Solid electrolytic capacitor for embedding into a circuit board
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-001/16
H05K-001/18
H01G-009/15
H01G-009/012
출원번호
US-0079909
(2016-03-24)
등록번호
US-9545008
(2017-01-10)
발명자
/ 주소
Zednicek, Stanislav
Petrzilek, Jan
출원인 / 주소
AVX Corporation
대리인 / 주소
Dority & Manning, P.A.
인용정보
피인용 횟수 :
1인용 특허 :
89
초록▼
An electrolytic capacitor is provided that contains a capacitor element, a case, and anode and cathode terminations having first and second external components. The first external components are perpendicular to a lower surface of the case, while the second external components are parallel to the lo
An electrolytic capacitor is provided that contains a capacitor element, a case, and anode and cathode terminations having first and second external components. The first external components are perpendicular to a lower surface of the case, while the second external components are parallel to the lower surface of the case and extend outwardly away from the front and rear surfaces of the case, respectively. Further, the second external components are mounted to a circuit board such that at least a portion of the capacitor is embedded in the board and such that the second external components are parallel to and in contact with a mounting surface of the circuit board. The particular arrangement of the external components of the terminations stabilizes the capacitor when it is embedded into the board to minimize flexing against the board and cracking or delamination of the capacitor.
대표청구항▼
1. A circuit board comprising: a substrate having an upper surface and a lower surface, wherein the substrate defines a mounting surface on which opposing conductive members are located, wherein a recessed opening is provided between the conductive members; and a solid electrolytic capacitor compris
1. A circuit board comprising: a substrate having an upper surface and a lower surface, wherein the substrate defines a mounting surface on which opposing conductive members are located, wherein a recessed opening is provided between the conductive members; and a solid electrolytic capacitor comprising a capacitor element that includes an anode, a dielectric layer overlying the anode, and a cathode overlying the dielectric layer; a case that encapsulates the capacitor element, wherein the case includes an upper surface, a lower surface, a front surface, and a rear surface; an anode termination that is electrically connected to the anode, the anode termination containing a first external component that is generally perpendicular to the lower surface of the case and a second external component that is generally parallel to the lower surface of the case and that extends outwardly away from the front surface of the case; and a cathode termination that is electrically connected to the cathode, the cathode termination containing a first external component that is generally perpendicular to the lower surface of the case and a second external component that is generally parallel to the lower surface of the case and that extends outwardly away from the rear surface of the case; wherein the second external component of the anode termination and the second external component of the cathode termination are electrically connected to the conductive members so that at least a portion of the solid electrolytic capacitor is embedded within the recessed opening, further wherein the second external component of the anode termination and the second external component of the cathode termination are generally parallel to and in contact with the mounting surface, wherein the second external component of the anode termination and the second external component of the cathode termination are generally coplanar. 2. The circuit board of claim 1, wherein the upper surface of the substrate is the mounting surface such that the conductive members are located on the upper surface of the substrate. 3. The circuit board of claim 1, wherein the lower surface of the substrate is the mounting surface such that the conductive members are located on the lower surface of the substrate. 4. The circuit board of claim 1, wherein the upper surface of the case extends above the upper surface of the substrate. 5. The circuit board of claim 4, wherein the lower surface of the case is generally coplanar with the lower surface of the substrate. 6. The circuit board of claim 4, wherein the lower surface of the case extends below the lower surface of the substrate. 7. The circuit board of claim 1, wherein the anode includes tantalum, niobium, or an electrically conductive oxide thereof. 8. The circuit board of claim 1, wherein an anode lead is electrically connected to the anode. 9. The circuit board of claim 1, wherein the cathode includes a solid electrolyte. 10. The circuit board of claim 9, wherein the solid electrolyte includes manganese dioxide, a conductive polymer, or a combination thereof. 11. A solid electrolytic capacitor comprising: a capacitor element that defines an upper surface, a lower surface, a front surface, and a rear surface, wherein the capacitor element includes an anode, a dielectric layer overlying the anode, and a cathode overlying the dielectric layer that includes a solid electrolyte; a case that encapsulates the capacitor element, wherein the case includes an upper surface, a lower surface, a front surface, and a rear surface; an anode termination that is electrically connected to the anode, the anode termination containing a first external component that is generally perpendicular to the lower surface of the case and a second external component that is generally parallel to the lower surface of the case and that extends outwardly away from the front surface of the case; a cathode termination that is electrically connected to the cathode, the cathode termination containing a first external component that is generally perpendicular to the lower surface of the case and a second external component that is generally parallel to the lower surface of the case and that extends outwardly away from the rear surface of the case; wherein the second external component of the anode termination and the second external component of the cathode termination are configured to be mounted to a circuit board such that at least a portion of the capacitor is embedded in the circuit board and such that the second external component of the anode termination and the second external component of the cathode termination are generally parallel to and in contact with a mounting surface of the circuit board, wherein the second external component of the anode termination and the second external component of the cathode termination are generally coplanar. 12. The solid electrolytic capacitor of claim 11, wherein the anode includes tantalum, niobium, or an electrically conductive oxide thereof. 13. The solid electrolytic capacitor of claim 11, wherein an anode lead is electrically connected to the anode. 14. The solid electrolytic capacitor of claim 13, wherein the anode termination includes a first internal component and a second internal component. 15. The solid electrolytic capacitor of claim 14, wherein the first internal component is generally parallel to a lower surface of the capacitor element and wherein the second internal component is generally perpendicular to the lower surface of the capacitor element. 16. The solid electrolytic capacitor of claim 15, wherein the second internal component contains a region for receiving the anode lead. 17. The solid electrolytic capacitor of claim 16, wherein the region is U-shaped. 18. The solid electrolytic capacitor of claim 11, wherein the solid electrolyte includes manganese dioxide, a conductive polymer, or a combination thereof.
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