초록 ▼

A semiconductor chip without a substrate is provided on an electrically insulating carrier. The carrier has electrically conductive contact metallizations. Furthermore, an electrically conductive carrier substrate and a covering substrate are provided. The covering substrate has electrically conduct

A semiconductor chip without a substrate is provided on an electrically insulating carrier. The carrier has electrically conductive contact metallizations. Furthermore, an electrically conductive carrier substrate and a covering substrate are provided. The covering substrate has electrically conductive contact structures. The carrier is attached to the carrier substrate. Subsequently, the covering substrate is attached to the semiconductor chip and/or to the carrier. The electrically conductive contact structures are connected in an electrically conductive manner to the electrically conductive contact metallizations and the electrically conductive carrier substrate.

대표청구항 ▼

1. A method for producing an optoelectronic component, the method comprising: providing a optoelectronic semiconductor chip arranged on a mounting surface of an electrically insulating carrier, wherein a plurality of electrically conductive contact metallizations are disposed on the mounting surface

1. A method for producing an optoelectronic component, the method comprising: providing a optoelectronic semiconductor chip arranged on a mounting surface of an electrically insulating carrier, wherein a plurality of electrically conductive contact metallizations are disposed on the mounting surface, the electrically conductive contact metallizations being insulated from one another;providing an electrically conductive carrier substrate;providing a covering substrate that has a plurality of electrically conductive contact structures that are electrically insulated from one another;applying the electrically insulating carrier with the optoelectronic semiconductor chip arranged thereon on the electrically conductive carrier substrate;applying the covering substrate on the optoelectronic semiconductor chip and/or on the mounting surface of the electrically insulating carrier; andelectrically conductively connecting the electrically conductive contact structures to the electrically conductive contact metallizations and the electrically conductive carrier substrate by folding over the contact structures of the covering substrate. 2. The method according to claim 1, wherein the electrically conductive carrier substrate and the contact structures of the covering substrate are embodied in an integral fashion. 3. The method according to claim 1, wherein the contact structures of the covering substrate are formed by being stamped out at least in regions from the electrically conductive carrier substrate. 4. The method according to claim 1, wherein the covering substrate has a radiation-influencing element. 5. The method according to claim 1, wherein the electrically conductively connecting is performed in a manner free of plated-through holes through the electrically insulating carrier and the electrically conductive carrier substrate. 6. The method according to claim 1, wherein the electrically conductive carrier substrate is formed by a metal foil. 7. The method according to claim 1, wherein the covering substrate is formed by a foil having the contact structures. 8. The method according to claim 1, wherein providing the optoelectronic semiconductor chip comprises providing a plurality of optoelectronic semiconductor chips in a wafer assemblage, each substrateless optoelectronic semiconductor chip being disposed on an electrically insulating carrier, and wherein providing the covering substrate comprises providing a plurality of covering substrates in the wafer assemblage, each covering substrate having a plurality of contact structures. 9. The method of claim 1, wherein the produced optoelectronic component comprises: the electrically insulating carrier;the optoelectronic semiconductor chip arranged on the mounting surface of the electrically insulating carrier; andthe electrically conductive carrier substrate, wherein the electrically insulating carrier is disposed on the electrically conductive carrier substrate,wherein the contact structures of the covering substrate are electrically conductively connected to the electrically conductive contact metallizations and the electrically conductive carrier substrate and are bent laterally at the electrically insulating carrier in a direction of the electrically conductive carrier substrate. 10. A method for producing an optoelectronic component, the method comprising: providing a optoelectronic semiconductor chip arranged on a mounting surface of an electrically insulating carrier, wherein a plurality of electrically conductive contact metallizations are disposed on the mounting surface, the electrically conductive contact metallizations being insulated from one another;providing an electrically conductive carrier substrate;providing a covering substrate that has a plurality of electrically conductive contact structures that are electrically insulated from one another;applying the electrically insulating carrier with the optoelectronic semiconductor chip arranged thereon on the electrically conductive carrier substrate;applying the covering substrate on the optoelectronic semiconductor chip and/or on the mounting surface of the electrically insulating carrier; andelectrically conductively connecting the electrically conductive contact structures to the electrically conductive contact metallizations and the electrically conductive carrier substrate, the produced optoelectronic component comprising: the electrically insulating carrier;the optoelectronic semiconductor chip arranged on the mounting surface of the electrically insulating carrier; andthe electrically conductive carrier substrate, wherein the electrically insulating carrier is disposed on the electrically conductive carrier substrate,wherein the contact structures of the covering substrate are electrically conductively connected to the electrically conductive contact metallizations and the electrically conductive carrier substrate and are bent laterally at the electrically insulating carrier in a direction of the electrically conductive carrier substrate. 11. A method for producing an optoelectronic component, the method comprising: providing a optoelectronic semiconductor chip arranged on a mounting surface of an electrically insulating carrier, wherein a plurality of electrically conductive contact metallizations are disposed on the mounting surface, the electrically conductive contact metallizations being insulated from one another;providing an electrically conductive carrier substrate;providing a covering substrate that has a plurality of electrically conductive contact structures that are electrically insulated from one another;applying the electrically insulating carrier with the optoelectronic semiconductor chip arranged thereon on the electrically conductive carrier substrate;applying the covering substrate on the optoelectronic semiconductor chip and/or on the mounting surface of the electrically insulating carrier; andelectrically conductively connecting the electrically conductive contact structures to the electrically conductive contact metallizations and the electrically conductive carrier substrate, wherein the contact structures of the covering substrate are formed by being stamped out at least in regions from the electrically conductive carrier substrate. 12. The method according to claim 11, wherein the electrically conductively connecting is effected by folding over the contact structures of the covering substrate. 13. A method for producing an optoelectronic component, the method comprising: providing a optoelectronic semiconductor chip arranged on a mounting surface of an electrically insulating carrier, wherein a plurality of electrically conductive contact metallizations are disposed on the mounting surface, the electrically conductive contact metallizations being insulated from one another;providing an electrically conductive carrier substrate;providing a covering substrate that has a plurality of electrically conductive contact structures that are electrically insulated from one another;applying the electrically insulating carrier with the optoelectronic semiconductor chip arranged thereon on the electrically conductive carrier substrate;applying the covering substrate on the optoelectronic semiconductor chip and/or on the mounting surface of the electrically insulating carrier; andelectrically conductively connecting the electrically conductive contact structures to the electrically conductive contact metallizations and the electrically conductive carrier substrate, wherein providing the optoelectronic semiconductor chip comprises providing a plurality of optoelectronic semiconductor chips in a wafer assemblage, each optoelectronic semiconductor chip being disposed on an electrically insulating carrier, and wherein providing the covering substrate comprises providing a plurality of covering substrates in the wafer assemblage, each covering substrate having a plurality of contact structures.