An electrical connection arrangement is provided between at least one flat conductor or conductor portion and a cable, the flat conductor or conductor portion leading to a pane, and electric or electronic components situated there, and the cable being an integral part of an external connection. The
An electrical connection arrangement is provided between at least one flat conductor or conductor portion and a cable, the flat conductor or conductor portion leading to a pane, and electric or electronic components situated there, and the cable being an integral part of an external connection. The flat conductor or conductor portion is formed on a carrier film, and has an encapsulation as a plastic injection overmolding in the area of the electric contacting point of cable and flat conductor or conductor portion. An adhesion-promoting, heat-activated adhesive film is applied in the area of the carrier film while leaving the space for the electrical contacting point, yet surrounding or two-dimensionally delimiting same.
대표청구항▼
1. An electrical connection arrangement between a flat conductor or conductor portion and a cable, the flat conductor or conductor portion leading to a pane, or laminated pane, and electric or electronic components situated there, and the cable being an integral part of an external connection, where
1. An electrical connection arrangement between a flat conductor or conductor portion and a cable, the flat conductor or conductor portion leading to a pane, or laminated pane, and electric or electronic components situated there, and the cable being an integral part of an external connection, wherein the flat conductor or conductor portion is further formed on a carrier film, or polyimide film, and includes an encapsulation as a plastic injection overmolding at least in an area of an electric contacting point of the cable and flat conductor or conductor portion, the electrical connection arrangement comprising: an adhesion-promoting, heat-activated adhesive film applied in an area of the carrier film while leaving space for the contacting point, yet surrounding or two-dimensionally delimiting same; andthe plastic injection overmolding formed on the flat conductor or conductor portion after forming an electrical connection at the contacting point,wherein pressure and temperature input simultaneously activates the adhesive film to realize a highly dense and durable bonding with the plastic injection overmolding. 2. The electrical connection arrangement according to claim 1, wherein the adhesive film is formed as an adhesive foil. 3. The electrical connection arrangement according to claim 2, wherein the adhesive foil exhibits self-adhesive properties. 4. The electrical connection arrangement according to claim 2, wherein the adhesive foil is made of a nonwoven material impregnated and/or coated with an adhesive agent. 5. The electrical connection arrangement according to claim 2, wherein a heat activating and curing temperature of the adhesive film is adapted to a processing temperature of the plastic injection overmolding compound. 6. The electrical connection arrangement according to claim 1, wherein pressure ratios set for forming the overmolding correspond at least to a contact pressure required for the adhesive film. 7. The electrical connection arrangement according to claim 1, wherein due to use of the adhesive film, a secure cross-linking between the carrier film and the overmolding is generated without requiring a pre-casting layer or permanently elastic insulating or sealing compound.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (4)
Clements James R. (5840 Darbwood La. West Bloomfield MI 48033) Yu Terry T. J. (19832 White Oaks Dr. Mt. Clemens MI 48043) Yu Laura H. C. (19832 White Oaks Dr. Mt. Clemens MI 48043), Electronic device including uniaxial conductive adhesive and method of making same.
Clements James R. (5840 Darbwood La. West Bloomfield MI 48033) Yu Terry T. J. (19832 White Oaks Dr. Mt. Clemens MI 48043) Yu Laura H. C. (19832 White Oaks Dr. Mt. Clemens MI 48043), Method of making an electronic device using an uniaxial conductive adhesive.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.