[특허]Method for manufacturing sealed structure including welded glass frits

Method for manufacturing sealed structure including welded glass frits 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-021/00 H01L-051/52 H01L-051/56
출원번호	US-0645091 (2012-10-04)
등록번호	US-9472776 (2016-10-18)
우선권정보	JP-2011-227026 (2011-10-14)
발명자 / 주소	Miyairi, Hidekazu Shimomura, Akihisa
출원인 / 주소	Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소	Husch Blackwell LLP
인용정보	피인용 횟수 : 0 인용 특허 : 27

초록 ▼

A method for manufacturing a sealed structure in which few cracks are generated is provided. Scan with the laser beam is performed so that there is no difference in an irradiation period between the middle portion and the perimeter portion of the glass layer and so that the scanning direction is substantially parallel to the direction in which solidification of the glass layer after melting proceeds. More specifically, in a region where the beam spot is overlapped with the glass layer, scan is performed with a laser beam having a beam spot shape whose width in a scanning direction is substantially uniform. Further, as a laser beam with which the glass layer is irradiated, a laser beam (a linear laser beam) having a linear beam spot shape with a major axis and a minor axis which is orthogonal to the major axis.

대표청구항 ▼

1. A method for manufacturing a sealed structure, comprising the steps of: placing a second substrate to face a first substrate and to be in contact with a glass layer including welded glass frits provided over the first substrate; andscanning and irradiating the glass layer with a laser beam to weld the glass layer to the second substrate,wherein an inner side of the glass layer is quadrilateral and an outer side of the glass layer is hexagonal. 2. The method for manufacturing a sealed structure, according to claim 1, wherein the glass layer is provided to have a closed shape. 3. The method for manufacturing a sealed structure, according to claim 1, wherein a light-emitting element is formed over the first substrate. 4. The method for manufacturing a sealed structure, according to claim 1, wherein, in a region where the laser beam and the glass layer overlap each other, a width of a beam spot of the laser beam in a direction of the scanning is substantially uniform. 5. The method for manufacturing a sealed structure, according to claim 1, wherein a beam spot shape of the laser beam has a major axis and a minor axis orthogonal to the major axis, andwherein the beam spot of the laser beam is tilted so that an angle between a scanning direction and the minor axis exceeds 0°. 6. A method for manufacturing a sealed structure, comprising the steps of: placing a second substrate to face a first substrate and to be in contact with a glass layer including welded glass fits provided over the first substrate; andscanning and irradiating the glass layer with a laser beam to weld the glass layer to the second substrate,wherein the glass layer irradiated with the laser beam includes a stripe connecting inside and outside of the glass layer, andwherein an inner side of the glass layer is quadrilateral and an outer side of the glass layer is hexagonal. 7. The method for manufacturing a sealed structure, according to claim 6, wherein the glass layer is provided to have a closed shape. 8. The method for manufacturing a sealed structure, according to claim 6, wherein a light-emitting element is formed over the first substrate. 9. The method for manufacturing a sealed structure, according to claim 6, wherein, in a region where the laser beam and the glass layer overlap each other, a width of a beam spot of the laser beam in a direction of the scanning is substantially uniform. 10. The method for manufacturing a sealed structure, according to claim 6, wherein a beam spot shape of the laser beam has a major axis and a minor axis orthogonal to the major axis, andwherein the beam spot of the laser beam is tilted so that an angle between a scanning direction and the minor axis exceeds 0°.

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