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Pretreatment method for photoresist wafer processing

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
  • H01L-021/02
  • H01J-037/32
  • C25D-005/48
  • C25D-005/02
  • C25D-005/34
  • C25D-007/12
  • H01L-021/027
  • H01L-021/67
  • H01L-021/768
  • G03F-007/42
출원번호 US-0264262 (2016-09-13)
등록번호 US-9607822 (2017-03-28)
발명자 / 주소
  • Buckalew, Bryan L.
  • Rea, Mark L.
출원인 / 주소
  • Lam Research Corporation
대리인 / 주소
    Weaver Austin Villeneuve & Sampson LLP
인용정보 피인용 횟수 : 2  인용 특허 : 57

초록

Certain embodiments herein relate to methods and apparatus for processing a partially fabricated semiconductor substrate in a remote plasma environment. The methods may be performed in the context of wafer level packaging (WLP) processes. The methods may include exposing the substrate to a reducing

대표청구항

1. A method of removing photoresist scum and electroplating metal into photoresist features, the method comprising: (a) receiving a substrate in a multi-tool electroplating apparatus, the multi-tool electroplating apparatus comprising: (i) at least one plasma treatment module comprising a plasma tre

이 특허에 인용된 특허 (57)

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  45. Fair, James A.; Havemann, Robert H.; Sung, Jungwan; Taylor, Nerissa; Lee, Sang-Hyeob; Plano, Mary Anne, Selective refractory metal and nitride capping.
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  48. Toshima, Takayuki; Omori, Tsutae; Yamashita, Masami, Silylation treatment unit and method.
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  50. Yu, Jengyi; Wong, Ka Shun; Jain, Sanjeev; Nag, Somnath; Fu, Haiying; Gupta, Atul; Van Schravendijk, Bart J., Systems and methods to retard copper diffusion and improve film adhesion for a dielectric barrier on copper.
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  52. Fair, James A., Thin layer metal chemical vapor deposition.
  53. Gage, Christopher; Chua, Lee Peng, Transferring heat in loadlocks.
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  55. Reid, Jonathan; Park, Seyang; Varadarajan, Seshasayee; Doubina, Natalia, Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers.
  56. van Schravendijk, Bart; Crew, William, UV treatment for carbon-containing low-k dielectric repair in semiconductor processing.
  57. van Schravendijk, Bart; Denisse, Christian, UV treatment of etch stop and hard mask films for selectivity and hermeticity enhancement.

이 특허를 인용한 특허 (2)

  1. Kondo, Hiroshi, Heater block having continuous concavity.
  2. Spurlin, Tighe A.; Antonelli, George Andrew; Doubina, Natalia; Duncan, James E.; Reid, Jonathan D.; Porter, David, Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer.
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