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An apparatus includes a contact grid array disposed on a substrate in a non-orthogonal row-column format with connection elements arranged in a hexagonal configuration. The contact grid array has an orientation based, at least in part, on an area available for the contact grid array on the substrate

An apparatus includes a contact grid array disposed on a substrate in a non-orthogonal row-column format with connection elements arranged in a hexagonal configuration. The contact grid array has an orientation based, at least in part, on an area available for the contact grid array on the substrate. A method to determine the orientation of the contact grid array includes identifying the area available for a contact grid array on a substrate and determining the orientation for the contact grid array based, at least in part, on the area available for the contact grid array on the substrate.

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1. A method comprising: identifying, with a processing device, an area available for a contact grid array on a substrate;determining, with the processing device, an orientation for the contact grid array including a non-orthogonal row-column format with multiple connection elements arranged in a hex

1. A method comprising: identifying, with a processing device, an area available for a contact grid array on a substrate;determining, with the processing device, an orientation for the contact grid array including a non-orthogonal row-column format with multiple connection elements arranged in a hexagonal configuration, wherein the determined orientation includes at least a rotational orientation which is determined based, at least in part, on the area available for the contact grid array on the substrate and a required number of the connection elements in the area available; andimplementing the determined orientation on the contact grid array. 2. The method of claim 1, wherein determining the orientation for the contact grid array further comprises determining, with the processing device, an arrangement of connection elements on edges of the area available for the contact grid array on the substrate based, at least in part, on dimensions of the area available for the contact grid array on the substrate and a number of connection elements in the contact grid array. 3. The method of claim 1, wherein a distance between rows is different than a distance between columns of the contact grid array, and wherein determining the rotational orientation of the contact grid array is further based on the dimensions of the area available for the contact grid array with respect to the distance between rows and the distance between columns of the contact grid array. 4. The method of claim 3, wherein the distance between the rows and the distance between the columns are both less than a preset distance between the connection elements. 5. The method of claim 1, wherein the orientation of the contact grid array is based, at least in part, on a distance of the connection elements from a center of the area available for the contact grid array on the substrate. 6. The method of claim 1, further comprising determining, with the processing device, locations for routing traces between the connection elements to electrically couple circuitry disposed on the substrate to the contact grid array, wherein determining the orientation for the contact grid array is based, at least in part, on the locations for the routing traces. 7. The method of claim 6, wherein the routing traces include at least one of a signaling trace, a power trace, or a ground trace. 8. An apparatus, including: a contact grid array; anda memory device storing instructions configured to cause a processing device to perform operations comprising:identifying an area available for the contact grid array on a substrate; anddetermining an orientation for the contact grid array having a non-orthogonal row-column format with multiple connection elements arranged in a hexagonal configuration wherein the determined orientation includes at least a rotational orientation which is determined based, at least in part, on the area available for the contact grid array on the substrate and a required and a required of the connection elements in the area available. 9. The apparatus of claim 8, wherein determining the orientation for the contact grid array further comprises determining an arrangement of connection elements on edges of the area available for the contact grid array on the substrate based, at least in part, on dimensions of the area available for the contact grid array on the substrate and a number of connection elements in the contact grid array. 10. The apparatus of claim 8, wherein a distance between rows is different than a distance between columns of the contact grid array, and wherein determining the rotational orientation of the contact grid array further based on the dimensions of the area available for the contact grid array with respect to the distance between rows and the distance between columns of the contact grid array. 11. The apparatus of claim 10, wherein the distance between the rows and the distance between the columns are both less than a preset distance between the connection elements. 12. The apparatus of claim 8, wherein the orientation of the contact grid array is based, at least in part, on a distance of the connection elements from a center of the area available for the contact grid array on the substrate. 13. The apparatus of claim 8, wherein the instructions are configured to cause the processing device to perform operations further comprising determining locations for routing traces between the connection elements to electrically couple circuitry disposed on the substrate to the grid ball array, wherein determining the orientation for the contact grid array is based, at least in part, on the locations for the routing traces. 14. An apparatus comprising: a contact grid array disposed on a substrate in a non-orthogonal row-column format with connection elements arranged in a hexagonal configuration, wherein the contact grid array has an orientation which at least includes a rotational orientation, and wherein the rotational orientation is determined based, at least in part, on an area available for the contact grid array on the substrate and a required number of the connection elements in the area available. 15. The apparatus of claim 14, wherein the orientation of the contact grid array includes an arrangement of connection elements on edges of the area available for the contact grid array on the substrate that is based, at least in part, on dimensions of the area available for the contact grid array on the substrate and a number of connection elements in the contact grid array. 16. The apparatus of claim 14, wherein a distance between rows is different than a distance between columns of the contact grid array, and wherein a rotational orientation of the contact grid array is further determined based on the dimensions of the area available for the contact grid array with respect to the distance between rows and the distance between columns of the contact grid array. 17. The apparatus of claim 16, wherein the distance between the rows and the distance between the columns are both less than a preset distance between the connection elements. 18. The apparatus of claim 14, wherein the orientation of the contact grid array is based, at least in part, on a distance of the connection elements from a center of the area available for the contact grid array on the substrate. 19. The apparatus of claim 14, further comprising routing traces located between the connection elements and configured to electrically couple circuitry disposed on the substrate to the grid ball array. 20. The apparatus of claim 19, wherein the routing traces include at least one of a signaling trace, a power trace, or a ground trace.