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Connection structure of electronic component and terminal metal fittings 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01H-050/14
  • H01R-009/24
  • H01H-050/04
출원번호 US-0003186 (2016-01-21)
등록번호 US-9520255 (2016-12-13)
우선권정보 JP-2013-179117 (2013-08-30)
발명자 / 주소
  • Kawamura, Yukihiro
출원인 / 주소
  • YAZAKI CORPORATION
대리인 / 주소
    Sughrue Mion, PLLC
인용정보 피인용 횟수 : 0  인용 특허 : 49

초록

A connection structure of an electronic component and terminal metal fittings includes a relay including a relay body and a plurality of terminals, terminal metal fittings mating with the terminals, and a holding member. The terminals have end portions facing side surfaces of the relay body, and the

대표청구항

1. A connection structure of an electronic component and terminal metal fittings, comprising: an electronic component including a component body having a rectangular parallelepiped outer shape, and a plurality of terminals that have end portions facing side surfaces of the component body, the end po

이 특허에 인용된 특허 (49)

  1. Walker Kevin E. (Harrisburg PA), Adapter for use with a bumperless chip carrier.
  2. Takano, Satoshi, Assembly of electromagnetic relay and circuit board.
  3. Jordan,Peter, Carrier device for electronic chip.
  4. Grabbe Dimitry G. (Middletown PA) Korsunsky Iosif (Harrisburg PA), Chip carrier socket having improved contact terminals.
  5. Grabbe Dimitry G. (Middletown PA) Korsunsky Iosif (Harrisburg PA), Chip carrier socket having improved contact terminals.
  6. Korsunsky Iosif (Harrisburg PA) Grabbe Dimitry (Middletown PA), Chip carrier socket which requires low insertion force for the chip carrier.
  7. Kozel Charles A. (McHenry IL) Scheitz John T. (Barrington IL) Stefaniu Michael V. (Arlington Hts. IL), Chip carrier socket with open aperture.
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  10. Coller James R. (Kernersville NC) Coon Paul A. (Kernersville NC) Goodman Joseph R. (Kernersville NC), Dual in-line package carrier assembly.
  11. Sadigh-Behzadi Amir-Akbar (Van Nuys CA), Dual-in-line package assembly.
  12. Grabbe ; Dimitry G. ; Sweeney ; Joseph Patrick, Electrical connections for chip carriers.
  13. Morin Scott Frederick ; Derstine Michael Paul, Electrical connector for leaded electronic component.
  14. Grabbe Dimitry G. (Middletown) Korsunsky Iosif (Harrisburg) Ringler Daniel R. (Elizabethville PA), Electrical socket for leaded chip carriers.
  15. Kawamura, Yukihiro; Yamada, Hiroaki, Electronic component.
  16. Kawamura, Yukihiro, Electronic component assembly structure and electrical junction box.
  17. Kawamura, Yukihiro, Electronic component assembly structure and electrical junction box.
  18. Kawamura, Yukihiro; Yamada, Hiroaki, Electronic component assembly structure and electrical junction box.
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  20. Korsunsky Iosif (3971 Dora Dr. Harrisburg PA 17110) Kopp Monte L. (Clark Valley Farms ; R.D. #1 Box 98 Tower City PA 17980) Grabbe Dimitry G. (2160 Rosedale Ave. Middletown PA 17057), High density chip carrier socket.
  21. Matsuoka Noriyuki (Tokyo JPX) Sasaki Tomio (Tokyo JPX), IC connector.
  22. Ikesugi Hiroshi (Yokohama JPX) Simmel George M. (The Waterside SGX), IC package connector.
  23. Ishizuka Shinichi (Tachikawa JPX) Suzuki Takao (Oume JPX) Umesato Shoji (Tokyo JPX) Okada Yoshikatsu (Tokyo JPX), IC socket.
  24. Currier, David W., Integrated circuit carrier and assembly.
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  29. Lee James C. K. (Los Altos Hills CA) Donaher Charles Joseph (Los Altos Hills CA), Interconnected leadless package receptacle.
  30. Scheingold William Samuel (Palmyra PA) Youngfleish Frank Christian (Harrisburg PA), Interconnection for electrically connecting two vertically stacked electronic packages.
  31. Grabbe Dimitry G. (Middletown PA), Low height chip carrier socket.
  32. Korsunsky Iosif (Harrisburg PA), Low insertion force chip carrier connector with movable housing.
  33. Korsunsky Iosif (Harrisburg PA) Kopp Monte L. (Tower City PA) Grabbe Dimitry G. (Middletown PA), Low profile chip carrier socket.
  34. Butt Sheldon H. (Godfrey IL) Mahulikar Deepak (Meriden CT), Metal packages having improved thermal dissipation.
  35. McIntyre James B. (Cupertino CA), Method and apparatus for replacing electronic components on a printed circuit board.
  36. Laub Michael F. (Etters PA), Modular chip carrier socket.
  37. Gianni ; Richard, Multi-level socket for an integrated circuit.
  38. Gianni Richard (216 Livorna Heights Alamo CA 94507), Multi-level socket for an integrated circuit.
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  40. Sato, Koki, Relay, relay module having the same, and electrical junction box.
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  43. Belopolsky Yakov ; Raistrick Alan ; Wang Din-Kuen,TWX, Socket for connecting an integrataed circuit to a printed wiring board.
  44. Mulholland Wayne A. (Plano TX) Martin Robert J. (Dallas TX) Wilson David S. (Fort Collins CO) Esparza ; Jr. Carlos (Lewisville TX), Socket for housing a plurality of integrated circuits.
  45. Coller James R. (Kernersville NC) Goodman Joseph R. (Walkertown NC), Socket for stacking integrated circuit packages.
  46. Smith ; Jr. John W. (Dallas TX) Scherpenberg Francis A. (Carrollton TX) Jiang Ching-Lin (Dallas TX) Bolan Michael L. (Dallas TX), Space-saving back-up power supply.
  47. Mason Scott C. (Fort Collins CO) Slutz Robert A. (Loveland CO), Surface mount method and device.
  48. Tonooka Takashi (Shizuoka JPX), Test socket incorporating circuit elements.
  49. Crawford Christopher L. (Harrisburg PA), Zero insertion force electrical connector.
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