising a pad,an encapsulant around the die, anda dielectric multi-layer structure over the die and the encapsulant, the dielectric multi-layer structure comprising a first conductive pattern in the dielectric multi-layer structure and a second conductive pattern on the dielectric multi-layer structure, a first portion of the second conductive pattern extending through the dielectric multi-layer structure to the pad; andan external electrical connector on the package. 10. The structure of claim 9, wherein the first conductive pattern comprises a connecting portion, a sidewall of the connecting portion adjoining the first portion of the second conductive pattern. 11. The structure of claim 10, wherein the connecting portion comprises a ring around the first portion of the second conductive pattern. 12. The structure of claim 10, wherein the connecting portion has a continuous portion enclosing the first portion of the second conductive pattern. 13. The structure of claim 9, wherein each of the first conductive pattern and the second conductive pattern comprises a seed layer and a main layer over the seed layer. 14. A structure comprising: a die having a conductive pad;an encapsulant at least laterally encapsulating the die;an interconnect structure on the die and the encapsulant, the interconnect structure being electrically coupled to the conductive pad, the interconnect structure comprising: a first conductive pattern on a first dielectric layer,a second dielectric layer on the first conductive pattern and the first dielectric layer, anda second conductive pattern over the second dielectric layer, the second conductive pattern having a first portion extending through the first dielectric layer and the second dielectric layer to a conductive feature, the first portion of the second conductive pattern adjoining a sidewall of the first dielectric layer, a sidewall of the first conductive pattern, and a sidewall of the second dielectric layer, the first portion of the second conductive pattern contacting the conductive feature; andan external electrical connector on the interconnect structure. 15. The structure of claim 14, wherein the conductive feature is the conductive pad of the die. 16. The structure of claim 14, wherein the first conductive pattern is continuous laterally around the first portion of the second conductive pattern. 17. The structure of claim 14, wherein the first conductive pattern is discontinuous laterally around the first portion of the second conductive pattern. 18. The structure of claim 14, wherein each of the first conductive pattern and the second conductive pattern comprises a seed layer and a main layer over the seed layer. 19. The structure of claim 14 further comprising: a bracing material over the second dielectric layer and the second conductive pattern and around at least a portion of the external electrical connector. 20. The structure of claim 14, wherein the first portion of the second conductive pattern has a circular shape.
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이 특허에 인용된 특허 (2)
Stuart E. Greer, Method of forming copper interconnection utilizing aluminum capping film.
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