A calculating apparatus includes a baseplate, a first mother board module and a connection module. The baseplate includes a bottom surface having a first component layout region, a second component layout region and a connection component layout region all arranged in order from a first side to a se
A calculating apparatus includes a baseplate, a first mother board module and a connection module. The baseplate includes a bottom surface having a first component layout region, a second component layout region and a connection component layout region all arranged in order from a first side to a second side of the bottom surface. The first mother board is drawably disposed at the first component layout region of the bottom surface. The first mother board includes a first tray, a first control board, and a first electronic hard disk drive. The connection module is electrically connected to the first mother board module so that the first mother board module is capable of performing external communication through the connection module.
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1. A computing apparatus, comprising: a baseplate having a bottom surface that has a first side and a second side opposite to the first side along a first direction, and has a first component layout region, a second component layout region, and a connection component layout region, the first compone
1. A computing apparatus, comprising: a baseplate having a bottom surface that has a first side and a second side opposite to the first side along a first direction, and has a first component layout region, a second component layout region, and a connection component layout region, the first component layout region extending from the first side of the bottom surface to the second side of the bottom surface, and the connection component layout region being farther from the first side of the bottom surface than the first and second component layout regions;a first mother board module drawably disposed at the first component layout region of the bottom surface and comprising:a first tray disposed at the first component layout region of the bottom surface;a first mother board disposed on the first tray and comprising a first central processing unit, a first electric connection port, and a second electric connection port;a first middle plate electrically connected to the first mother board, comprising a third electric connection port, disposed on the first tray, and being farther from the first side of the bottom surface than the first mother board;a first control board comprising a first serial transmission interface connection port and selectively disposed on either the first mother board or the first middle plate so that the first serial transmission interface connection port is selectively coupled to either the first electric connection port or the third electric connection port; anda first electronic hard disk drive (SATA DOM, Serial ATA Disk on Module) disposed on either the first mother board or the first middle plate selectively and comprising a first serial bus connection port that is coupled to the second electric connection port when the first electronic hard disk drive is on the first mother board; anda connection module disposed at the connection component layout region of the baseplate and electrically connected to the first mother board module so that the first mother board module is capable of performing external communication through the connection module. 2. The computing apparatus according to claim 1, wherein the second component layout region comprises a second mother board module electrically connected to the connection module, being capable of performing external communication through the connection module, and comprising: a second tray disposed at the second component layout region of the bottom surface;a second mother board disposed on the second tray and comprising a second central processing unit, a fourth electric connection port, and a fifth electric connection port;a second middle plate electrically connected to the second mother board, comprising a sixth electric connection port, disposed on the second tray, and being farther from the first side of the bottom surface than the second mother board, the second middle plate;a second control board comprising a second serial transmission interface connection port and selectively disposed on either the second mother board or the second middle plate so that the second serial transmission interface connection port is selectively coupled to either the fourth electric connection port or the sixth electric connection port; anda second electronic hard disk drive selectively disposed on the second mother board or the second middle plate and comprising a second serial bus connection port that is coupled to the fifth electric connection port. 3. The computing apparatus according to claim 1, wherein the first mother board module further comprises a first hard disk drive module and selectively comprises a first extended hard disk drive module; and when the first mother board module comprises the first extended hard disk drive module, the first extended hard disk drive module is disposed on the first mother board and near the first side of the bottom surface, the first serial transmission interface connection port of the first control board is coupled to the third electric connection port, the first control board is capable of communicating with the first mother board through the first middle plate, and the first serial bus connection port of the first electronic hard disk drive is coupled to the second electric connection port through a first cable line. 4. The computing apparatus according to claim 2, wherein the second mother board module further comprises a second hard disk drive module and selectively comprises a second extended hard disk drive module; and when the second mother board module comprises the second extended hard disk drive module, the second extended hard disk drive module is disposed on the second mother board and near the first side of the bottom surface, the second serial transmission interface connection port of the second control board is coupled to the sixth electric connection port, the second control board is capable of communicating with the second mother board through the second middle plate, and the second serial bus connection port of the second electronic hard disk drive is coupled to the fifth electric connection port through a second cable line. 5. The computing apparatus according to claim 1, wherein the first electric connection port and the third electric connection port are serial attached SCSI (SAS) connection ports, and the second electric connection port is a serial advanced technology attachment (SATA) connection port. 6. The computing apparatus according to claim 2, wherein the fourth electric connection port and the sixth electric connection port are SAS connection ports and the fifth electric connection port is a SATA electric connection port. 7. The computing apparatus according to claim 2, wherein when the first serial transmission interface connection port is coupled to the third electric connection port, the first control board and the first middle plate are parallel to each other; and when the second serial transmission interface connection port is coupled to the sixth electric connection port, the second control board and the second middle plate are parallel to each other. 8. The computing apparatus according to claim 2, wherein the first mother board is electrically connected to the connection module through the first middle plate, and the second mother board is electrically connected to the connection module through the second middle plate. 9. The computing apparatus according to claim 2, wherein the connection module comprises: a first intermediate backboard disposed at the connection component layout region and near the first component layout region and electrically connected to the first middle plate of the first mother board module;a second intermediate backboard disposed at the connection component layout region and near the second component layout region and electrically connected to the second middle plate of the second mother board module;an end plate disposed at the connection component layout region and near the second side of the bottom surface, electrically connected to the first intermediate backboard and the second intermediate backboard, and comprising a power connection port that is electrically connected to an external power module and configured to power the computing apparatus; anda signal board disposed at the connection component layout region and near the second side of the bottom surface and the end plate, electrically connected to the end plate, and comprising an external signal connection port configured to perform external communication for the computing apparatus. 10. The computing apparatus according to claim 9, wherein the connection module further comprises a plurality of connection wires, the end plate further comprises a plurality of internal power connection ports and a plurality of internal signal connection ports, the first intermediate backboard comprises a first power connection port and a first signal connection port, the first power connection port is electrically connected to one of the plurality of internal power connection ports of the end plate through one of the plurality of connection wires, the first signal connection port is electrically connected to one of the plurality of internal signal connection ports of the end plate through one of the plurality of connection wires, the second intermediate backboard comprises a second power connection port and a second signal connection port, the second power connection port is electrically connected to one of the plurality of internal power connection ports of the end plate through one of the plurality of connection wires, and the second signal connection port is electrically connected to one of the plurality of internal signal connection ports through one of the plurality of connection wires. 11. The computing apparatus according to claim 1, wherein the first mother board module further comprises a network control interface module, which is electrically connected to the first mother board, disposed on the first mother board, and closer to the first side of the bottom surface than the first central processing unit. 12. The computing apparatus according to claim 1, wherein the first mother board module further comprises a memory set comprising a plurality of memories, long edges of the plurality of memories are parallel to a direction from the first side to second side of the bottom surface, and the plurality of memories is disposed at two opposite sides of the first central processing unit, respectively. 13. The computing apparatus according to claim 2, wherein there is another first central processing unit in the first mother board module, and there is another second central processing unit in the second mother board module. 14. The computing apparatus according to claim 1, wherein the first electric connection port and the second electric connection port are closer to the first side of the bottom surface than the first central processing unit. 15. The computing apparatus according to claim 2, wherein the fourth electric connection port and the fifth electric connection port are closer to the first side of the bottom surface than the second central processing unit.
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