Applying pressure to adhesive using CTE mismatch between components
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B32B-037/10
B32B-037/12
출원번호
US-0963681
(2015-12-09)
등록번호
US-9555606
(2017-01-31)
발명자
/ 주소
Fisher, Michael J.
Long, David C.
Merte, Donald
Weiss, Robert
Weiss, Thomas
출원인 / 주소
INTERNATIONAL BUSINESS MACHINES CORPORATION
대리인 / 주소
McNamara, Esq., Margaret A.
인용정보
피인용 횟수 :
14인용 특허 :
117
초록▼
Assembly apparatuses and processes are provided which include a pressure cure fixture. The pressure cure fixture is sized to reside within a container, such as an electronic enclosure, and facilitate applying pressure to an adhesive disposed over an inner surface of the container. The pressure cure
Assembly apparatuses and processes are provided which include a pressure cure fixture. The pressure cure fixture is sized to reside within a container, such as an electronic enclosure, and facilitate applying pressure to an adhesive disposed over an inner surface of the container. The pressure cure fixture is formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and is sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container. When heated, the pressure cure fixture expands greater than the container and imparts the pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container.
대표청구항▼
1. An assembly apparatus comprising: a pressure cure fixture sized to reside within a container and facilitate applying pressure to an adhesive disposed over an inner surface of the container during curing, the pressure cure fixture being formed of a material with a higher coefficient of thermal exp
1. An assembly apparatus comprising: a pressure cure fixture sized to reside within a container and facilitate applying pressure to an adhesive disposed over an inner surface of the container during curing, the pressure cure fixture being formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and being sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container, wherein when heated, the pressure cure fixture expands greater than the container and imparts the pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container; andwherein the adhesive is a first adhesive, the pressure cure fixture is a first pressure cure fixture, the material of the first pressure cure fixture is a first material, and the surface-mount element is a first surface-mount element, and wherein the assembly apparatus further comprises a second pressure cure fixture to facilitate adhering a second surface-mount element to the inner surface of the container after the first surface-mount element has been adhered to the inner surface of the container, the second pressure cure fixture being formed of a second material with a higher coefficient of thermal expansion (CTE) than the container, the second pressure cure fixture being sized to correspond, at least in part, to the inner space of the container while allowing for the first surface-mount element, the second surface-mount element and a second adhesive to be disposed between the second pressure cure fixture and the inner surface of the container, wherein when heated, the second pressure cure fixture expands greater than the container and imparts pressure to the second surface-mount element and the second adhesive to facilitate securing the second surface-mount element to the inner surface of the container. 2. The assembly apparatus of claim 1, wherein the first adhesive comprises an adhesive sheet layer, at least one side of the adhesive sheet layer comprising a pressure-sensitive adhesive. 3. The assembly apparatus of claim 2, wherein the material of the first pressure cure fixture comprises a silicone sponge rubber. 4. The assembly apparatus of claim 2, wherein the inner surface comprises an inner-sidewall surface of the container, and wherein the first surface-mount element mounts to the inner-sidewall surface of the container via the first adhesive. 5. The assembly apparatus of claim 1, wherein the second adhesive comprises a liquid adhesive to be heat cured. 6. The assembly apparatus of claim 5, wherein the material of the pressure cure fixture comprises polytetraflouoroethylene. 7. The assembly apparatus of claim 1, further comprising a base fixture, upper fixture and clamp, the base fixture including an opening sized to receive the container with the first pressure cure fixture, first surface-mount element and first adhesive disposed therein, and the clamp clamping the upper fixture to the base fixture, and the base fixture, upper fixture and clamp facilitating alignment of the first surface-mount element to an edge of the container during the heating to cure the first adhesive and imparting the pressure to the first surface-mount element and the first adhesive. 8. The assembly apparatus of claim 1, wherein the first material and the second material are different materials, and wherein the first and second adhesives are different types of adhesives, at least one of the different types of adhesives comprising a pressure-sensitive adhesive. 9. The assembly apparatus of claim 1, wherein the different materials of the first and second pressure cure fixtures comprise at least one of silicone or polytetraflouoroethylene. 10. An assembly apparatus comprising: a pressure cure fixture sized to reside within an electronic enclosure and facilitate applying pressure to a an adhesive disposed over an inner surface of the electronic enclosure, the pressure cure fixture being formed of a material with a higher coefficient of thermal expansion (CTE) than the electronic enclosure, and being sized to correspond, at least in part, to an inner space of the electronic enclosure while allowing for the adhesive and a tamper-respondent sensor to be disposed between the pressure cure fixture and the inner surface of the electronic enclosure, wherein when heated, the pressure cure fixture expands greater than the electronic enclosure and imparts the pressure to the tamper-respondent sensor and the adhesive to facilitate securing the tamper-respondent sensor to the inner surface of the electronic enclosure; andwherein the adhesive is a first adhesive, the pressure cure fixture is a first pressure cure fixture, the material of the first pressure cure fixture is a first material, and wherein the assembly apparatus further comprises a second pressure cure fixture to facilitate adhering an inner main surface tamper-respondent sensor to an inner main surface of the electronic enclosure, the second pressure cure fixture comprising a second material with a higher coefficient of thermal expansion (CTE) than the electronic enclosure, and the second pressure cure fixture facilitating applying pressure to the second adhesive during curing, wherein the second pressure cure fixture is sized to correspond, at least in part, to the inner space of the electronic enclosure while allowing for the inner-sidewall tamper-respondent sensor, the first adhesive, the inner main surface tamper-respondent sensor and the second adhesive to be disposed between the second pressure cure fixture and the inner surface of the electronic enclosure, wherein when heated, the second pressure cure fixture expands greater than the electronic enclosure and imparts pressure to the inner main surface tamper-respondent sensor and the second adhesive to facilitate securing the inner main surface tamper-respondent sensor to the inner main surface of the electronic enclosure. 11. The assembly apparatus of claim 10, wherein the inner surface comprises an inner-sidewall of the electronic enclosure, and the tamper-respondent sensor comprises an inner-sidewall tamper-respondent sensor sized to cover the inner-sidewall of the electronic enclosure, and wherein the first adhesive comprises an adhesive sheet layer, at least one side of the adhesive sheet layer comprising a pressure-sensitive adhesive. 12. The assembly apparatus of claim 11, wherein the material of the first pressure cure fixture comprises a silicone sponge rubber. 13. The assembly apparatus of claim 10, wherein the first material and the second material are different materials, and wherein the first and second adhesives are different types of adhesives, at least one of the different types of adhesives comprising a pressure-sensitive adhesive. 14. The assembly apparatus of claim 13, wherein at least one of the different materials of the first and second pressure cure fixtures comprises silicone or polytetraflouoroethylene teflon. 15. The assembly apparatus of claim 10, further comprising a base fixture, upper fixture and clamp, the base fixture including an opening sized to receive the electronic enclosure with the pressure cure fixture, tamper-respondent sensor and first adhesive disposed therein, the clamp clamping the upper fixture to the base fixture, and the base fixture, upper fixture and clamp facilitating alignment of the tamper-respondent sensor to an edge of the electronic enclosure during the heating imparting the pressure to the tamper-respondent sensor and the first adhesive. 16. A fabrication method comprising: providing an assembly apparatus, comprising: providing a pressure cure fixture sized to reside within a container and facilitate applying pressure to an adhesive disposed over an inner surface of the container during curing, the pressure cure fixture being formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and being sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container;wherein heating the container with the pressure cure fixture, surface-mount element and adhesive disposed therein expands the pressure cure fixture greater than the container and imparts the pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container; andwherein the container is an electronic enclosure, and the surface-mount element comprises a tamper-respondent sensor. 17. The fabrication method of claim 16, wherein the first adhesive comprises an adhesive sheet layer, at least one side of the adhesive sheet layer comprising a pressure-sensitive adhesive.
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