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System for evaluating and/or improving performance of a CMP pad dresser

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-049/00
  • B24D-018/00
  • B24B-053/02
  • B24B-001/00
  • B24B-049/18
  • B24B-053/017
  • B24D-003/28
출원번호 US-0223726 (2014-03-24)
등록번호 US-9475169 (2016-10-25)
발명자 / 주소
  • Sung, Chien-Min
출원인 / 주소
  • Sung, Chien-Min
대리인 / 주소
    Thorpe North & Western LLP
인용정보 피인용 횟수 : 0  인용 특허 : 261

초록

Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality of superabrasive particles on

대표청구항

1. A method of identifying overly-aggressive superabrasive particles in a CMP pad dresser, comprising: positioning a CMP pad dresser having a plurality of superabrasive particles on an indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser

이 특허에 인용된 특허 (261)

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  193. Sung,Chien Min; Pai,Yang Liang, Pad conditioner dresser with varying pressure.
  194. Moon,Sung Taok; Lee,Dong Jun; So,Jae Hyun; Kang,Kyoung Moon; Ahn,Bong Su, Pad conditioner for chemical mechanical polishing apparatus.
  195. Garretson, Charles C., Pad conditioning disk.
  196. D\Silva Thomas L. (Belmont CA), Partially amorphous silver-copper-indium brazing foil.
  197. Vincent D. Romero, Patterned abrading articles and methods of making and using same.
  198. Tselesin Naum N. (Atlanta GA), Patterned abrasive material and method.
  199. Woo Christy M.-C., Performing chemical mechanical polishing of oxides and metals using sequential removal on multiple polish platens to inc.
  200. Tateno Yasuo (Miyagi JPX) Naruse Hiroji (Miyagi JPX) Abe Mayumi (Miyagi JPX), Perpendicular magnetic recording medium and process for production of the same.
  201. Sathrum Paul E. (Sparta NJ) Coll Bernard F. (Sparta NJ), Plasma enhancement apparatus and method for physical vapor deposition.
  202. Kojima, Shunichiro; Hirokawa, Kazuto; Kodera, Akira, Polishing apparatus and dressing method for polishing tool.
  203. Tanaka Katsunori,JPX, Polishing machine with efficient polishing and dressing.
  204. Doan, Trung; Balagani, Venkata R.; Ngan, Kenny King-Tai, Polishing pad conditioner and methods of manufacture and recycling.
  205. Balagani,Venkata R.; Lazari,George; Ngan,Kenny King Tai, Polishing pad conditioner with shaped abrasive patterns and channels.
  206. Paul Holzapfel, Polishing pad conditioning device with cutting elements.
  207. Billett Bruce H., Polishing pad conditioning surface having integral conditioning points.
  208. Hempel ; Jr. Eugene O., Polishing pad conditioning system and method.
  209. Osterheld, Thomas H.; Ko, Sen-Hou, Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus.
  210. Morimura Yasuhiro,JPX ; Kotsubo Hidefumi,JPX, Polishing sheet.
  211. Takashita Junji (Yokohama JPX) Yamamoto Hironori (Chigasaki JPX) Nakamura Nobuo (Yokohama JPX) Imanari Toru (Kawasaki JPX) Kozakai Takashi (Setagaya JPX), Polishing/grinding tool and process for producing the same.
  212. Frushour Robert H. (Ann Arbor MI), Polycrystalline abrasive grit.
  213. Frushour Robert H. (Ann Arbor MI), Polycrystalline abrasive grit.
  214. Corrigan Francis R. (Worthington OH), Polycrystalline cubic boron nitride abrasive and process for preparing same in the absence of catalyst.
  215. Hall David R. (Provo UT), Polycrystalline diamond body with enhanced surface irregularities.
  216. Sung,Chien Min, Polycrystalline grits and associated methods.
  217. Mullins James M. (Austin TX), Preconditioner for a polishing pad and method for using the same.
  218. Brown, William D.; Beera, Rajan A.; Malshe, Ajay P.; Naseem, Hameed A., Process and apparatus for applying charged particles to a substrate, process for forming a layer on a substrate, products made therefrom.
  219. Sung Chien-Min,TWX, Process for controlling diamond nucleation during diamond synthesis.
  220. Chen Chia-Fu (Hsinchu TWX) Chen Sheng-Hsiung (Tai-Ya Hsiang TWX) Hong Tsao-Ming (Erh-Lin Chen TWX), Process for depositing diamond by chemical vapor deposition.
  221. Lai Lei Ping ; Kim Sung C., Process for forming a semiconductor device.
  222. Gigl Paul D. (Worthington OH), Process for making diamond and cubic boron nitride compacts.
  223. Kim Sung C. ; Bajaj Rajeev ; Zaleski Mark A., Process for polishing a semiconductor device substrate.
  224. Corrigan Francis R. (Westerville OH), Process for preparing polycrystalline CBN ceramic masses.
  225. Sumiya Hitoshi (Itami) Tsuji Kazuwo (Itami JPX), Process for production of diamond abrasive grains.
  226. Sumiya Hitoshi,JPX ; Satoh Shuichi,JPX ; Nishibayashi Yoshiki,JPX, Process for the production of synthetic diamond.
  227. Duescher, Wayne O., Raised island abrasive, method of use and lapping apparatus.
  228. Inoue Kiyoshi (Tokyo JPX) Onoue Makoto (Yokohama JPX) Otaki Noriyoshi (Yokohama JPX), Recess electrodepositing method, electrode assembly and apparatus.
  229. Johnson David M. (Westerville OH) Corrigan Francis R. (Columbus OH), Reduction of stresses in the polycrystalline abrasive layer of a composite compact with in situ bonded carbide/carbide s.
  230. Wayne Lougher ; Timothy S. Dyer, Rigid polishing pad conditioner for chemical mechanical polishing tool.
  231. Schuster, Bernd; Schwarz, Bernd; Nikles, Rufold, Rotary slide.
  232. Nanda Arun Kumar,SGX ; Quek Ser Wee,SGX, Rounded surface for the pad conditioner using high temperature brazing.
  233. Deakins Martin E. (Dublin OH) Slutz David E. (Worthington OH) Johnson Neil R. (Columbus OH) Clark Thomas J. (Powell OH) Bovenkerk Harold P. (Worthington OH), Sawblade segments utilizing polycrystalline diamond grit.
  234. Cho, Hyun Sam; Chen, John; Han, Kyung Yul, Self-grown monopoly compact grit.
  235. Appel Andrew T. (Dallas TX) Chisholm Michael F. (Plano TX), Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad condition.
  236. Berger Sidney E. (Rye NY), Silicon treated surfaces.
  237. Zador Eugene (Ballston Lake NY) Hsu Shyiguei (Watervliet NY) Kaczmarek Wesley R. (Ballston Lake NY) Ravipati Sitaramaiah (Latham NY) Supkis Stanley (Averill Park NY) Vogel Richard H. (Saratoga Spring, Single step, radiation curable ophthalmic fining pad.
  238. Wofsey David (3368 S. Ulster Court Denver CO 80231), Sonic spark plug.
  239. Endo Yukio (Yokohama JPX) Mitani Kazuyuki (Tokyo JPX) Matsuoka Tadashi (Kodaira JPX) Ueki Masayoshi (Abiko JPX) Otake Norio (Tokyo JPX), Super abrasive grinding tool element and grinding tool.
  240. Sung,Chien Min, Superabrasive particle synthesis with controlled placement of crystalline seeds.
  241. Sung,Chien Min, Superabrasive particle synthesis with controlled placement of crystalline seeds.
  242. Fisher Kawika S. (Buford GA), Superabrasive tool.
  243. Mitsui Kosuke,JPX ; Fukunishi Toshio,JPX ; Kadomura Kazunori,JPX ; Shimizu Yukio,JPX ; Kouta Yoshio,JPX ; Yamanaka Masaaki,JPX ; Hara Akio,JPX, Superabrasive tool and method of manufacturing the same.
  244. Sung, Chien-Min, Superabrasive tools having substantially leveled particle tips and associated methods.
  245. Sung, Chien-Min, Superhard cutters and associated methods.
  246. Sung, Chien-Min, Superhard cutters and associated methods.
  247. Yazu Shuji (Hyogo JPX) Satoh Shuichi (Hyogo JPX), Synthetic diamond heat sink.
  248. Sung, Chien-Min, System for evaluating and/or improving performance of a CMP pad dresser.
  249. Bovenkerk Harold P. (Worthington OH) Gigl Paul D. (Worthington OH), Temperature resistant abrasive compact and method for making same.
  250. Bovenkerk Harold P. (Worthington OH), Thermally stable dense electrically conductive diamond compacts.
  251. Sung,Chien Min, Tools for polishing and associated methods.
  252. Sung,Chien Min, Tools for polishing and associated methods.
  253. Preston Jay B. ; Tselesin Naum N. ; Gorsuch Ian,GBX, Tools with abrasive segments.
  254. Mller Karl-Heinz (Berlin DEX) Krisch Burkhard (Berlin DEX) Rindfleisch Volker (Berlin DEX) Neuendorff Hans F. R. (Berlin DEX), Transmission-type scanning charged-particle beam microscope.
  255. Powell David G. ; Watson Stanley A., Two-sided abrasive tool and method of assembling same.
  256. Fernandez-Moran Villalobos Humberto (55 Dartmouth Rd. Williams Bay WI 53191), Ultrasharp polycrystalline diamond edges, points, and improved diamond composites, and methods of making and irradiating.
  257. Ishizaki, Junji; Ito, Kenji; Fujii, Tsuyoshi; Watanabe, Kimihiro, Vitrified bond tool and method of manufacturing the same.
  258. Ishizaki,Junji; Ito,Kenji; Fujii,Tsuyoshi; Watanabe,Kimihiro, Vitrified bond tool and method of manufacturing the same.
  259. Sakuma, Noriyuki; Tsunenari, Kinji, Wafer polishing method and wafer polishing apparatus in semiconductor fabrication equipment.
  260. Solanki Mukesh M. (New Albany IN) Harley Christopher (New Albany IN), Wear resistance in a hardfaced substrate.
  261. Murai Teruyuki (Hyogo JPX) Hashimoto Yoshihiro (Hyogo JPX) Kawakita Takao (Osaka JPX), Wire incrusted with abrasive grain.
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