Systems and methods of thermal transfer and/or storage
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F28D-015/00
F28D-015/02
C09K-005/06
C09K-005/10
C09K-005/12
F01K-003/00
F24H-007/04
F28D-020/00
F28D-020/02
출원번호
US-0885411
(2010-09-17)
등록번호
US-9612059
(2017-04-04)
발명자
/ 주소
Xiang, XiaoDong
Zhang, Rong
출원인 / 주소
Bluelagoon Technologies Ltd.
대리인 / 주소
Hunter, Tom
인용정보
피인용 횟수 :
0인용 특허 :
19
초록▼
Systems, methods, and computer-implemented embodiments consistent with the inventions herein are directed to storing and/or transferring heat. In one exemplary implementation, there is provided a system for transferring/storing heat comprised of a heat exchange/storage apparatus including a chamber,
Systems, methods, and computer-implemented embodiments consistent with the inventions herein are directed to storing and/or transferring heat. In one exemplary implementation, there is provided a system for transferring/storing heat comprised of a heat exchange/storage apparatus including a chamber, and a heat input device adapted to heat/provide a vapor into the chamber. Other exemplary implementations may include one or more features consistent with a heat output device through which a working medium/fluid passes, a thermal storage medium located within the chamber, and/or a heat exchange system that delivers a heat exchange medium/fluid to the thermal storage medium.
대표청구항▼
1. A system for transferring and storing heat comprising: a first heat exchange and storage apparatus including:a first closed chamber;a heat output device, through which a working medium passes, having heat output device surfaces that pass through and are exposed within the first closed chamber;a h
1. A system for transferring and storing heat comprising: a first heat exchange and storage apparatus including:a first closed chamber;a heat output device, through which a working medium passes, having heat output device surfaces that pass through and are exposed within the first closed chamber;a heat input device that carries a heat transfer fluid (HTF) from a heat source or collector external to said first closed chamber and injects a vapor form of the heat transfer fluid through a valve into the first closed chamber;a thermal storage medium located within the first closed chamber and having defined thermal storage surfaces, wherein said thermal storage medium comprises a solid-liquid phase change material;a heat exchange system configured to deliver a heat exchange medium from a storage reservoir external to said first closed chamber to the thermal storage surfaces inside said first closed chamber;wherein, during thermal storage, the first heat exchange and storage apparatus is configured to contact the vapor form of the HTF produced by said heat source or collector with the thermal storage surfaces and condense the HTF on said thermal storage surfaces delivering latent heat from the vapor form to the thermal storage medium via phase change from vapor to liquid HTF and to recirculate the liquid HTF back to the heat source or collector where said HTF is converted back to a vapor form; andwherein, during thermal release, the first heat exchange and storage apparatus is configured to deliver a liquid phase heat exchange medium from said storage reservoir to the thermal storage surfaces which convert the heat exchange medium to a vapor phase that contacts the surfaces of said heat output device that are exposed within the first closed chamber and heats the working medium in said heat output device while condensing back to a liquid phase heat exchange medium and to recirculate said liquid heat exchange medium back to said storage reservoir. 2. The system of claim 1 wherein the thermal storage medium comprises a high temperature solid-liquid phase change material. 3. The system of claim 2, wherein the high temperature solid-liquid phase change material comprises a material selected from the group consisting of MnCl2+NaCl+KCl, LiCO3+K2CO3+NaCO3, MgCL2+KCl+NaCl, MgCL2+KCl+NaCl, KCl+MnCl2+NaCl, MgCL2+NaCl+KCl, KOH, NaOH+NaCl, KCl+MnCL2+NaCl, KCl+FeCL2, KNO3, NaOH+NaCl+Na2CO3, NaOH, KNO3+KCl, NaNO3+Na2CO3, NaNO3, NaNO3+NaF, NaCl+NaNO3, NaOH+NaCl+Na2CO3, NaCl+NaNO3, NaNO3+Na2SO4, NaNO3+Na2SO4, NaOH+NaNO4, NaOH+NaCl+Na2CO3, NaCl+NaF+NaNO3, NaNO3+NaCl+Na2SO4, Na2CO3+NaOH, NaOH+NaCl+Na2CO3, NO3+NaOH, KCl+ZnCl2, NaNO3+NaOH, NaNO3+NaOH, NaNO3+NaOH, NaOH+NaCl+NaNO3, NaNO3+NaCl+NaOH, NaOH+NaNO3, and NaOH+NaNO3. 4. The system of claim 1 wherein the thermal storage medium comprises a low temperature solid-liquid phase change material. 5. The system of claim 4 wherein the low temperature solid-liquid phase-change material is a hydrous salt, a paraffin, or a fatty acid. 6. The system of claim 4 wherein the low temperature solid-liquid phase change material is selected from the group of LiNO3*3H2O, Na2SO4*10H2O, Na2CO3*10H2O, Na2HPO4*10H2O, Na2S2O3*5H2O, Na(CH3COO)*3H2O, Na2P2O4*10H2O, 50% Na(CH3COO)*3H2O+50% HCONH2, Ba(OH)2i*8H2O, lauric acid, tetradecanoic acid, cetylic acid, and stearic acid. 7. The system of claim 1 wherein the heat transfer fluid is selected from the group of water, synthetic oil, ionic fluid, or molten salt. 8. The system of claim 1 wherein the heat transfer fluid is a high-boiling substance. 9. The system of claim 8 wherein the high-boiling substance is selected from the group of N-Octadecane, N-Pentadecylcyclopentane, and 1-Eicosanol. 10. The system of claim 1 wherein the heat transfer fluid is a low-boiling substance. 11. The system of claim 10 wherein the low-boiling substance is selected from the group of chloroform, methanol, acetyl chloride, cyclopentane, propionaldehyde, n-propyl amine, and 2,3-dimethyl-1-butene. 12. The system of claim 1 wherein the heat transfer fluid is a mid-boiling substance. 13. The system of claim 12 wherein the mid-boiling substance is selected from the group consisting of O-ethylphenol, ethyl benzoate, 1,2,3,4-tetrahydronaphthalene n-hexylcyclopentane, 1-dodecene, and VP-1 heat transfer oil. 14. The system of claim 1 further comprising: a second heat exchange and storage apparatus including:a second closed chamber coupled to the first closed chamber, wherein the heat transfer fluid is transferred to the second closed chamber prior to being recirculated back to the heat source or collector;a second heat output device, through which a working medium/fluid passes, having heat output device surfaces that pass through and are exposed within the second closed chamber;a second thermal storage medium located within the second closed chamber and having second defined thermal storage surfaces;wherein the vapor form of the HTF contacts the second thermal storage surfaces and condenses thereon, delivering latent heat from the vapor form to the thermal storage medium via phase change from vapor to liquid;wherein the heat transfer fluid that is condensed into liquid form in the second closed chamber is recirculated out of the second closed chamber back to the heat source or collector; anda second heat exchange system that delivers a heat exchange medium/fluid to the thermal storage surfaces. 15. The system of claim 14 further comprising a third heat exchange and storage apparatus. 16. The system of claim 14 wherein the thermal storage medium comprises a first solid-liquid phase change material and the second thermal storage medium comprises a second solid-liquid phase change material. 17. The system of claim 16 wherein a melting point of the first solid-liquid phase change material is higher than a melting point of the second solid-liquid phase change material. 18. The system of claim 16 wherein a melting point of the first solid-liquid phase change material is the same as a melting point of the second solid-liquid phase change material. 19. The system of claim 1 wherein the working medium is water or ammonia. 20. The system of claim 1, wherein the thermal storage medium comprises a plurality of secondary containers each containing the solid-liquid phase change material. 21. The system of claim 20 wherein the plurality of secondary containers are positioned on a set of layered shelves with voids among the plurality of secondary containers. 22. The system of claim 21 wherein the heat exchange system further comprises a channel from a bottom of the first closed chamber to a top of the first closed chamber, such that the channel allows the heat exchange medium to travel to the top of the plurality of secondary containers without passing through the voids when the heat exchange medium is vaporized. 23. The system of claim 22 wherein the heat exchange system further comprises a circulation pump in fluid communication with a heat exchange medium reservoir. 24. The system of claim 23 wherein the heat exchange system further comprises a liquid spread device disposed at the top of the chamber. 25. The system of claim 24 wherein the liquid spread device receives heat exchange medium from the reservoir by way of the circulation pump, and the liquid spread device spreads the heat exchange medium onto high temperature surfaces of the plurality of secondary containers, thereby vaporizing the heat exchange medium. 26. The system of claim 25 wherein the heat exchange medium transfers latent heat from the vaporized heat exchange medium to the working medium by condensation on the heat output device surface at the top of the first closed chamber. 27. The system of claim 26 wherein the circulation pump is further in fluid communication with the bottom of the chamber, such that condensing heat exchange medium drops to the bottom of the chamber and is circulated to the top of the chamber by the circulation pump. 28. The system of claim 1, wherein the working medium is water. 29. The system of claim 1, wherein the heat exchange medium is the same material as the heat transfer fluid. 30. The system of claim 1, wherein the heat exchange medium is the same material type as the working medium. 31. The system of claim 1, wherein the heat exchange system that delivers the heat exchange medium to the thermal storage surfaces is a showering system that continuously supplies a liquid phase portion of the heat exchange medium to the thermal storage surfaces, and transfers heat to the working medium. 32. The system of claim 1 wherein the heat exchange system operates to deliver heat to the working medium when there is no heat transfer fluid transferring into the heat input device. 33. The system of claim 1 wherein the heat exchange and storage apparatus further comprises an inert gas pressure regulator coupled to the first closed chamber. 34. The system of claim 1 wherein the heat exchange and storage apparatus further comprises a reservoir and a circulating pump coupled to the chamber. 35. The system of claim 26 wherein the temperature in the first closed chamber is controlled using an inert gas pressure regulator in conjunction with a flow rate control that controls the reservoir, the circulating pump, and the pressure regulator to maintain a chamber vapor pressure and a chamber temperature for a target liquid phase volume for constant heat exchange. 36. The system of claim 1 wherein the thermal storage surfaces are made with an elastic metal shell so that when solid phase material changes to liquid phase materials, the elastic metal shell adapts to volume changes of the thermal storage medium. 37. The system of claim 36, wherein the thermal storage surfaces comprise grooves on the elastic metal shell that further accommodate volume changes. 38. The system of claim 1, wherein the thermal storage medium includes solid-to-liquid phase change material in containers. 39. A method of transferring and storing heat comprising: providing the first heat exchange and storage apparatus according to claim 1, and:operating said first heat exchange and storage apparatus during thermal storage to contact the vapor form of the HTF produced by said heat source or collector with the thermal storage surfaces and condense the HTF on said thermal storage surfaces delivering latent heat from the vapor form to the thermal storage medium via phase change from vapor to liquid HTF and to recirculate the liquid HTF back to the heat source or collector where said HTF is converted back to a vapor form; oroperating said first heat exchange and storage apparatus during thermal release to deliver a liquid phase heat exchange medium from said storage reservoir to the thermal storage surfaces and convert the heat exchange medium to a vapor phase that contacts the surfaces of said heat output device that are exposed within the first closed chamber and heat the working medium in said heat output device while condensing back to a liquid phase heat exchange medium and to recirculate said liquid heat exchange medium back to said storage reservoir. 40. The method of claim 39, wherein the heat transfer fluid is VP-1, wherein the VP-1 material is heated to about 400 degrees Celsius by the heat source or collector, and the chamber is maintained at a temperature of about 380 degrees Celsius. 41. The method of claim 39 further comprising: controlling a temperature of the first closed chamber, a pressure of the first closed chamber, or both the temperature and pressure of the first closed chamber to cause the vapor phase heat transfer fluid to condense and thereby transfer latent heat of the vapor phase heat transfer fluid to the thermal storage material.
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