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To eliminate such shortcomings in the prior art that a large-scale semiconductor facility is required, large-sized wiring cannot be produced, and wiring for connection between substrates cannot be formed. Also, to eliminate such shortcomings in a method of using optical fibers for wiring that the wi

To eliminate such shortcomings in the prior art that a large-scale semiconductor facility is required, large-sized wiring cannot be produced, and wiring for connection between substrates cannot be formed. Also, to eliminate such shortcomings in a method of using optical fibers for wiring that the wiring is unstable, requires a larger space, and gives rise to a difficulty in management regarding how the optical fibers are connected when the number of optical fibers increases. Further, to eliminate such shortcomings in another method of holding and fixing an optical fiber between polymer sheets that wiring cannot be formed on a plate connecting substrates. In an optical fiber wiring method and apparatus, by feeding an optical fiber, preferably a polymer-made optical fiber, to pass through an adhesive ejecting nozzle having an inner diameter larger than an outer diameter of the optical fiber, the optical fiber coated with the adhesive on a fiber surface is obtained and optical wiring is formed on a substrate by using the adhesive-coated optical fiber. The optical wiring is formed on the substrate by moving the substrate and the nozzle relative to each other, for example, by moving the nozzle with the substrate held fixed, or by moving the substrate with the nozzle held fixed. The adhesive is of the type being hardened with irradiation of an ultraviolet ray. The optical wiring is formed on the substrate by irradiating an ultraviolet ray after the optical fiber coated with the adhesive on the fiber surface has been wired on the substrate.

대표청구항 ▼

1. An optical fiber wiring method comprising the steps of: feeding an optical fiber to pass through a syringe holding a liquid adhesive, the syringe having an opening disposed at an upper end and an adhesive ejecting nozzle with an inner diameter larger than an outer diameter of the optical fiber, w

1. An optical fiber wiring method comprising the steps of: feeding an optical fiber to pass through a syringe holding a liquid adhesive, the syringe having an opening disposed at an upper end and an adhesive ejecting nozzle with an inner diameter larger than an outer diameter of the optical fiber, wherein the optical fiber passes through a liquid surface and is immersed in the liquid adhesive in the syringe, and the optical fiber coated with the liquid adhesive on a fiber surface exits from the adhesive ejecting nozzle; andforming an optical fiber circuit on a surface of a workpiece by simultaneously ejecting the optical fiber and the liquid adhesive,wherein the syringe does not have a port on its lateral surface,wherein the syringe is covered with a cover for supporting the syringe and the optical fiber, the cover is detachably attached to the upper end,wherein the cover includes an inlet portion through which the optical fiber is introduced, an air supply port and a packing to prevent leakage of air between the syringe and the cover, andwherein air pressure is applied on the liquid adhesive from the air supply port. 2. The optical fiber wiring method according to claim 1, wherein the workpiece comprises at least two substrates and the optical fiber circuit includes an optical connection between two substrates. 3. The optical fiber wiring method according to claim 2, wherein the optical connection includes an optical fiber which is wired on the two substrates in a manner that bridges and straddles the two substrates. 4. The optical fiber wiring method according to claim 1, wherein the optical fiber is ejected through the nozzle with the adhesive ejected through the nozzle. 5. The optical fiber wiring method according to claim 1, wherein the cover supports a pipe which is connected to the air supply port. 6. The optical fiber wiring method according to claim 1, wherein the optical fiber circuit includes a linear shape and a curved shape, wherein feeding speed of the optical fiber is increased when the optical fiber circuit is formed in the linear shape, and the feeding speed of the optical fiber is decreased when the optical fiber circuit is formed in the curved shape, andwherein a pressure for pushing out the adhesive is raised when feeding speed of the optical fiber is increased, and the pressure for pushing out the adhesive is lowered when feeding speed of the optical fiber is decreased.