High-density rack unit systems and methods are described for telecommunication and data communication systems that utilize novel airflow mechanisms thereby enabling modularity and high-density in small-form factor units. The high-density rack unit systems and methods offer novel airflow mechanisms v
High-density rack unit systems and methods are described for telecommunication and data communication systems that utilize novel airflow mechanisms thereby enabling modularity and high-density in small-form factor units. The high-density rack unit systems and methods offer novel airflow mechanisms via right-angle backplane connectors to enable more airflow in a rack unit as well as novel field replaceable fans in these high-density rack units. Further, the high-density rack unit systems and methods include a baffle structure to keep power-supply-related airflow separate from the airflow over other components in the 1U or 2U rack unit. In this manner, the high-density rack unit systems and methods enable system vendors and network operators to realize significant density improvements.
대표청구항▼
1. A rack unit system, comprising: a physical housing comprising a front side, a back side, a left side, and a right side, wherein the left side and the right side are configured to connect to a rack, wherein the physical housing comprising 1RU (Rack Unit) or 2RU of height;bottom-plane connections l
1. A rack unit system, comprising: a physical housing comprising a front side, a back side, a left side, and a right side, wherein the left side and the right side are configured to connect to a rack, wherein the physical housing comprising 1RU (Rack Unit) or 2RU of height;bottom-plane connections located at or near the back side, wherein the bottom-plane connections interface to right-angle connections on associated bottom-plane circuit boards connecting the associated bottom-plane circuit boards to one another and wherein the associated bottom-plane circuit boards are in a horizontal plane inside the physical housing; anda first plurality of openings in the back side located in substantially unobstructed portions of the back side thereby enabling airflow through the physical housing;a power supply located internal to the physical housing, wherein the power supply is located in the horizontal plane with the associated bottom-plane circuit boards;a second plurality of openings located on either the left side or the right side for providing enabling airflow through the physical housing over the power supply; anda baffle blocking airflow from the front side from the power supply such that airflow from the power supply is disjoint from airflow associated with the associated bottom-plane circuit boards, wherein the baffle is located from a top side to a bottom side of the physical housing. 2. The rack unit system of claim 1, further comprising: top-plane connections located at or near the back side, wherein the top-plane connections interface to right-angle connections on associated top-plane circuit boards connecting the associated top-plane circuit boards to one another, and wherein the top-plane associated circuit boards are in a horizontal plane inside the physical housing. 3. The rack unit system of claim 2, further comprising: connections disposed on or attached to the physical housing communicatively coupling the top-plane connections and the bottom-plane connections to one another. 4. The rack unit system of claim 1, wherein the bottom-plane connections comprise a combination of male type pin connectors and female type socket connectors. 5. The rack unit system of claim 1, wherein the 1U or 2U rack unit comprises an Ethernet switch. 6. The rack unit system of claim 1, further comprising: at least one slot attached to or formed on the back side; anda connector in the at least one slot for receiving a selectively insertable cooling unit, wherein the cooling unit facilitates airflow through the plurality of openings in the back side and a plurality of openings in the left side, the right side, and the front side. 7. The rack unit system of claim 6, wherein the selectively insertable cooling unit comprises a field replaceable fan, wherein the connector facilitates power and alarm data between the rack unit and the field replaceable fan, wherein the airflow is directed between the front side and the back side and wherein the cooling modules include one or more pins that interface to the one or more slots for receiving power and instructions comprising when to turn on/off. 8. The rack unit system of claim 1, further comprising: a second set of a plurality of openings disposed near the power supply drawing in airflow for the power supply such that the airflow avoids the associated bottom-plane circuit boards. 9. The rack unit system of claim 1, wherein the power supply is modular and field replaceable. 10. A modular system, comprising: a housing comprising a front side, a back side, a left side, a right side, a top side, and a bottom side, wherein the physical housing comprising 1RU (Rack Unit) or 2RU of height;top-plane connections located at or near the back side and the top side;bottom-plane connections located at or near the back side and the bottom side, wherein the top-plane connections and the bottom-plane connections leave the back side substantially unobstructed for airflow there through;at least one module comprising a first right-angle connector configured to interface to one of the bottom-plane connections and a second right-angle connector configured to interface to one of the top-plane connections;a first plurality of openings in the back side located in substantially unobstructed portions of the back side thereby enabling airflow through the housing;a power supply located internal to the housing and in a same horizontal plane as the at least one module;a baffle blocking airflow from the front side from the power supply, wherein the baffle is located from the top side to the bottom side of the physical housing thereby separating airflow in the physical housing; anda second set of a plurality of openings disposed near the power supply drawing in airflow for the power supply such that the airflow avoids the at least one module, wherein the at least one module is selectively insertable through the front side. 11. The modular system of claim 10, wherein the top-plane connections comprise data connections and the bottom-plane connections comprise power connections. 12. The modular system of claim 11, wherein the top-plane connections comprise pin connectors and the bottom-plane connections comprise socket connectors. 13. The modular system of claim 10, further comprising: at least one slot attached to or formed on the back side; anda connector in the at least one slot for receiving a field replaceable fan, wherein the field replaceable fan facilitates airflow through the plurality of openings in the back side and a plurality of openings in the left side, the right side, and the front side. 14. The modular system of claim 10, wherein the power supply is modular and field replaceable. 15. A method, comprising: inserting a module comprising a pair of right-angle connectors thereon into a high-density 1U or 2U rack unit;selectively inserting and connecting the module via the pair of right-angle connectors to connections in the high-density 1U or 2U rack unit, wherein the pair of connections in the high-density 1U or 2U rack unit leave a substantial portion of a back side of the high-density 1U or 2U rack unit unobstructed for airflow;operating a selectively insertable cooling unit at or near the back side to draw airflow through the high-density 1U or 2U rack unit through the unobstructed substantial portion of the back side; andoperating a second cooling unit at or near a side to draw airflow through a side of the high-density 1U or 2U rack unit to cool a power unit which is located in a same horizontal plane as the module and which has airflow separate from the module through a baffle in the high-density 1U or 2U rack unit, wherein the baffle is located from a top side to a bottom side of the physical housing thereby separating airflow in the high-density 1U or 2U rack unit. 16. The rack unit system of claim 1, further comprising: a first set of one or more cooling units to facilitate airflow from the front side to the back side and over the associated bottom-plane circuit boards; anda second set of one or more cooling units to facilitate airflow from one of the right side and the left side to the back side and over the power supply. 17. The modular system of claim 10, further comprising: a first set of one or more cooling units to facilitate airflow to the plurality of openings and over the associated bottom-plane circuit boards; anda second set of one or more cooling units to facilitate airflow from the second set of the plurality of openings and over the power supply.
Gagnon Kevin M. (1668 Larwood Rd. Lemon Grove CA 91945) Goulter Victor H. (485 Molimo Dr. San Francisco CA 94127-1655), Dual filtered airflow systems for cooling computer components, with optimally placed air vents and switchboard control p.
Jarrett Brian S. ; Eldridge Robert A., Flexible computer chassis adapted to receive a plurality of different computer components of different sizes and config.
Faneuf, Barrett M.; Berry, William E.; Holalkere, Ven R.; De Lorenzo, David S., High capacity air-cooling systems for electronic apparatus and associated methods.
Hamburgen, William; Clidaras, Jimmy; Leung, Winnie; Stiver, David W.; Beck, Jonathan D.; Carlson, Andrew B.; Chow, Steven T. Y.; Imwalle, Gregory P.; Michael, Amir M., Modular data center cooling.
Claassen, Alan; Eckberg, Eric Alan; Hansen, Dennis John; Kamath, Vinod; Iyengar, Madhusudan K.; Mahaney, Jr., Howard Victor; Miller, Michael Sven; Mroz, Stephen Peter, Rack with integrated rear-door heat exchanger.
Wyler Gregory T. (Winchester MA), Silent air cooled computer having a hard disk drive with an acoustic shield and a heat sink arranged exterior to the dri.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.