Described herein are improved configurations for providing a stranded printed circuit board trace comprising, a plurality of conductor layers, a plurality of individual conductor traces on each of the said conductor layers, and a plurality of vias for connecting individual conductor traces on differ
Described herein are improved configurations for providing a stranded printed circuit board trace comprising, a plurality of conductor layers, a plurality of individual conductor traces on each of the said conductor layers, and a plurality of vias for connecting individual conductor traces on different said conductor layers, the vias located on the outside edges of the stranded trace. The individual conductor traces of each layer may be routed from vias on one side of the stranded printed circuit board trace to vias on the other side in a substantially diagonal direction with respect to the axis of the stranded printed circuit board trace. In embodiments, the stranded printed circuit board trace configuration may be applied to a wireless power transfer system.
대표청구항▼
1. A high-Q self-resonant coil, comprising: a high-Q inductor coil, with inductance L, formed on a substrate; comprisingat least two turns of formed conducting material;wherein a spacing between the at least two turns of the formed conducting material is designed to produce a distributed capacitance
1. A high-Q self-resonant coil, comprising: a high-Q inductor coil, with inductance L, formed on a substrate; comprisingat least two turns of formed conducting material;wherein a spacing between the at least two turns of the formed conducting material is designed to produce a distributed capacitance, C; andwherein a resonant frequency, w, of the self-resonant coil is substantially equal to 1/(LC)1/2;wherein w is an operating frequency of a wireless power transfer system. 2. The self-resonant coil of claim 1, wherein the formed conducting material comprises copper. 3. The self-resonant coil of claim 1, wherein the formed conducting material comprises conducting ink. 4. The self-resonant coil of claim 1, wherein the formed conducting material comprises aluminum. 5. The self-resonant coil of claim 1, wherein the substrate is rigid. 6. The self-resonant coil of claim 1, wherein the substrate is flexible. 7. The self-resonant coil of claim 1, wherein the self-resonant frequency is between 10 kHz and 100 MHz. 8. The self-resonant coil of claim 1, wherein the self-resonant frequency is an ISM frequency. 9. The self-resonant coil of claim 1, wherein the self-resonant frequency is 6.78 MHz. 10. The self-resonant coil of claim 1, wherein the self-resonant frequency is 13.56 MHz. 11. A source element for a non-radiative wireless power source, comprising: a circuit board comprising at least first and second layers;wherein the first layer comprises an inductive element for generating an oscillating magnetic near-field; andwherein the second layer comprises a high-Q self-resonant coil. 12. The source element of claim 11, wherein the circuit board is rigid. 13. The source element of claim 11, wherein the circuit board is flexible. 14. The source element of claim 11, further comprising circuit board traces on the first layer for placing elements of source resonator power and control circuitry. 15. The source element of claim 14, wherein the elements of source resonator power and control circuitry comprise any of a transistor, a capacitor, an inductor, a diode, and a sensor. 16. A device element for a non-radiative wireless power device, comprising: a circuit board comprising at least first and second layers;wherein at least one layer comprises an inductive element for capturing an oscillating magnetic near-field; andwherein at least one other layer comprises a high-Q self-resonant coil. 17. The device element of claim 16, wherein the circuit board is rigid. 18. The device element of claim 16, wherein the circuit board is flexible. 19. The device element of claim 16 further comprising circuit board traces on the at least first layer for placing elements of device resonator power and control circuitry. 20. The device element of claim 19, wherein the elements of device resonator power and control circuitry comprise any of a transistor, a capacitor, an inductor, a diode, and a sensor.
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