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System and method for fluid cooling of electronic devices installed in a sealed enclosure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • H05K-005/02
  • H05K-005/00
출원번호 US-0225787 (2016-08-01)
등록번호 US-9560789 (2017-01-31)
발명자 / 주소
  • Smith, David Lane
출원인 / 주소
  • Smith, David Lane
인용정보 피인용 횟수 : 2  인용 특허 : 56

초록

A system and method for cooling electronic devices disposed with the inner volume of a fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The inner

대표청구항

1. A system for facilitating transfer of thermal energy from a volume of a containment vessel, said system comprising: said containment vessel enclosing the volume, said volume being sealed;a primary dielectric thermally conductive fluid at least partially filling said volume of said containment ves

이 특허에 인용된 특허 (56)

  1. Porter Warren W. (Escondido CA), Apparatus and method for cooling an electronic device.
  2. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Kamath, Vinod; Simons, Robert E., Apparatus and method for facilitating immersion-cooling of an electronic subsystem.
  3. Oktay Sevgin (Poughkeepsie NY) Torgersen Gerard J. (Pawling NY) Wong Alexander C. (Wappingers Falls NY), Bubble generating tunnels for cooling semiconductor devices.
  4. Attlesey, Chad Daniel, Case and rack system for liquid submersion cooling of electronic devices connected in an array.
  5. Attlesey, Chad Daniel, Case and rack system for liquid submersion cooling of electronic devices connected in an array.
  6. Attlesey, Chad Daniel, Case and rack system for liquid submersion cooling of electronic devices connected in an array.
  7. Attlesey, Chad Daniel; Klum, R. Daren; Berning, Allen James, Case for a liquid submersion cooled electronic device.
  8. Attlesey,Chad Daniel; Klum,R. Daren; Berning,Allen James, Circuit board assembly for a liquid submersion cooled electronic device.
  9. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser structures with fin cavities facilitating vapor condensation cooling of coolant.
  10. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling.
  11. Chester, Daniel; Hopton, Peter; Bent, Jason; Deakin, Keith, Cooled electronic system.
  12. Patel, Chandrakant D.; Obermaier, Hannsjorg; Barber, Vernon Alan, Cooling plate arrangement for electronic components.
  13. Cosley,Michael R.; Fischer,Richard L., Cooling system for densely packed electronic components.
  14. Takasou, Kazuo, Electronic apparatus cooling structure.
  15. Zapach Trevor,CAX ; Jeakins William D.,CAX ; Muegge Steven,CAX, Electronic unit.
  16. Besanger Michel (Grenoble FRX), Enclosure and printed circuit card with heat sink.
  17. Attlesey, Chad Daniel, Extruded server case.
  18. Canney, Brian A.; Karrat, Wally; Lehman, Bret W.; Molloy, Christopher L., Free cooling solution for a containerized data center.
  19. Attlesey, Chad Daniel; Williamson, Scott; Fjerstad, Wayne, Gravity assisted directed liquid cooling.
  20. Mistry Mahesh B. ; Slothower Robert Edwin, Heat exchanger for outdoor equipment enclosures.
  21. Vinson,Wade D.; Franz,John P., Heat sink having compliant interface to span multiple components.
  22. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Hybrid immersion cooled server with integral spot and bath cooling.
  23. Cray ; Jr. Seymour R. (Chippewa Falls WI), Immersion cooled high density electronic assembly.
  24. Shelnutt, Austin Michael; Curlee, James D.; Pike, Jimmy; Sekel, Joseph M.; Rousset, Stephen P.; Vivio, Joseph, Immersion server, immersion server drawer, and rack-mountable immersion server drawer-based cabinet.
  25. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  26. Smolley Robert (Portuguese Bend CA), Liquid cooled high density packaging for high speed circuits.
  27. Pellant Michal (Prague CSX) Zuna Jaroslav (Prague CSX) Novak Petr (Prague CSX) Zavazal Zdenek (Prague CSX) Kratina Jindrich (Prague CSX) Reichel Pavel (Prague CSX) Kafunek Pavel (Prague CSX), Liquid cooler for semiconductor power elements.
  28. El-Essawy, Wael R.; Keller, Jr., Thomas W.; Roy, Jarrod A.; Rubio, Juan C., Liquid cooling system for stackable modules in energy-efficient computing systems.
  29. Bishop Michael,CAX ; Zapach Trevor,CAX ; Moss John,CAX, Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments.
  30. Thomas Rammhofer DE; Jan Grabenstatter DE, Liquid reservoir.
  31. Attlesey, Chad D., Liquid submersion cooled network electronics.
  32. Attlesey, Chad Daniel; Klum, R. Daren; Berning, Allen James, Liquid submersion cooling system.
  33. Attlesey, Chad Daniel; Klum, R. Daren; Berning, Allen James, Liquid submersion cooling system.
  34. Attlesey,Chad Daniel; Klum,R. Daren; Berning,Allen James, Liquid submersion cooling system.
  35. Barrett Fredrick W. (Glendale AZ), Liquid-cooled circuit package with micro-bellows for controlling expansion.
  36. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
  37. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit.
  38. Clark William E. (401 Hyder St. ; N.E. Palm Bay FL 32907), Liquid-cooled, flat plate heat exchanger.
  39. Andresen Rolf (Tucson AZ) Bellar Robert J. (Tucson AZ) Kim Sung J. (Tucson AZ) Murphy Alan L. (Tucson AZ), Method and apparatus for immersion cooling or an electronic board.
  40. Taraci Richard (Phoenix AZ) Taraci Brian (Laguna Niguel CA) Gorgenyi Imre (Scottsdale AZ), Method and apparatus for maintaining electrically operating device temperatures.
  41. Taraci Richard (Phoenix AZ) Taraci Brian (Laguna Niguel CA) Gorgenyi Imre (Scottsdale AZ), Method and apparatus for maintaining electrically operating device temperatures.
  42. Huffstutler, Keith Wayne, Method and apparatus for protecting an article during operation.
  43. Cheng Bruce C. H.,TWX, Miniaturizing power supply system for portable computers by improving heat dissipation therein.
  44. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Moisture barrier seals for cooled IC chip module assemblies.
  45. Clidaras, Jimmy; Leung, Winnie, Motherboards with integrated cooling.
  46. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Open flow cold plate for immersion-cooled electronic packages.
  47. Dreier Kenneth ; Garcia Marvin P., Outdoor equipment cabinet.
  48. Iwatare Misao,JPX, Protective casing structure for electronic apparatus.
  49. Attlesey, Chad Daniel, Server case with optical input/output and/or wireless power supply.
  50. Cosley, Michael R.; Fischer, Richard L.; Thiesen, Jack H.; Willen, Gary S., Small scale chip cooler assembly.
  51. Olsen, John; Jackson, Bradley; Sendelbach, Eric; Higham, Gabriel; Bryan, James; Franz, Jason; North, Travis; Morris, William, System and method for cooling information handling resources.
  52. Smith, David Lane, System and method for fluid cooling of electronic devices installed in a sealed enclosure.
  53. Smith, David Lane, System and method for fluid cooling of electronic devices installed in a sealed enclosure.
  54. Shelnutt, Austin Michael; Curlee, James D.; Bailey, Edmond I.; Sekel, Joseph M.; Stuewe, John R.; Mills, Richard Steven, System and method for powering multiple electronic devices operating within an immersion cooling vessel.
  55. Neumann Edward William (Poughkeepsie NY) Rabenda ; Jr. Edward John (Poughkeepsie NY), Thermally conducting elastomeric device.
  56. Shelnutt, Austin Michael; Curlee, James D., Vertically-oriented immersion server with vapor bubble deflector.

이 특허를 인용한 특허 (2)

  1. Smith, David Lane, System and method for fluid cooling of electronic devices installed in a sealed enclosure.
  2. Smith, David Lane, System and method for fluid cooling of electronic devices installed in a sealed enclosure.
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