초록 ▼

A field effect transistor (FET) device including a substrate and a plurality of semiconductor layers provided on the substrate, where a top semiconductor layer is a heavily doped cap layer and another one of the semiconductor layers directly below the cap layer is a Schottky barrier layer, and where

A field effect transistor (FET) device including a substrate and a plurality of semiconductor layers provided on the substrate, where a top semiconductor layer is a heavily doped cap layer and another one of the semiconductor layers directly below the cap layer is a Schottky barrier layer, and where a gate recess is formed through the cap layer and into the Schottky barrier layer. The FET device also includes a gate terminal having a titanium layer, an inhibitor layer provided on the titanium layer and a gold layer provided on the inhibitor layer, where the gate terminal is formed in the recess so that the titanium layer is in contact with the Schottky barrier layer, and where the inhibitor layer is effective for preventing hydrogen gas from being dissociated into hydrogen atoms so as to reduce or prevent hydrogen poisoning of the FET device.

대표청구항 ▼

1. A field effect transistor (FET) device comprising: a substrate;a plurality of semiconductor layers provided on the substrate; anda gate terminal provided on the plurality of semiconductor layers, said gate terminal including a first gate metal layer provided in contact with one of the semiconduct

1. A field effect transistor (FET) device comprising: a substrate;a plurality of semiconductor layers provided on the substrate; anda gate terminal provided on the plurality of semiconductor layers, said gate terminal including a first gate metal layer provided in contact with one of the semiconductor layers, an inhibitor layer provided on the first gate metal layer and a second gate metal layer provided on the inhibitor layer, said inhibitor layer being effective for preventing hydrogen gas from being dissociated into hydrogen atoms so as to reduce or prevent hydrogen poisoning of the FET device. 2. The FET device according to claim 1 wherein the inhibitor layer is a titanium-tungsten layer. 3. The FET device according to claim 2 wherein the inhibitor layer has a thickness in the 30-50 Å range. 4. The FET device according to claim 1 wherein the inhibitor layer is selected from the group consisting of molybdenum, rhodium, tantalum, iridium and tungsten. 5. The FET device according to claim 1 wherein the first gate metal layer is titanium and the second gate metal layer is gold. 6. The FET device according to claim 1 wherein a top semiconductor layer of the plurality of semiconductor layers is a heavily doped cap layer and another one of the semiconductor layers directly below the cap layer is a Schottky barrier layer, and wherein the FET device includes a gate recess formed through the cap layer and into the Schottky barrier layer, and wherein the gate terminal is formed in the recess so that the first gate metal layer is in contact with the Schottky barrier layer. 7. The FET device according to claim 6 wherein the cap layer is an N+ GaAs layer and the barrier layer is an AlGaAs barrier layer. 8. The FET device according to claim 1 further comprising a silicon nitride passivation layer formed over the gate terminal. 9. The FET device according to claim 1 wherein the FET device is a high electron mobility transistor. 10. The FET device according to claim 1 wherein the FET device is sealed in a hermetically-sealed package. 11. The FET device according to claim 1 wherein the FET device is part of an integrated microwave assembly. 12. A field effect transistor (FET) device comprising: a substrate;a plurality of semiconductor layers provided on the substrate, wherein a top semiconductor layer of the plurality of semiconductor layers is a heavily doped cap layer and another one of the semiconductor layers directly below the cap layer is a Schottky barrier layer, and wherein a gate recess is formed through the cap layer and into the Schottky barrier layer; anda gate terminal including a titanium layer, an inhibitor layer provided on the titanium layer and a gold layer provided on the inhibitor layer, wherein the gate terminal is formed in the recess so that the titanium layer is in contact with the Schottky barrier layer, said inhibitor layer being effective for preventing hydrogen gas from being dissociated into hydrogen atoms so as to reduce or prevent hydrogen poisoning of the FET device. 13. The FET device according to claim 12 wherein the inhibitor layer is a titanium-tungsten layer. 14. The FET device according to claim 13 wherein the inhibitor layer has a thickness in the 30-50 Å range. 15. The FET device according to claim 12 wherein the inhibitor layer is selected from the group consisting of molybdenum, rhodium, tantalum, iridium and tungsten. 16. The FET device according to claim 12 wherein the cap layer is an N+ GaAs layer and the barrier layer is an AlGaAs barrier layer. 17. The FET device according to claim 12 wherein the FET device is a high electron mobility transistor. 18. The FET device according to claim 12 wherein the FET device is sealed in a hermetically-sealed package. 19. A field effect transistor (FET) device comprising: a substrate;a plurality of semiconductor layers provided on the substrate, wherein a top semiconductor layer of the plurality of semiconductor layers is a N+ GaAs cap layer and another one of the semiconductor layers directly below the cap layer is an AlGaAs Schottky barrier layer, and wherein a gate recess is formed through the cap layer and into the Schottky barrier layer; anda gate terminal including a titanium layer, a titanium-tungsten inhibitor layer provided on the titanium layer and a gold layer provided on the inhibitor layer, wherein the gate terminal is formed in the recess so that the titanium layer is in contact with the Schottky barrier layer, said inhibitor layer being effective for preventing hydrogen gas from being dissociated into hydrogen atoms so as to reduce or prevent hydrogen poisoning of the FET device. 20. The FET device according to claim 19 wherein the inhibitor layer has a thickness in the 30-50 Å range.