Method of bonding material layers in an additive manufacturing process
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B29C-041/22
B32B-003/06
B32B-003/26
B32B-005/16
B32B-005/22
B29C-071/04
C08L-079/08
C08L-069/00
C08L-055/02
B33Y-010/00
B33Y-070/00
B29C-067/00
B29C-070/64
B29C-037/00
B29C-059/00
C08K-009/10
B29K-069/00
B29K-055/02
B29K-105/00
B29C-035/08
B29C-059/16
B29C-059/02
출원번호
US-0475360
(2014-09-02)
등록번호
US-9586371
(2017-03-07)
발명자
/ 주소
Rothfuss, Christopher J.
출원인 / 주소
EMPIRE TECHNOLOGY DEVELOPMENT LLC
대리인 / 주소
Dorsey & Whitney LLP
인용정보
피인용 횟수 :
0인용 특허 :
6
초록▼
Feedstocks for additive manufacturing are provided. The feedstock may include a matrix material, and one or more capsules disposed in the matrix material, wherein the one or more capsules are configured to be removable from a surface portion when the matrix material is solidified to form one or more
Feedstocks for additive manufacturing are provided. The feedstock may include a matrix material, and one or more capsules disposed in the matrix material, wherein the one or more capsules are configured to be removable from a surface portion when the matrix material is solidified to form one or more cavities in the surface portion. Methods of depositing the feedstocks and objects formed from the feedstocks are also provided.
대표청구항▼
1. A method of bonding material layers in an additive manufacturing process, the method comprising: forming a layer of a first feedstock comprising a first matrix material and one or more first capsules disposed in the first matrix material, the first feedstock including one or more reinforcement st
1. A method of bonding material layers in an additive manufacturing process, the method comprising: forming a layer of a first feedstock comprising a first matrix material and one or more first capsules disposed in the first matrix material, the first feedstock including one or more reinforcement structures that extend between the first matrix material and the one or more first capsules;removing the one or more first capsules from at least a surface portion of the first matrix material when the first matrix material solidifies, thereby forming one or more cavities in the surface portion, wherein the one or more reinforcement structures remain extended from the first matrix material after removal of the one or more first capsules; andforming a layer of a second feedstock comprising a second matrix material, on at least a portion of the first matrix material;prior to solidification of the second matrix material, at least partially infiltrating the one or more cavities in the surface portion of the first matrix material with the second matrix material. 2. The method of claim 1, wherein a bond between the first matrix material and the second matrix material is strengthened by infiltration of the second matrix material into the one or more cavities in the first matrix material. 3. The method of claim 1, wherein removing the one or more first capsules from at least a surface portion of the first matrix material when the first matrix material solidifies comprises removing the one or more capsules by contacting the surface portion of the first matrix material with at least one acid, at least one solvent, or both. 4. The method of claim 1, wherein removing the one or more first capsules from at least a surface portion of the first matrix material when the first matrix material solidifies comprises removing the one or more capsules by exposing the surface portion of the first matrix material to visible light, ultraviolet light, or infrared light. 5. The method of claim 1, wherein one or both of the layer of the first feedstock and the layer of the second feedstock are formed by a powder-based process, an extrusion-based process, or a liquid-vat process. 6. The method of claim 5, wherein the powder-based process includes at least one of three-dimensional printing, laser sintering, or selective mark sintering. 7. The method of claim 5, wherein the extrusion-based process includes at least one of fused deposition modeling, multiphase jet solidification, or jetted photopolymer. 8. The method of claim 5, wherein the liquid-vat process includes stereolithography. 9. The method of claim 1, wherein the first matrix material and the second matrix material are formed of the same material or are formed of different materials. 10. The method of claim 1, wherein the first matrix material and the second matrix material have compatible mechanical properties, thermal properties, or both. 11. The method of claim 1, wherein the first matrix material and the second matrix material are chemically inert to each other. 12. The method of claim 1, wherein one or both of the first feedstock and the second feedstock include a binder. 13. The method of claim 1, wherein one or both of the first matrix material and the second matrix material include one or more of at least one thermoplastic polymer, at least one thermoset polymer, or at least one photoactive polymer. 14. The method of claim 13, wherein the at least one thermoplastic polymer includes at least one of polyphenylsulfone, acrylonitrile butadiene styrene, polycarbonate, polyamide, polyetherimide, or polystyrene. 15. The method of claim 1, wherein the one or more reinforcement structures extend between the first matrix material and the second matrix material after forming the layer of the second feedstock on the first matrix material. 16. The method of claim 1, wherein the second feedstock includes one or more second capsules disposed in the second matrix material. 17. The method of claim 16, wherein the one or more first capsules in the first feedstock and the one or more second capsules in the second feedstock are formed of the same material or are formed of different materials. 18. A method of bonding material layers in an additive manufacturing process, the method comprising: forming a layer of a first feedstock including a first matrix material and one or more first light-decomposable capsules disposed in the first matrix material;exposing a surface portion of the first matrix material to at least one of light effective to remove the one or more first light-decomposable capsules from at least the surface portion of the first matrix material when the first matrix material solidifies, thereby forming one or more cavities in the surface portion; andforming a layer of a second feedstock including a second matrix material, on at least a portion of the first matrix material;prior to solidification of the second matrix material, at least partially infiltrating the one or more cavities in the surface portion of the first matrix material with the second matrix material. 19. The method of claim 18, wherein the light includes visible light, ultraviolet light, or infrared light.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (6)
Priedeman, Jr., William R., Build materials containing nanofibers for use with extrusion-based layered depositions systems.
Juskey Frank J. (Coral Springs FL) Suppelsa Anthony B. (Coral Springs FL) Dorinski Dale W. (Coral Springs FL), Method of forming a three-dimensional printed circuit assembly.
Ozaki Tatsuhiko,JPX ; Suzuki Toshiharu,JPX ; Matsueda Hirokazu,JPX, Method of providing leveling property to photocurable resin composition layers in production process of three-dimensiona.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.