Large area nitride crystal and method for making it
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-021/02
H01L-029/20
C30B-025/02
C30B-025/18
C30B-029/40
C30B-033/06
출원번호
US-0731453
(2012-12-31)
등록번호
US-9564320
(2017-02-07)
발명자
/ 주소
D'Evelyn, Mark P.
Speck, James S.
Kamber, Derrick S.
Pocius, Douglas W.
출원인 / 주소
Soraa, Inc.
대리인 / 주소
Saul Ewing LLP
인용정보
피인용 횟수 :
0인용 특허 :
114
초록▼
Techniques for processing materials in supercritical fluids including processing in a capsule disposed within a high-pressure apparatus enclosure are disclosed. The disclosed techniques are useful for growing crystals of GaN, AlN, InN, and their alloys, including InGaN, AlGaN, and AlInGaN for the ma
Techniques for processing materials in supercritical fluids including processing in a capsule disposed within a high-pressure apparatus enclosure are disclosed. The disclosed techniques are useful for growing crystals of GaN, AlN, InN, and their alloys, including InGaN, AlGaN, and AlInGaN for the manufacture of bulk or patterned substrates, which in turn can be used to make optoelectronic devices, lasers, light emitting diodes, solar cells, photoelectrochemical water splitting and hydrogen generation devices, photodetectors, integrated circuits, and transistors.
대표청구항▼
1. A gallium-containing nitride merged crystal made from a process comprising: depositing an adhesion layer on a surface of a handle substrate, said adhesion layer having a melting point at a first temperature; while said adhesion layer is at a temperature of no less than said first temperature to m
1. A gallium-containing nitride merged crystal made from a process comprising: depositing an adhesion layer on a surface of a handle substrate, said adhesion layer having a melting point at a first temperature; while said adhesion layer is at a temperature of no less than said first temperature to melt said adhesion layer to enhance its adhesion, bonding at least a first crystal and a second crystal to said adhesion layer to form a tiled substrate, said first crystal having a first nominal crystallographic orientation (x1 y1 z1), and said second crystal having a second nominal crystallographic orientation (x2 y2 z2), said first nominal crystallographic orientation (x1 y1 z1) and said second nominal crystallographic orientation (x2 y2 z2) being identical; andafter said first and second crystals are adhered to said adhesion layer, heat treating said adhesion layer to form a heat-treated adhesion layer, said heat-treated adhesion layer having a melting point at a second temperature higher than said first temperature; laterally and vertically growing a crystalline composition over said tiled substrate using ammonothermal growth at a third temperature to form a merged crystal, said third temperature being higher than said first temperature and below said second temperature, wherein said first and second crystals define first and second domains in said merged crystal. 2. The crystal of claim 1, wherein each of the first domain and the second domain comprises GaN. 3. The crystal of claim 1, wherein each of the first domain and the second domain is characterized by a dislocation density of less than 106 cm−2. 4. The crystal of claim 1, wherein each of the first domain and the second domain is characterized by a dislocation density of less than 105 cm−2. 5. The crystal of claim 1, wherein each of the first domain and the second domain is characterized by a dislocation density of less than 104 cm−2. 6. The crystal of claim 1, wherein the first domain and the second domain are separated by a line of dislocations with a linear density less than 2×105 cm−1 and the polar misorientation angle γ between the first domain and the second domain is less than 0.3 degree and the misorientation angles α and β are less than 0.6 degree. 7. The crystal of claim 1, wherein the first domain and the second domain are separated by a line of dislocations with a linear density less than 1×105 cm−1 and the polar misorientation angle γ between the first domain and the second domain is less than 0.1 degree and the misorientation angles α and β are less than 0.2 degrees. 8. The crystal of claim 7, wherein the first domain and the second domain are separated by a line of dislocations with a linear density less than 1×104 cm−1 and the polar misorientation angle γ between the first domain and the second domain is less than 0.05 degrees. 9. The crystal of claim 1, wherein each of the first domain and the second domain are characterized by a nonpolar or semipolar surface crystallographic orientation and one or both of the first domain and the second domain are characterized by a stacking-fault concentration of about 103 cm−1 or less. 10. The crystal of claim 1, wherein each of the first domain and the second domain is characterized by an impurity concentration of H greater than about 1017 cm−2 and an impurity concentration of at least one of Li, Na, K, Rb, Cs, F, and Cl greater than about 1015 cm−1. 11. The crystal of claim 1, further comprising a semiconductor structure overlying at least one of the first domain and the second domain. 12. The crystal of claim 11, wherein an active layer of the semiconductor structure lies within a single domain. 13. The crystal of claim 12, wherein the semiconductor structure forms a portion of a device selected from a light emitting diode, a laser diode, a photodetector, an avalanche photodiode, a transistor, a rectifier, a thyristor, Schottky rectifier, a p-i-n diode, a metal-semiconductor-metal diode, a high-electron mobility transistor, a metal semiconductor field effect transistor, a metal oxide field effect transistor, a power metal oxide semiconductor field effect transistor, a power metal insulator semiconductor field effect transistor, a bipolar junction transistor, a metal insulator field effect transistor, a heterojunction bipolar transistor, a power insulated gate bipolar transistor, a power vertical junction field effect transistor, a cascode switch, an inner sub-band emitter, a quantum well infrared photodetector, a quantum dot infrared photodetector, and a combination of any of the foregoing. 14. The crystal of claim 1, wherein, each of the first domain and the second domain is characterized by a crystallographic orientation within 5 degrees of a (0 0 0 1) Ga-polar plane; andz1 and z2 are unit vectors along [0 0 0 −1], x1 and x2 are unit vectors along [1 0 −1 0], and y1 and y2 are unit vectors along [1 −2 1 0]. 15. The crystal of claim 1 wherein, each of the first domain and the second domain is characterized by a crystallographic orientation within 5 degrees of a {1 0 −1 0} non-polar plane; andz1 and z2 are unit vectors along [−1 0 1 0], x1 and x2 are unit vectors along [1 −2 1 0], and y1 and y2 are unit vectors along [0 0 0 1]. 16. The crystal of claim 1, wherein each of the first domain and the second domain is characterized by a crystallographic orientation within 5 degrees of an orientation selected from a{1 1 −2 ±2} plane, a {6 0 −6 ±1} plane, a {5 0 −5 ±1} plane, a {40 −4±1} plane, a {3 0 −3 ±1} plane, a {5 0 −5 ±2} plane, a {7 0 −7 ±3} plane, a {2 0 −2 ±1} plane, a {3 0 −3 ±2} plane, a {4 0 −4 ±3}, a {5 0 −5 ±4} plane, a {1 0−1 ±1} plane, a {1 0 −1 ±2} plane, a {1 0 −1 ±3} plane, a {2 1 −3 ±1} plane, and a {3 0 −3 ±4} plane. 17. The crystal of claim 1, wherein said first domain is characterized by a first lateral dimension and a second lateral dimension, and the second domain is characterized by a third lateral dimension and a fourth lateral dimension, wherein each of the first lateral dimension, the second lateral dimension, the third lateral dimension, and the fourth lateral dimension are greater than 10 millimeters. 18. The crystal of claim 1, wherein each of the first domain and the second domain is characterized by an impurity concentration of 0, H, C, and at least one of Na and K between about 1×1016 cm−3 and 1×1019 cm−3, between about 1×1016 cm−3 and 2×1019 cm−3, below 1×1017 cm−3, and between about 3×1015 cm−3 and 1×1018 cm−3, respectively, as quantified by calibrated secondary ion mass spectrometry (SIMS). 19. The crystal of claim 1, wherein each of the first domain and the second domain is characterized by an impurity concentration of O, H, C, and at least one of F and Cl between about 1×1016 cm−3 and 1×1019 cm−3, between about 1×1016 cm−3 and 2×1019 cm−3, below 1×1017 cm−3, and between about 1×1015 cm−3 and 1×1017 cm−3, respectively, as quantified by calibrated secondary ion mass spectrometry (SIMS). 20. The crystal of claim 1, wherein said growing comprises epitaxial growth. 21. The crystal of claim 1, wherein z1 is a negative surface normal of the first nominal crystallographic orientation, and x1 and y1 are crystallographic vectors that are orthogonal to z1;z2 is a negative surface normal of the second nominal crystallographic orientation, and x2 and y2 are crystallographic vectors that are orthogonal to z2;a polar misorientation angle γ between z1 and z2 is greater than about 0.005 degrees and less than about 0.5 degrees;a misorientation angle α between x1 and x2 is greater than about 0.01 degrees and less than about 1 degree; anda misorientation angle β between y1 and y2 is greater than about 0.01 degrees and less than about 1 degree. 22. The crystal of claim 1, wherein said first temperature is no greater than about 500° C., said second temperature is no less than about 700° C., and said third temperature is no less than 600° C.
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