A temperature control equipment is capable of controlling a tested object to a predetermined temperature. The temperature control equipment includes a thermal conducting plate, a temperature regulating module, a carrier plate, and a thermoelectric cooling module. The temperature regulating module is
A temperature control equipment is capable of controlling a tested object to a predetermined temperature. The temperature control equipment includes a thermal conducting plate, a temperature regulating module, a carrier plate, and a thermoelectric cooling module. The temperature regulating module is thermally connected to the thermal conducting plate for regulating the thermal conducting plate to a reference temperature. The carrier plate is used to accommodate the tested object. The thermoelectric cooling module is thermally connected between the thermal conducting plate and the carrier plate for controlling the tested object to the predetermined temperature via the carrier plate based on the reference temperature.
대표청구항▼
1. A temperature control equipment for controlling a tested object to a predetermined temperature, the temperature control equipment comprising: a thermal conducting plate;a temperature regulating module thermally connected to the thermal conducting plate for regulating the thermal conducting plate
1. A temperature control equipment for controlling a tested object to a predetermined temperature, the temperature control equipment comprising: a thermal conducting plate;a temperature regulating module thermally connected to the thermal conducting plate for regulating the thermal conducting plate to a reference temperature;a carrier plate for accommodating the tested object;a thermoelectric cooling module thermally connected between the thermal conducting plate and the carrier plate for controlling the tested object to the predetermined temperature via the carver plate, wherein the tested object is controlled to the predetermined temperature based on the reference temperature;a temperature sensor thermally connected to the carrier plate for sensing an actual temperature of the tested object; anda temperature controller electrical connected between the thermoelectric cooling module and the temperature sensor for controlling the thermoelectric cooling module to heat or to cool the tested object via the carrier plate, so as to control the actual temperature to the predetermined temperature: wherein the temperature regulating module comprises: a cooling assembly thermally connected to the thermal conducting plate for cooling the thermal conducting plate; anda cooling controller electrically connected to the cooling assembly for driving the cooling assembly to cool the thermal conducting plate to the reference temperature. 2. The temperature control equipment of claim 1, wherein the temperature regulating module comprises: a heating unit thermally connected to the thermal conducting plate for heating the thermal conducting plate; anda heating controller electrically connected to the heating unit for driving the heating unit to heat the thermal conducting plate to the reference temperature. 3. The temperature control equipment of claim 2, wherein: the temperature controller is electrically connected to the heating controller;the thermoelectric cooling module has a temperature controlling range;when a temperature difference between the predetermined temperature and an ambient temperature is larger than the temperature controlling range, the temperature controller controls the heating controller to drive the heating unit, so that the thermoelectric cooling module controls the tested object to the predetermined temperature via the carrier plate, wherein the tested object is controlled to the predetermined temperature based on the reference temperature; andwhen the temperature difference between the predetermined temperature and the ambient temperature is smaller than the temperature controlling range, the temperature controller directly controls the thermoelectric cooling module to the predetermined temperature. 4. The temperature control equipment of claim 1, wherein: the temperature controller is electrically connected to the cooling controller;the thermoelectric cooling module has a temperature controlling range;when a temperature difference between the predetermined temperature and an ambient temperature is larger than the temperature controlling range, the temperature controller controls the cooling controller to drive the cooling assembly, so that the thermoelectric cooling module controls the tested object to the predetermined temperature via the carrier plate, wherein the tested object is controlled to the predetermined temperature based on the reference temperature; andwhen the temperature difference between the predetermined temperature and the ambient temperature is smaller than the temperature controlling range, the temperature controller directly controls the thermoelectric cooling module to the predetermined temperature. 5. The temperature control equipment of claim 1, wherein the cooling assembly comprises: an evaporator thermally connected to the thermal conducting plate for absorbing the heat of the thermal conducting plate by a refrigerant so as to cool the thermal conducting plate to the reference temperature;a compressor thermally connected to the evaporator and electrically connected to the cooling controller, wherein the cooling controller drives the compressor to compress the refrigerant; anda condenser thermally connected between the evaporator and the compressor for dissipating the heat of the refrigerant. 6. The temperature control equipment of claim 1, wherein the temperature regulating module comprises: a plate heat exchanger thermally connected to the thermal conducting plate for absorbing the heat of the thermal conducting plate by a low-temperature air, so as to cool the thermal conducting plate to the reference temperature; andan air pump connected to the plate heat exchanger and the cooling assembly for transporting the low-temperature air. 7. A temperature control equipment for controlling a tested object to a predetermined temperature, the temperature control equipment comprising: a thermal conducting plate;a heating unit thermally connected to the thermal conducting plate for heating the thermal conducting plate;a heating controller electrically connected to the heating unit for driving the heating unit to heat the thermal conducting plate to a first reference temperature;a cooling assembly thermally connected to the thermal conducting plate for cooling the thermal conducting plate;a cooling controller electrically connected to the cooling assembly for driving the cooling assembly to cool the thermal conducting plate to a second reference temperature;a carrier plate for accommodating the tested object; anda thermoelectric cooling module thermally connected between the thermal conducting plate and the carrier plate for controlling the tested object to the predetermined temperature via the carrier plate, wherein the tested object is controlled to the predetermined temperature based on the first reference temperature or the second reference temperature. 8. The temperature control equipment of claim 7, further comprising: a temperature sensor thermally connected to the carrier plate for sensing an actual temperature of the tested object; anda temperature controller electrically connected between the thermoelectric cooling module and the temperature sensor for controlling the thermoelectric cooling module to heat or to cool the tested object via the carrier plate, so as to control the actual temperature to the predetermined temperature. 9. The temperature control equipment of claim 8, wherein: the temperature controller is electrically connected to the heating controller and the cooling controller;when the predetermined temperature is larger than an ambient temperature, the temperature controller controls the heating controller to drive the heating unit, so that the thermoelectric cooling module controls the tested object to the predetermined temperature via the carrier plate, wherein the tested object is controlled to the predetermined temperature based on the first reference temperature; andwhen the predetermined temperature is smaller than the ambient temperature, the temperature controller controls the cooling controller to drive the cooling assembly, so that the thermoelectric cooling module controls the tested object to the predetermined temperature via the carrier plate, wherein the tested object is controlled to the predetermined temperature based on the second reference temperature.
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이 특허에 인용된 특허 (11)
Cheng, Huang-Sheng; Tsai, Cheng-Jung, Compliant chuck for semiconducting device testing and chiller thereof.
Porter Warren W. (Escondido CA) Lauffer Donald K. (San Diego CA), Method and apparatus for low temperature integrated circuit chip testing and operation.
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