Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-001/11
H05K-001/14
H05K-001/18
H05K-003/36
H05K-003/46
H05K-003/22
출원번호
US-0383237
(2010-07-09)
등록번호
US-9491862
(2016-11-08)
우선권정보
AT-432/2009 (2009-07-10)
국제출원번호
PCT/AT2010/000254
(2010-07-09)
§371/§102 date
20120110
(20120110)
국제공개번호
WO2011/003123
(2011-01-13)
발명자
/ 주소
Pludra, Rainer
Drofenik, Dietmar
Stahr, Johannes
Götzinger, Siegfried
Mareljic, Liubomir
출원인 / 주소
AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
대리인 / 주소
Jacobson Holman, PLLC.
인용정보
피인용 횟수 :
0인용 특허 :
1
초록▼
In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one device or one conductive component, wherein printed circuit board regions to be connected to
In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one device or one conductive component, wherein printed circuit board regions to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions, at least one additional layer or ply of the printed circuit board is applied over the printed circuit board regions, the additional layer is embodied as a conductive layer, which is contact-connected via plated-through holes to conductive layers or devices or components integrated in the printed circuit board regions.
대표청구항▼
1. A method for producing a printed circuit board comprising the following steps in the following order: providing two printed circuit board regions each comprising horizontal surfaces and vertical surfaces, wherein the printed circuit board regions each comprise at least one conductive layer and/or
1. A method for producing a printed circuit board comprising the following steps in the following order: providing two printed circuit board regions each comprising horizontal surfaces and vertical surfaces, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one device or one conductive component;placing the printed circuit board regions on a common plane that is parallel to the horizontal surfaces of the printed circuit board regions and directly adjoining the printed circuit board regions by a coupling or connection;applying a common insulating or nonconductive layer on the printed circuit board regions connected to one another; andapplying at least one common further conductive layer on the common insulating or non conductive layer, wherein the at least one common further conductive layer is contact-connected via plated-through holes extending through the common insulating or non-conductive layer to conductive layers or devices or components integrated in the printed circuit board regions connected to one another;wherein at least one mutually complementary coupling element is each formed on mutually adjoining lateral surfaces of the printed circuit board regions to be connected to one another, via which coupling element coupling or connecting to the respectively adjoining printed circuit board region is effected. 2. The method according to claim 1, wherein, after having connected or coupled printed circuit board regions to be connected to one another and after having arranged or applied at least one additional conducting or conductive layer or ply, the structuring or patterning of conducting or conductive layers of the printed circuit boards and/or the mounting of additional electronic components or devices on the printed circuit board is/are effected. 3. The method according to claim 1, wherein an electrical connection of electrically conducting or conductive regions or elements of the printed circuit board regions to be connected to one another and/or layers of additional plies or additional elements is formed by soldering, gluing, welding, riveting or pinning, by vias or passages, conductively made bores, conductive pastes, conductive foils or wires, electronic devices or components or optical connections. 4. The method according to claim 1, wherein coupling or connecting of the printed circuit board regions to be connected to one another is effected by gluing, press-fitting, laminating, bonding, welding, soldering, a galvanic connection and/or by arranging or fixing components of the printed circuit board. 5. The method according to claim 1, wherein mutually complementary coupling elements are positively connected to each other. 6. The method according to claim 1, wherein mutually adjoining lateral surfaces of printed circuit board regions to be connected to one another are formed with mutually complementary profilings, particularly in the form of stepped and/or through-going recesses or depressions. 7. The method according to claim 1, wherein recesses or depressions for receiving printed circuit board regions extend over several layers or plies of multilayer printed circuit board regions. 8. The method according to claim 1, wherein the printed circuit board regions to be connected to one another are formed by flexible, rigid, rigid-flexible or semi flexible printed circuit board regions and/or high-frequency, HDI, substrate or ceramic printed circuit board regions. 9. The method according to claim 1, wherein a flexible printed circuit board region with at least one adjoining transition region is cut out of a carrier element comprising a plurality of the flexible printed circuit board regions and is inserted in a respective recess of a carrier element likewise comprising a plurality of rigid printed circuit board regions for the coupling or connection with at least one rigid printed circuit board region to be connected thereto of the plurality of the rigid printed circuit board regions.
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이 특허에 인용된 특허 (1)
Davidson Lewis A. (Reston VA) Duffy Michael C. (Vienna VA) Erickson Alvard J. (Reston VA) Gunther-Mohr Gerard R. (Chappaqua NY) Williams Richard A. (Candor NY), Functional package for complex electronic systems with polymer-metal laminates and thermal transposer.
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