Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-005/00
H05K-005/02
출원번호
US-0865686
(2015-09-25)
등록번호
US-9578764
(2017-02-21)
발명자
/ 주소
Fisher, Michael J.
Long, David C.
Peets, Michael T.
Weiss, Thomas
출원인 / 주소
INTERNATIONAL BUSINESS MACHINES CORPORATION
대리인 / 주소
McNamara, Esq., Margaret A.
인용정보
피인용 횟수 :
14인용 특허 :
119
초록▼
Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and
Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner surface. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the at least one security element overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure. In enhanced embodiments, the electronic enclosure is secured to a multilayer circuit board which includes an embedded tamper-respondent sensor, and together, the tamper-respondent sensor covering the inner surface of the electronic enclosure and the embedded tamper-respondent sensor within the multilayer circuit board define a secure volume about the electronic component(s).
대표청구항▼
1. A tamper-respondent assembly comprising: an electronic enclosure to enclose, at least in part, at least one electronic component to be protected, the electronic enclosure comprising an inner surface;a tamper-respondent electronic circuit structure comprising a tamper-respondent sensor coupled to
1. A tamper-respondent assembly comprising: an electronic enclosure to enclose, at least in part, at least one electronic component to be protected, the electronic enclosure comprising an inner surface;a tamper-respondent electronic circuit structure comprising a tamper-respondent sensor coupled to the inner surface of the electronic enclosure, the tamper-respondent sensor comprising at last one flexible layer with tamper-detect circuit lines covering, at least in part, the inner surface of the electronic enclosure and defining, at least in part, a secure volume about the electronic enclosure; andat least one security element disposed within the secure volume and overlying and physically securing in place, at least in part, the tamper-respondent sensor, with the at least one flexible layer with tamper-detect circuit lines covering, at least in part, the inner surface of the electronic enclosure, wherein the at least one flexible layer with tamper-detect circuit lines is positioned, at least in part, between the inner surface of the electronic enclosure and the at least one security element. 2. The tamper-respondent assembly of claim 1, wherein the at least one security element comprises at least one metal security element. 3. The tamper-respondent assembly of claim 2, wherein the at least one metal security element is grounded. 4. The tamper-respondent assembly of claim 1, wherein the at least one security element defines a security band which extends, at least in part, around an inner perimeter of the electronic enclosure. 5. The tamper-respondent assembly of claim 4, wherein the tamper-respondent assembly comprises multiple, distinct security elements, with adjacent security elements of the multiple, distinct security elements being spaced apart with a gap therebetween, the security band being defined by the multiple, distinct security elements, and the at least one security element being at least one security element of the multiple, distinct security elements. 6. The tamper-respondent assembly of claim 1, wherein the inner surface of the electronic enclosure comprises an inner main surface and an inner sidewall surface, and the security element overlies and physically secures in place the tamper-respondent sensor over, at least in part, the inner main surface or the inner sidewall surface of the electronic enclosure. 7. The tamper-respondent assembly of claim 6, wherein the tamper-respondent sensor is an inner-sidewall tamper-respondent sensor disposed over the inner sidewall surface of the electronic enclosure, and the tamper-respondent electronic circuit structure further comprises an inner main surface tamper-respondent sensor disposed, at least in part, over the inner main surface of the electronic enclosure, the inner-sidewall tamper-respondent sensor and the inner main surface tamper-respondent sensor being discrete, tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about the at least one electronic component to be protected. 8. The tamper-respondent assembly of claim 7, wherein the at least one security element overlies and secures in place the overlap of the inner-sidewall tamper-respondent sensor and the inner main surface tamper-respondent sensor. 9. The tamper-respondent assembly of claim 8, wherein the inner sidewall surface includes at least one inner-sidewall corner, and the at least one security element overlies and physically secures in place the overlap of the inner-sidewall tamper-respondent sensor and the inner main surface tamper-respondent sensor at the at least one inner-sidewall corner of the electronic enclosure. 10. The tamper-respondent assembly of claim 9, wherein the inner main surface tamper-respondent sensor comprises multiple corner tabs projecting therefrom, the multiple corner tabs overlying, at least in part, the at least one inner-sidewall corner of the electronic enclosure, and the at least one security element overlies and physically secures in place the multiple corner tabs projecting from the inner main surface tamper-respondent sensor at the at least one inner-sidewall corner of the electronic enclosure. 11. The tamper-respondent assembly of claim 8, wherein: the at least one flexible layer comprises at least one first flexible layer having opposite first and second sides; andthe tamper-detect circuit lines comprise first circuit lines forming at least one first tamper-detect network, the first circuit lines being disposed on at least one of the first side or the second side of the at least one first flexible layer; andthe inner main surface tamper-respondent sensor comprises: at least one second flexible layer having opposite first and second sides; andsecond circuit lines forming at least one second tamper-detect network, the second circuit lines being disposed on at least one of the first side or the second side of the at least one second flexible layer. 12. A tamper-respondent assembly comprising: an electronic assembly comprising at least one electronic component to be protected;an electronic enclosure surrounding, at least in part, the electronic assembly, the electronic enclosure comprising an inner surface;a tamper-respondent electronic circuit structure comprising a tamper-respondent sensor coupled to the inner surface of the electronic enclosure, the tamper-respondent sensor comprising at least one flexible layer with tamper-detect circuit lines covering, at least in part, the inner surface of the electronic enclosure, and defining, at least in part, a secure volume about the electronic enclosure; andat least one security element disposed within the secure volume and overlying and physically securing in place, at least in part, the tamper-respondent sensor, with the at least one flexible layer with tamper-detect circuit lines covering, at least in part, the inner surface of the electronic enclosure, wherein the at last one flexible layer with tamper-detect circuit lines is positioned, at least in part, between the inner surface of the electronic enclosure and the at least one security element. 13. The tamper-respondent assembly of claim 12, further comprising: a multilayer circuit board, the electronic assembly being associated with the multilayer circuit board;an embedded tamper-respondent sensor disposed within the multilayer circuit board; andwherein the electronic enclosure seals to the multilayer circuit board, and the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the embedded tamper-respondent sensor within the multilayer circuit board define a secure volume about the electronic assembly. 14. The tamper-respondent assembly of claim 13, wherein the at least one security element comprises at least one metal security element. 15. The tamper-respondent assembly of claim 13, wherein the at least one security element defines a security band which extends, at least in part, around an inner perimeter of the electronic enclosure. 16. The tamper-respondent assembly of claim 15, wherein the tamper-respondent assembly comprises multiple, distinct security elements, with adjacent security elements of the multiple, distinct security elements being spaced apart, with a gap therebetween, the security band being defined by the multiple, distinct security elements, and the at least one security element being at least one security element of the multiple, distinct security elements. 17. The tamper-respondent assembly of claim 13, wherein the tamper-respondent sensor is an inner-sidewall tamper-respondent sensor disposed over the inner sidewall surface of the electronic enclosure, and the tamper-respondent electronic circuit structure further comprises an inner main surface tamper-respondent sensor disposed, at least in part, over the inner main surface of the electronic enclosure, the inner-sidewall tamper-respondent sensor and the inner main surface tamper-respondent sensor being discrete, tamper-respondent sensors that overlap, at least in part, and facilitate defining the secure volume within which the electronic assembly is disposed, and wherein the at least one security element overlies and secures in place the overlap of the inner-sidewall tamper-respondent sensor and the inner main surface tamper-respondent sensor. 18. The tamper-respondent assembly of claim 17, wherein the inner sidewall surface includes at least one inner-sidewall corner, and the at least one security element overlies and physically secures in place the overlap of the inner-sidewall tamper-respondent sensor and the inner main surface tamper-respondent sensor at the at least one inner-sidewall corner of the electronic enclosure. 19. The tamper-respondent assembly of claim 18, wherein the inner main surface tamper-respondent sensor comprises multiple corner tabs projecting therefrom, the multiple corner tabs overlying, at least in part, the at least one inner-sidewall corner of the electronic enclosure, and the at least one security element overlies and physically secures in place the multiple corner tabs projecting from the inner main surface of the tamper-respondent sensor at the at least one inner-sidewall corner of the electronic enclosure.
Verrier Philippe (Le Port Marly FRX) Poulenard Roger (Le Peco FRX), Arrangement for protecting an electronic card and its use for protecting a terminal for reading magnetic and/or micropro.
Angelopoulos, Marie; Graham, Teresita O.; Purushothaman, Sampath; Weingart, Steve H., Data protection by detection of intrusion into electronic assemblies.
Kleijne Theodoor A. (Dreumel NLX) de Bruin Johannes A. J. (Montfoort NLX) Goossens Jan B. (De Bilt NLX), Data security device for protecting stored data.
Shirakami, Takashi; Yamazaki, Naoya; Iino, Kazuhiro; Tada, Yoshiaki; Ueda, Satoshi, Heat transfer mechanism, heat dissipation system, and communication apparatus.
Bumler Heinz (Mnchen DEX) Hoffmann Richard (Gaimersheim DEX) Schirmer Klaus (Ingolstadt DEX) Zeides Otto (Ingolstadt DEX), Housing for installation in motor vehicles.
Dellmo, Russell Wayne; Petkus, Eric Edmond; Yancy, Bruce Wayne, Modular cryptographic device providing multi-mode wireless LAN operation features and related methods.
Perreault,Paul G; Clark,Douglas A; Heitmann,Kjell A, System and method for installing a tamper barrier wrap in a PCB assembly, including a PCB assembly having improved heat sinking.
Mori Ryoichi (24-12 ; Hakusan 1-chome Bunkyo-ku ; Tokyo JPX), Tamper resistant module having logical elements arranged in multiple layers on the outer surface of a substrate to prote.
Comerford Liam D. (Carmel NY) Ledermann Peter G. (Pleasantville NY) Levy Lawrence I. (Yorktown Heights NY) White Steve R. (New York NY), Tamper resistant packaging for information protection in electronic circuitry.
Farquhar, Donald S.; Feger, Claudius; Markovich, Voya; Papathomas, Konstantinos I.; Poliks, Mark D.; Shaw, Jane M.; Szeparowycz, George; Weingart, Steve H., Tamper-responding encapsulated enclosure having flexible protective mesh structure.
Farquhar, Donald S.; Feger, Claudius; Markovich, Voya; Papathomas, Konstantinos I.; Poliks, Mark D.; Shaw, Jane M.; Szeparowycz, George; Weingart, Steve H., Tamper-responding encapsulated enclosure having flexible protective mesh structure.
Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Thomas, Enclosure with inner tamper-respondent sensor(s) and physical security element(s).
Busby, James A.; Dragone, Silvio; Fisher, Michael J.; Gaynes, Michael A.; Long, David C.; Rodbell, Kenneth P.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-proof electronic packages formed with stressed glass.
Brodsky, William L.; Busby, James A.; Dreiss, Zachary T.; Fisher, Michael J.; Long, David C.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with bond protection.
Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Dragone, Silvio; Fisher, Michael J.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with enclosure-to-board protection.
Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Robert; Weiss, Thomas; Tersigni, James E., Tamper-respondent assembly with vent structure.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.