Childproof blister package with controlled opening
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B65D-075/36
B65B-051/24
B65D-075/52
B65D-065/42
B65D-075/32
출원번호
US-0762986
(2014-01-23)
등록번호
US-9533812
(2017-01-03)
우선권정보
DK-2013 00045 (2013-01-24)
국제출원번호
PCT/DK2014/000006
(2014-01-23)
국제공개번호
WO2014/114297
(2014-07-31)
발명자
/ 주소
Broedsgaard, Ole
Johansen, Peter
Dydensborg, Else
Westad, Sanne Norup
Christensen, Lars Christian
출원인 / 주소
DANAPAK FLEXIBLES A/S
대리인 / 주소
Holland & Hart, LLP
인용정보
피인용 횟수 :
0인용 특허 :
7
초록▼
The present invention relates to a blister package consisting of a lower web in which a row of cavities is provided, and an upper web which is welded to the provided lower web, and wherein perforation lines are provided between adjoining cavities, and wherein there is an area in connection with each
The present invention relates to a blister package consisting of a lower web in which a row of cavities is provided, and an upper web which is welded to the provided lower web, and wherein perforation lines are provided between adjoining cavities, and wherein there is an area in connection with each cavity where the upper web is not welded to the lower web, such that a snip is created, said upper web being welded to the lower web by a first inner weld which surrounds the cavity completely, as well as a second outer weld which surrounds the cavity around the first weld and adjoins the area where the upper web is not welded to the lower web. The invention also relates to a method of making the blister package.
대표청구항▼
1. A blister package, comprising: a lower web in which a row of cavities is provided; and;an upper web which is welded to the provided lower web;wherein perforation lines are provided between adjoining cavities; andwherein there is an area in connection with each cavity where the upper web is not we
1. A blister package, comprising: a lower web in which a row of cavities is provided; and;an upper web which is welded to the provided lower web;wherein perforation lines are provided between adjoining cavities; andwherein there is an area in connection with each cavity where the upper web is not welded to the lower web, said area forming a snip; and;wherein the upper web is welded to the lower web by a first, inner weld which surrounds one of the cavities completely, and a second, outer weld which surrounds said one cavity partly around the first, inner weld and terminates at the area where the upper web is not welded to the lower web. 2. The blister package according to claim 1, wherein the blister package comprises two rows of cavities. 3. The blister package according to claim 2, wherein the areas which are not welded to the lower web are disposed between four of the cavities. 4. The blister package according to claim 3, wherein the areas which are not welded to the lower web are separated by the perforation lines. 5. The blister package according to claim 1, wherein an at least partial weld is provided along an edge of the area which is not welded to the lower web, said edge facing toward the cavity. 6. The blister package according to claim 1, wherein materials for the upper web are selected from polyvinyl chloride (PVC), polyethylene terephthalate (PET), amorphous polyethylene terephthalate (APET), polypropylene (PP), polyethylene (PE) coated aluminium or PE coated APET. 7. The blister package according to claim 1 wherein the width of the first, inner weld is variable. 8. The A blister package according to claim 1, wherein the width of the second, outer weld is variable. 9. The blister package according to claim 1, wherein the first, inner weld has a width between 0.05 mm and 5 mm. 10. The blister package according to claim 1, wherein the second, outer weld has a width between 0.05 mm and 5 mm. 11. A method of making a blister package, said method comprising: providing a lower web configured with cavities;providing an upper web;bringing the upper web into contact with the lower web;attaching the upper web to the lower web by a first weld which, in the form of a rim, surrounds one of the cavities completely;performing an additional, secondary weld which, in the form of a rim, surrounds said one cavity partly around the first weld, said secondary weld being terminated at an area where the upper web is not welded to the lower web, said area creating a snip. 12. The method according to claim 11, further comprising providing perforations between the cavities. 13. The method according to claim 11, wherein the first weld is welded with a rim width between 0.05 mm and 5 mm. 14. The method according to claim 11, wherein the secondary weld is welded with a rim width between 0.05 mm and 5 mm. 15. The blister package according to claim 1, wherein the first, inner weld has a width between 0.1 mm and 3 mm. 16. The blister package according to claim 1, wherein the second, outer weld has a width between 0.1 mm and 3 mm. 17. The method according to claim 11, wherein the first weld is welded with a rim width between 0.1 mm and 3 mm. 18. The method according to claim 11, wherein the secondary weld is welded with a rim width between 0.1 mm and 3 mm. 19. The method according to claim 12, wherein the secondary weld is welded so as to extend to an edge of the blister package and to the perforations in areas where the secondary weld is welded to the lower web.
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이 특허에 인용된 특허 (7)
Vasquez William M. ; Murphy Jeffrey Alan ; Sheldon Jill Nicole, Blister card package.
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