Vortex generating finned liquid-cooling heat exchanger module with transverse plate or pathways
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F28D-007/00
F28D-015/00
F28F-003/02
F28F-003/12
H01L-023/473
출원번호
US-0731022
(2012-12-30)
등록번호
US-9518783
(2016-12-13)
우선권정보
TW-100217648 U (2011-09-21)
발명자
/ 주소
Hwang, Jer-Sheng
Chang, Teng-Kai
출원인 / 주소
ENERMAX TECHNOLOGY CORPORATION
대리인 / 주소
Shih, Chun-Ming
인용정보
피인용 횟수 :
0인용 특허 :
13
초록▼
A liquid cooling heat exchanger module filled with a cooling liquid includes a casing (10) and a cooling structure (11), and the interior of the casing (10) is hollow, and the cooling structure (11) is installed in the casing (10), and the cooling structure (11) is formed by a plurality of fins (14)
A liquid cooling heat exchanger module filled with a cooling liquid includes a casing (10) and a cooling structure (11), and the interior of the casing (10) is hollow, and the cooling structure (11) is installed in the casing (10), and the cooling structure (11) is formed by a plurality of fins (14) erected vertically and arranged equidistantly apart from one another to form a plurality of flow channels (15), and the cooling structure (11) includes one or more of transversally cut grooves (111) between the fins (15), so as to achieve the effects of extending the time for the cooling liquid to stay in the heat exchanger module (1), maximizing the cooling effect of the cooling liquid, and improving the heat dissipating efficiency.
대표청구항▼
1. A liquid cooling heat exchanger module, filled with a cooling liquid, comprising: a casing (10) with a hollow interior, comprising an upper casing (12) and a base (13);a cooling structure, comprising at least two sets of fin structures formed on the base (13) of the casing (10), each of the at le
1. A liquid cooling heat exchanger module, filled with a cooling liquid, comprising: a casing (10) with a hollow interior, comprising an upper casing (12) and a base (13);a cooling structure, comprising at least two sets of fin structures formed on the base (13) of the casing (10), each of the at least two sets of fin structures including a plurality of fins (14) erected vertically on the base (13) and arranged equidistantly from one another to form a plurality of flow channels (15);at least one groove (111) formed between the at least two sets of the fin structures; andat least one partition plate (16) disposed in the at least one groove (111) and both sides of the at least one partition plate (16) directly contacting each of the plurality of fins (14) of each of the at least two sets of fin structures, wherein the at least one partition (16) is directly disposed on the base so that the plurality of flow channels (15) of the at least two sets of fin structures are divided by the at least one partition (16) to avoid the cooling liquid flowing between corresponding flow channels (15),wherein the plurality of fins (14) and the plurality of flow channels (15) of one of the at least two sets of fin structures are corresponsive to the plurality of fins (14) and the plurality of flow channels (15) of the other one of the at least two sets of fin structure to form as a plurality of straight lines wherein the casing (10) has an inlet (100) and an outlet (101) internally interconnected with each other, and a vortex generating area (110) concavely formed on the cooling structure and at a position corresponding to the inlet (100), such that the cooling liquid is filled into the casing through the inlet (100) and driven to form a vortex in the vortex generating area (110), and then the cooling liquid flows into each flow channel, the vortex generating area (110) is in a concave circular arc shape which forms a bowl on the top of the fins. 2. The liquid cooling heat exchanger module of claim 1, wherein the inlet (100) of the casing (10) is disposed at a position-corresponding to a side in the vortex generating area (110). 3. The liquid cooling heat exchanger module of claim 1, wherein the upper casing (12) comprises an external cover unit (120), and an internal partition unit (121) installed in the external cover unit (120), and an outlet (101) is formed on the external cover unit (120), and an inlet (100) is formed on the internal partition unit (121), and the cooling structure (11) is installed in the internal partition unit (121). 4. The liquid cooling heat exchanger module of claim 3, wherein the external cover unit (120) has a through hole (122) formed at a position corresponding to the inlet (100), and the inlet (100) is protruded in a form of a connecting pipe, and the through hole (122) is provided for interconnecting the inlet (100). 5. The liquid cooling heat exchanger module of claim 3, further comprising a buffer area (123) disposed on a lateral side of the internal partition unit (121) and between the external cover unit (120) and the internal partition unit (121), and a guiding area (124) disposed at the top of the internal partition unit (121). 6. The liquid cooling heat exchanger module of claim 1, wherein the vortex generating area (110) is formed at the upper edge of the fins. 7. The liquid cooling heat exchanger module of claim 1, wherein the at least one partition (16) has a concave arc edge (160) formed at the upper edge and corresponding to a concave shape of the vortex generating area (110). 8. The liquid cooling heat exchanger module of claim 1, wherein a height of the at least one partition plate 9 (6) is the same as that of edges of the at least two sets of fin structures contacting the at least one partition plate (16).
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이 특허에 인용된 특허 (13)
Hanzlik Steven E. ; Hansen Michael A. ; Wagner Guy R., Cooling apparatus for electronic devices.
Usui,Shoichiro; Goto,Tadahiro, Fin structure, heat-transfer tube having the fin structure housed therein, and heat exchanger having the heat-transfer tube assembled therein.
Cannell, Michael J.; Cooley, Roger; Garman, Richard W.; Green, Geoffrey; Harrison, Peter N.; Walters, Joseph D., Fluid-cooled heat sink with turbulence-enhancing support pins.
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