Photovoltaic devices with electroplated metal grids
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-031/0224
H01L-031/068
H01L-031/18
H01L-031/0747
H01L-031/02
출원번호
US-0132967
(2016-04-19)
등록번호
US-9502590
(2016-11-22)
발명자
/ 주소
Fu, Jianming
Heng, Jiunn Benjamin
Beitel, Christopher J.
Xu, Zheng
출원인 / 주소
SolarCity Corporation
대리인 / 주소
Yao, Shun
인용정보
피인용 횟수 :
0인용 특허 :
107
초록▼
One embodiment of the present invention provides a solar cell. The solar cell includes a photovoltaic structure and a front-side metal grid situated above the photovoltaic structure. The front-side metal grid also includes one or more electroplated metal layers. The front-side metal grid includes on
One embodiment of the present invention provides a solar cell. The solar cell includes a photovoltaic structure and a front-side metal grid situated above the photovoltaic structure. The front-side metal grid also includes one or more electroplated metal layers. The front-side metal grid includes one or more finger lines, and each end of a respective finger line is coupled to a corresponding end of an adjacent finger line via an additional metal line, thus ensuring that the respective finger line has no open end.
대표청구항▼
1. A metallic grid positioned on a photovoltaic structure, the metallic grid comprising: a first finger line positioned on a first surface of the photovoltaic structure;a second finger line positioned on the first surface of the photovoltaic structure, wherein the second finger line is substantially
1. A metallic grid positioned on a photovoltaic structure, the metallic grid comprising: a first finger line positioned on a first surface of the photovoltaic structure;a second finger line positioned on the first surface of the photovoltaic structure, wherein the second finger line is substantially parallel to the first finger line; anda metallic line connecting an end of the first finger line to an adjacent end of the second finger line;wherein a portion of the first finger line in a vicinity of an intersection between the first finger line and the metallic line is wider than a center portion of the first finger line. 2. The metallic grid of claim 1, wherein the metallic line is wider than at least a portion of the first or second finger line. 3. The metallic grid of claim 1, wherein the intersection between the metallic line and the first finger line is rounded or chamfered. 4. The metallic grid of claim 1, wherein the first finger line comprises a metallic adhesive layer in direct contact with the photovoltaic structure, and wherein the metal adhesive layer comprises at least one of: Cu, Al, Co, W, Cr, Mo, Ni, Ti, Ta, titanium nitride, titanium tungsten, titanium silicide, titanium silicon nitride, tantalum nitride, tantalum silicon nitride, nickel vanadium, tungsten nitride, or their combinations. 5. The metallic grid of claim 4, wherein the metallic adhesive layer is formed using a physical vapor deposition technique directly onto a transparent conductive oxide layer of the photovoltaic structure. 6. The metallic grid of claim 4, wherein the first finger line further comprises an electroplated metallic layer and a metallic seed layer, wherein the metallic seed layer is positioned between the electroplated metallic layer and the metallic adhesive layer. 7. The metallic grid of claim 1, wherein the first finger line comprises at least one of: a Cu layer;an Ag layer; ora Sn layer. 8. The metallic grid of claim 1, wherein the portion of the first finger line in the vicinity of the intersection is at least 20% wider than the center portion of the first finger line. 9. The metallic grid of claim 1, wherein a length of the widened portion of the first finger line is between 1 and 30 mm. 10. The metallic grid of claim 1, wherein a width of the intersection is 0.2 mm or less. 11. A metal grid on a surface of a photovoltaic structure, the grid comprising: a busbar positioned on the surface of the photovoltaic structure;a first finger line on the surface of the photovoltaic structure and substantially orthogonal to the busbar;a second finger line on the surface of the photovoltaic structure and substantially orthogonal to the busbar;a third finger line on the surface of the photovoltaic structure and substantially orthogonal to the busbar; anda connecting metal line, wherein the connecting metal line electrically connects the first, second and the third finger lines, and wherein a portion of the first finger line in a vicinity of an intersection between the first finger line and the connecting metal line is wider than a center portion of the first finger line. 12. The metal grid of claim 11, wherein the connecting metal line is wider than at least a portion of the first finger line. 13. The metal grid of claim 11, wherein the intersection between the connecting metal line and the first finger line is rounded or chamfered. 14. The metal grid of claim 11, wherein the first finger line comprises at least one of: a Cu layer;an Ag layer; ora Sn layer. 15. The metal grid of claim 11, wherein the first finger line comprises a metallic adhesive layer in direct contact with the photovoltaic structure, and wherein the metal adhesive layer comprises at least one of: Cu, Al, Co, W, Cr, Mo, Ni, Ti, Ta, titanium nitride, titanium tungsten, titanium silicide, titanium silicon nitride, tantalum nitride, tantalum silicon nitride, nickel vanadium, tungsten nitride, or their combinations. 16. The metal grid of claim 15, wherein the metallic adhesive layer is formed using a physical vapor deposition technique directly onto a transparent conductive oxide layer of the photovoltaic structure. 17. The metal grid of claim 15, wherein the first finger line further comprises an electroplated metallic layer and a metallic seed layer, wherein the metallic seed layer is positioned between the electroplated metallic layer and the metallic adhesive layer. 18. The metal grid of claim 11, wherein the portion of the first finger line in the vicinity of the intersection is at least 20% wider than the center portion of the first finger line. 19. The metal grid of claim 11, wherein a length of the widened portion of the first finger line is between 1 and 30 mm. 20. The metal grid of claim 11, wherein a width of the intersection is 0.2 mm or less.
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이 특허에 인용된 특허 (107)
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