System for evaluating and/or improving performance of a CMP pad dresser
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B24B-049/00
B24D-018/00
B24B-053/02
B24B-001/00
B24B-049/18
B24B-053/017
B24D-003/28
출원번호
US-0223726
(2014-03-24)
등록번호
US-9475169
(2016-10-25)
발명자
/ 주소
Sung, Chien-Min
출원인 / 주소
Sung, Chien-Min
대리인 / 주소
Thorpe North & Western LLP
인용정보
피인용 횟수 :
0인용 특허 :
261
초록▼
Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality of superabrasive particles on
Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality of superabrasive particles on an indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser contact the indicator substrate, and moving the CMP pad dresser across the indicator substrate in a first direction such that the portion of the plurality of superabrasive particles create a first marking pattern on the substrate, wherein the first marking pattern identifies a plurality of working superabrasive particles from among the plurality of superabrasive particles.
대표청구항▼
1. A method of identifying overly-aggressive superabrasive particles in a CMP pad dresser, comprising: positioning a CMP pad dresser having a plurality of superabrasive particles on an indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser
1. A method of identifying overly-aggressive superabrasive particles in a CMP pad dresser, comprising: positioning a CMP pad dresser having a plurality of superabrasive particles on an indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser contact the indicator substrate;pressing the CMP pad dresser against the indicator substrate with a fixed load; andmoving the CMP pad dresser across the indicator substrate in a first direction such that the portion of the plurality of superabrasive particles create a first marking pattern on the substrate, wherein the first marking pattern identifies a plurality of working superabrasive particles from among the plurality of superabrasive particles. 2. The method of claim 1, further comprising moving the CMP pad dresser in a second direction across the indicator substrate such that the portion of the plurality of superabrasive particles create a second marking pattern, the second direction being substantially transverse to the first direction, wherein the second marking pattern compared with the first marking pattern provides orientation information of the plurality of working superabrasive particles. 3. The method of claim 1, wherein the indicator substrate includes an indicator marker that marks the plurality of working superabrasive particles as the CMP pad dresser is moved across the indicator substrate. 4. The method of claim 3, wherein the indicator marker includes a member selected from the group consisting of pigment markers, fluorescent markers, chemical markers, radioactive markers, and combinations thereof. 5. The method of claim 1, wherein the plurality of superabrasive particles have at least one alignment orientation direction with respect to the CMP pad dresser, and wherein the first direction is not the at least one alignment orientation. 6. The method of claim 1, further comprising identifying and ablating overly-aggressive superabrasive particles from the plurality of working superabrasive particles. 7. The method of claim 6, further comprising: positioning the CMP pad dresser on a subsequent indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser contact the subsequent indicator substrate; andmoving the CMP pad dresser across the subsequent indicator substrate in the first direction such that the portion of the plurality of superabrasive particles create a subsequent marking pattern on the substrate, wherein the subsequent marking pattern identifies a subsequent plurality of superabrasive particles from among the plurality of superabrasive particles. 8. The method of claim 1, wherein the plurality of superabrasive particles is a plurality of superabrasive segments, and the plurality of working superabrasive particles is a plurality of working superabrasive segments. 9. A method of increasing a proportion of working superabrasive particles in a CMP pad dresser, comprising: positioning a CMP pad dresser having a plurality of superabrasive particles on an indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser contact the indicator substrate;pressing the CMP pad dresser against the indicator substrate under a fixed load;moving the CMP pad dresser across the indicator substrate in a first direction such that the portion of the plurality of superabrasive particles create a first marking pattern on the substrate, wherein the first marking pattern identifies a plurality of working superabrasive particles from among the plurality of superabrasive particles;identifying a plurality of overly-aggressive superabrasive particles from the plurality of working superabrasive particles; andablating at least a portion of the plurality of overly-aggressive superabrasive particles to increase the proportion of working superabrasive particles in the CMP pad dresser. 10. The method of claim 9, further comprising: positioning the CMP pad dresser on a subsequent indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser contact the subsequent indicator substrate; andmoving the CMP pad dresser across the subsequent indicator substrate in the first direction such that the portion of the plurality of superabrasive particles create a subsequent marking pattern on the substrate, wherein the subsequent marking pattern identifies a subsequent plurality of working superabrasive particles from among the plurality of superabrasive particles. 11. A system for identifying working superabrasive particles in a CMP pad dresser, comprising: an indicator substrate;a CMP pad dresser having a plurality of superabrasive particles, wherein a portion of the plurality of superabrasive particles are pressed against the indicator substrate under a fixed load; anda marking pattern cut into the indicator substrate by the portion of the plurality of superabrasive particles, wherein the marking pattern identifies a plurality of working superabrasive particles from among the plurality of superabrasive particles. 12. The system of claim 11, wherein the indicator substrate includes an indicator marker to mark the plurality of working superabrasive particles. 13. The system of claim 12, wherein the indicator marker includes a member selected from the group consisting of pigment markers, fluorescent markers, chemical markers, radioactive markers, and combinations thereof.
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