Device and method for filling a container with a gas under pressure
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F17C-005/00
F17C-005/06
F17C-007/00
F17C-013/02
출원번호
US-0212476
(2014-03-14)
등록번호
US-9528657
(2016-12-27)
우선권정보
FR-08 51560 (2008-03-11)
발명자
/ 주소
Allidieres, Laurent
Charbonneau, Thomas
Vinard, Thomas
Sequeira, Sebastian-Eloy
출원인 / 주소
L'Air Liquide Societe Anonyme Pour L'Etude Et L'Exploitation Des Procedes Georges Claude
대리인 / 주소
Cronin, Christopher J.
인용정보
피인용 횟수 :
0인용 특허 :
1
초록▼
Device for filling a container with a gas under pressure, especially hydrogen in a tank of a vehicle, comprising at least one source (1, 2, 3, 6) of gas pressurized to a first pressure, called high pressure, a transfer circuit (201, 36, 13, 14, 136, 146) capable of selectively connecting the source
Device for filling a container with a gas under pressure, especially hydrogen in a tank of a vehicle, comprising at least one source (1, 2, 3, 6) of gas pressurized to a first pressure, called high pressure, a transfer circuit (201, 36, 13, 14, 136, 146) capable of selectively connecting the source or sources (1, 2, 3, 6) of pressurized gas to the tank to be filled, the transfer circuit comprising control members (204, 132, 142) for controlling the flow of the gas from the source or sources (1, 2, 3, 6) to the tank, the transfer circuit further including at least one cooling exchanger (9), for cooling the pressurized gas, wherein the cooling exchanger (9) comprises a hot flow circuit (99) for the pressurized gas to be cooled, a cold flow circuit (98) for a cold cooling fluid, and a refrigeration hold-over medium (5), the refrigeration hold-over medium (5) being in direct heat exchange, on the one hand, with the cold fluid of the cold circuit (98) and, on the other hand, with the pressurized gas to be cooled of the hot circuit (99), in order to selectively carry out indirect heat exchange between the pressurized gas and the cold fluid (4) via the refrigeration hold-over medium (5), and wherein the refrigeration hold-over medium (5) forms and fills a gap (1) between the cold fluid of the cold circuit (98) and the pressurized gas of the hot circuit (99), the gap (1) having a thickness of greater than 5 mm and preferably between 20 and 50 mm.
대표청구항▼
1. A device for filling a vehicle tank with pressurized hydrogen, comprising at least one source of pressurized hydrogen gas and a transfer circuit capable of selectively fluidly connecting said at least one source and the tank to be filled, said transfer circuit comprising a heat exchanger, the hea
1. A device for filling a vehicle tank with pressurized hydrogen, comprising at least one source of pressurized hydrogen gas and a transfer circuit capable of selectively fluidly connecting said at least one source and the tank to be filled, said transfer circuit comprising a heat exchanger, the heat exchanger comprising a refrigeration hold-over medium that forms and fills a gap between a hot circuit traversing the refrigeration hold-over medium and a cold circuit traversing the refrigeration hold-over medium, wherein: the hot circuit receives a flow of the pressurized hydrogen gas from said at least one source and directs the flow of the pressurized hydrogen gas to the vehicle tank to be filled;the cold circuit allows a flow of cooling fluid therethrough;the refrigeration hold-over medium essentially consists of a mass of aluminum metal formed by high-temperature casting in liquid form around the hot and cold circuits, or a mass of aluminum metal through which the hot circuit is bored;the gap between the hot circuit and the cold circuit is greater than 5 mm. 2. The device of claim 1, wherein the cold flow circuit is selectively connected to a tank of cryogenic fluid. 3. The device of claim 2, wherein the cryogenic fluid is liquid nitrogen or CO2. 4. The device of claim 1, wherein the transfer circuit further comprises a valve and a selective by-pass circuit portion that bypasses at least one part of the heat exchanger for controlling the temperature of the hydrogen. 5. The device of claim 1, wherein the thermal contact resistance between the hot circuit and the refrigeration hold-over medium is less than 0.002 Km2/W.
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이 특허에 인용된 특허 (1)
Seiler Thomas F.,CAX ; Bettio Dario,CAX ; Peric Yuri,CAX, By-pass values for heat exchanger.
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