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특허 상세정보

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High temperature electromagnetic coil assemblies

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01F-027/04    H01F-027/32    H01F-005/06    H01F-041/12    H01F-027/28    H01F-021/06   
출원번호 US-0035560 (2013-09-24)
등록번호 US-9508486 (2016-11-29)
발명자 / 주소
  • Piascik, James
  • Passman, Eric
  • Oboodi, Reza
  • Franconi, Robert
  • Fox, Richard
  • Seminara, Gary J.
  • Holden, Gene
  • Harding, Jacob
출원인 / 주소
  • HONEYWELL INTERNATIONAL INC.
대리인 / 주소
    Lorenz & Kopf, LLP
인용정보 피인용 횟수 : 0  인용 특허 : 73
초록
▼

Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the high temperature electromagnetic coil assembly includes a coiled anodized aluminum wire and an electrically-insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded. The electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion greater than 10 parts per million per deg...

대표
청구항
▼

1. A high temperature electromagnetic coil assembly, comprising: a coiled anodized aluminum wire; andan electrically-insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded;wherein the electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion greater than 10 parts per million per degree Celsius and less than the coefficient of thermal expansion of the coiled anodized aluminum wire. 2. The high temperature electromagnetic coil assembly of claim 1 wherein the electrica...

이 특허에 인용된 특허 (73)

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