Seat assembly with temperature or humidity sensor
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B60N-002/56
B60H-001/00
B60N-002/58
G01N-019/10
출원번호
US-0629853
(2015-02-24)
등록번호
US-9511646
(2016-12-06)
우선권정보
EP-14156631 (2014-02-25)
발명자
/ 주소
Müller, Christoph
Götze, Michael
Graf, Markus
출원인 / 주소
Sensirion AG
대리인 / 주소
Foley & Lardner LLP
인용정보
피인용 횟수 :
0인용 특허 :
4
초록▼
A sensor module for integration within a seat assembly is provided. The sensor module comprises a temperature and/or humidity sensor (21) and a separate sensor support (51) for mechanically supporting said temperature and/or humidity sensor. The sensor support is configured to be arranged on or in a
A sensor module for integration within a seat assembly is provided. The sensor module comprises a temperature and/or humidity sensor (21) and a separate sensor support (51) for mechanically supporting said temperature and/or humidity sensor. The sensor support is configured to be arranged on or in a support layer below an air-permeable cover of the seat assembly.
대표청구항▼
1. A sensor module for integration within a seat assembly comprising a seat bottom and a backrest, at least one of the seat bottom and the backrest comprising a support layer and an air-permeable cover having an outside surface, which forms an occupant contact area of the seat assembly, and an insid
1. A sensor module for integration within a seat assembly comprising a seat bottom and a backrest, at least one of the seat bottom and the backrest comprising a support layer and an air-permeable cover having an outside surface, which forms an occupant contact area of the seat assembly, and an inside surface, the sensor module comprising: a combined temperature and humidity sensor; anda separate sensor support for mechanically supporting the combined temperature and humidity sensor, the sensor support being configured to be arranged on or in the support layer below the air-permeable cover, wherein the combined temperature and humidity sensor comprises a semiconductor-based humidity sensor, the semiconductor-based humidity sensor comprising a semiconductor substrate and a polymer layer disposed on the semiconductor substrate, and wherein the polymer layer forms an active sensor surface. 2. The sensor module of claim 1, wherein the sensor support defines a window that is fully surrounded by material of the sensor support, and wherein the active sensor surface is accessible for media through the window. 3. The sensor module of claim 2, wherein the sensor module comprises an air-permeable protective membrane that covers the window. 4. The sensor module of claim 1, wherein the sensor support includes a base portion having an essentially planar bottom surface configured to rest flat on the support layer. 5. The sensor module of claim 4, wherein the base portion has a generally flat configuration. 6. The sensor module of claim 5, wherein the base portion has a top surface configured to face away from the support layer towards the air-permeable cover, the entire top surface of the base portion being devoid of any prominent protrusions. 7. The sensor module of claim 6, wherein the base portion has an outer rim, the top surface and the bottom surface meeting at the outer rim, andwherein the top surface is domed, a distance between the top surface and the bottom surface of the base portion continuously decreasing towards the outer rim until the top surface and the bottom surface meet at the outer rim. 8. The sensor module of claim 4, wherein the combined temperature and humidity sensor is mounted to the bottom surface of the base portion. 9. The sensor module of claim 4, further comprising a connecting element for establishing an electrical connection with the combined temperature and humidity sensor, the connecting element comprising a flat, flexible printed circuit board, wherein the combined temperature and humidity sensor and the connecting element are together mounted to the bottom surface of the base portion. 10. The sensor module of claim 9, wherein the base portion has an outer rim,wherein the sensor support includes one or more anchors configured to extend from the base portion into the support layer when the base portion rests flat on the support layer, the anchors extending along a longitudinal direction, andwherein the connecting element extends beyond the outer rim of the base portion in a direction that is perpendicular to the longitudinal direction. 11. The sensor module of claim 9, wherein the base portion has a notch, the notch receiving the combined temperature and humidity sensor and the connecting element. 12. The sensor module of claim 11, wherein the base portion has an outer rim, andwherein the notch is laterally open towards one side of the sensor support so as to allow the connecting element to extend beyond the outer rim of the base portion. 13. The sensor module of claim 9, wherein the base portion, the combined temperature and humidity sensor, and the connecting element together form a planar bottom surface. 14. The sensor module of claim 4, wherein the sensor module comprises an adhesive layer on the bottom surface of the base portion. 15. The sensor module of claim 14, wherein the adhesive layer is covered by a peelable protective layer. 16. The sensor module of claim 4, wherein the sensor support includes one or more anchors configured to extend from the base portion into the support layer when the base portion rests flat on the support layer. 17. The sensor module of claim 1, wherein the sensor module has a top surface configured to face away from the support layer towards the air-permeable cover, the entire top surface being devoid of any prominent protrusions. 18. The sensor module of claim 17, wherein the top surface is domed. 19. The sensor module of claim 1 wherein the sensor support comprises a main body and a sensor carrier, the sensor carrier carrying the combined temperature and humidity sensor and being connected to the main body via a slide-in connection and/or a latching connection. 20. The sensor module of claim 1, wherein the sensor module comprises at least one of: a connecting element for establishing an electrical connection with the combined temperature and humidity sensor; anda microcontroller. 21. The sensor module of claim 1, wherein the sensor module comprises a communication device for wireless communication with a remote control unit. 22. A seat assembly comprising a seat bottom and a backrest, at least one of the seat bottom and the backrest comprising: a support layer,an air-permeable cover having an outside surface, which forms an occupant contact area of the seat assembly, and an inside surface that is directed towards the support layer; anda sensor module comprising a combined temperature and a separate sensor support for mechanically supporting the combined temperature and humidity sensor, the sensor support being configured to be arranged on or in the support layer below the air-permeable cover,wherein the sensor module is disposed below the inside surface of the air-permeable cover, wherein the combined temperature and humidity sensor comprises a semiconductor-based humidity sensor, the semiconductor-based humidity sensor comprising a semiconductor substrate and a polymer layer disposed on the semiconductor substrate, and wherein the polymer layer forms an active sensor surface. 23. The seat assembly of claim 22, wherein the combined temperature and humidity sensor is disposed at a distance of less than 25 mm below the outside surface of the air-permeable cover. 24. The seat assembly of claim 22, wherein the sensor module is mounted in or on the support layer. 25. The seat assembly of claim 24, wherein the support layer is a heating mat. 26. The seat assembly of claim 24, wherein the support layer is resiliently compressible, and wherein the sensor module is mounted in or on a portion of the support layer that faces the air-permeable cover, the sensor module being mounted in such a manner that at least a portion of the sensor module that extends into the support layer is movable relative to the support layer when the support layer is resiliently compressed. 27. The seat assembly of claim 22, wherein the support layer defines at least one pre-formed cavity that is open towards the air-permeable cover, and wherein at least part of the sensor module is disposed in the at least one pre-formed cavity. 28. The seat assembly of claim 22, wherein the sensor module is enclosed in an air-permeable bag. 29. The seat assembly of claim 22, further comprising at least one of a heating device, a cooling device and a ventilation device, and comprising a controller being configured to receive sensor signals from the sensor module and to control the heating device, cooling device and/or ventilation device based on the sensor signals. 30. The seat assembly of claim 22, wherein the sensor module comprises a separate sensor support for mechanically supporting the combined temperature and humidity sensor, the sensor support being arranged on or in the support layer below the air-permeable cover. 31. The seat assembly of claim 30, wherein the support layer is a heating mat. 32. The seat assembly of claim 30, wherein the sensor support includes a base portion having an essentially planar bottom surface, the bottom surface resting flat on the support layer, andwherein the sensor support includes one or more anchors, the anchors extending from the base portion into the support layer. 33. The seat assembly of claim 32, wherein the anchors protrude from the bottom surface of the base portion along a longitudinal direction. 34. The seat assembly of claim 33, wherein the anchors are free to move within the support layer along the longitudinal direction when the support layer is resiliently compressed. 35. A sensor module for integration within a seat assembly comprising a seat bottom and a backrest, at least one of the seat bottom and the backrest comprising a support layer and an air-permeable cover having an outside surface, which forms an occupant contact area of the seat assembly, and an inside surface, the sensor module comprising: a combined temperature and humidity sensor; anda separate sensor support for mechanically supporting the combined temperature and humidity sensor, the sensor support being configured to be arranged on or in the support layer below the air-permeable cover,wherein the sensor support defines a window that is fully surrounded by material of the sensor support, and wherein the combined temperature and humidity sensor has an active sensor surface that is accessible for media through the window,wherein the combined temperature and humidity sensor comprises a packaging, the packaging providing a first contribution to mechanical protection of the combined temperature and humidity sensor, the packaging defining a window-like opening,wherein the sensor support provides a second contribution to mechanical protection of the combined temperature and humidity sensor,wherein the active sensor surface is disposed below the window-like opening, andwherein a diffusion path exists between the window of the sensor support and the window-like opening of the packaging. 36. The sensor module of claim 35, wherein the window of the sensor support and the window opening of the packaging are arranged on top of one another. 37. The sensor module of claim 1, wherein the active sensor surface faces the inside surface of the air-permeable cover.
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이 특허에 인용된 특허 (4)
Rittmueller,Phillip; Shieh,Shiuh An; Kirksey,J. Frederick, Flexible occupant sensor and method of use.
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