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Auto-correction of malfunctioning thermal control element in a temperature control plate of a semiconductor substrate support assembly that includes deactivating the malfunctioning thermal control element and modifying a power level of at least one functioning thermal control element

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
  • H01L-021/67
출원번호 US-0307062 (2014-06-17)
등록번호 US-9543171 (2017-01-10)
발명자 / 주소
  • Waldmann, Ole
  • Pape, Eric A.
  • Gaff, Keith William
  • Singh, Harmeet
출원인 / 주소
  • LAM RESEARCH CORPORATION
인용정보 피인용 횟수 : 0  인용 특허 : 39

초록

A method for auto-correction of at least one malfunctioning thermal control element among an array of thermal control elements that are independently controllable and located in a temperature control plate of a substrate support assembly which supports a semiconductor substrate during processing the

대표청구항

1. A method for auto-correction of at least one malfunctioning thermal control element among an array of thermal control elements that are independently controllable and located in a temperature control plate of a substrate support assembly which supports a semiconductor substrate during processing

이 특허에 인용된 특허 (39)

  1. Gaff, Keith William; Singh, Harmeet; Comendant, Keith; Vahedi, Vahid, Adjusting substrate temperature to improve CD uniformity.
  2. O\Geary Daniel R. (Albuquerque NM) Arnold Larry D. (Albuquerque NM), Advanced thermoelectric heating and cooling system.
  3. Koelmel, Blake; Lerner, Alexander N.; Ranish, Joseph M.; Sangam, Kedarnath; Sorabji, Khurshed, Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber.
  4. Shu Nakajima JP; Neil Benjamin, Ceramic electrostatic chuck assembly and method of making.
  5. Natsuhara, Masuhiro; Narita, Masashi; Nakata, Hirohiko; Kuibira, Akira, Circuit pattern of resistance heating elements and substrate-treating apparatus incorporating the pattern.
  6. Liao Ching-Wen (Taipei Hsien TWX) Kuo Chin-Chuan (Chia TWX) Peng Chi-Kang (Hsin-chu TWX) Lin Tsun-Ching (Hsin-chu TWX), Compete hot plate temperature control system for hot treatment.
  7. Gerola, Davide; Pastore, Cristiano, Cooking hob with discrete distributed heating elements.
  8. Severns, Matthew L., Direct heater control for infant care apparatus.
  9. Ootsuka,Takeshi; Endou,Kazunori, Electrode-built-in susceptor and a manufacturing method therefor.
  10. Moon, Jung Eon, Electrostatic discharge protection device having low junction capacitance and operational voltage.
  11. Gore,Makarand P., Fuel cartridge with thermo-degradable barrier system.
  12. Okajima,Hisakazu; Unno,Yutaka; Kawasaki,Keiji, Heating apparatus.
  13. Gaff, Keith William; Comendant, Keith, Heating plate with diode planar heater zones for semiconductor processing.
  14. Singh, Harmeet; Gaff, Keith; Benjamin, Neil; Comendant, Keith, Heating plate with planar heater zones for semiconductor processing.
  15. Singh, Harmeet; Gaff, Keith; Benjamin, Neil; Comendant, Keith, Heating plate with planar heating zones for semiconductor processing.
  16. Colelli ; Jr. James J. ; Leggett Randall A. ; Mundenar Joseph ; Whiting Charles A., Hot plate with in situ surface temperature adjustment.
  17. Mak,Alfred W.; Lee,Yung Hee Yvette; Brooks,Cynthia B.; Buie,Melisa J.; Sahin,Turgut; Ding,Jian, Integrated phase angle and optical critical dimension measurement metrology for feed forward and feedback process control.
  18. Benjamin, Neil; Steger, Robert, Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support.
  19. Vincent E. Burkhart ; Steven Sansoni ; Michael N. Sugarman ; Anthony Chan, Method and apparatus for reducing thermal gradients within a substrate support.
  20. Segawa, Terutsugu; Sanada, Minoru, Method and apparatus for wafer level burn-in.
  21. Matsuda,Hiroto; Nobori,Kazuhiro; Mori,Yutaka, Method of manufacturing electrical resistance heating element.
  22. Lund Mark D. (Vancouver WA), Passively-multiplexed resistor array.
  23. Chen,Lee; Kambara,Hiromitsu; Tian,Caizhong; Nishizuka,Tetsuya; Nozawa,Toshihisa, Plasma processing system for treating a substrate.
  24. Getchel Paul A. ; Lyden Henry A. ; Miffitt Donald C., Power and control system for a workpiece chuck.
  25. Decesari, Roberto; Corda, Andrea; Brindani, Franco, Power management system in electrical cooking appliances.
  26. Barnett, Jr.,James R.; Ekblad,Mark K.; Parker,Jeffrey M., Process module tuning.
  27. Bethune Edwin M. ; Olmsted Donald, Semiconductor processing furnace heating control system.
  28. Morita Akihiko,JPX ; Ohtani Masami,JPX ; Imanishi Yasuo,JPX ; Tsuji Masao,JPX ; Iwami Masaki,JPX ; Nishimura Joichi,JPX ; Nishimura Kazuhiro,JPX ; Hamada Tetsuya,JPX ; Yamamoto Satoshi,JPX ; Kamei Ke, Substrate processing apparatus having regulated power consumption and method therefor.
  29. Giere, Matthew; Prakash, Satya; Askeland, Ronald A., System and method for predicting dynamic thermal conditions of an inkjet printing system.
  30. Sorabji, Khurshed; Lerner, Alexander; Ranish, Joseph; Hunter, Aaron; Adams, Bruce; Behdjat, Mehran; Ramanujam, Rajesh, Temperature measurement and control of wafer support in thermal processing chamber.
  31. Jyousaka, Megumi; Shinozuka, Shinichi; Ogata, Kunie, Temperature setting method of thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plate.
  32. Feder,Jan; Beyerle,Rick; Byers,Stephen; Jones,Thomas, Thermal control of a DUT using a thermal control substrate.
  33. Gaff, Keith William; Comendant, Keith; Ricci, Anthony, Thermal plate with planar thermal zones for semiconductor processing.
  34. Gaff, Keith William; Comendant, Keith; Ricci, Anthony, Thermal plate with planar thermal zones for semiconductor processing.
  35. Kessler Rolf (Merzhausen DEX), Thermoelectric heating or cooling device.
  36. Ennis, Gerard, Vacuum plasma processor and method of operating same.
  37. Arami Junichi (Tokyo JPX) Ishikawa Kenji (Sagamihara JPX) Deguchi Youichi (Machida JPX) Yagi Hironori (Yokohama JPX) Kawada Nobuo (Annaka JPX) Yanagisawa Isao (Annaka JPX), Vacuum processing apparatus.
  38. Kamp, Tom A.; Gottscho, Richard; Lee, Steve; Lee, Chris; Yamaguchi, Yoko; Vahedi, Vahid; Eppler, Aaron, Variable temperature processes for tunable electrostatic chuck.
  39. Fujikawa Takao (Takasago JPX) Uehara Katsuhiro (Takasago JPX) Sakashita Yoshihiko (Takasago JPX) Okada Hiroshi (Kobe JPX) Kawanaka Takao (Kobe JPX), Vertical furnace for the growth of single crystals.
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