Thermodynamic system including a heat transfer system having an evaporator and a condenser
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F25B-009/00
F28D-015/04
출원번호
US-0366782
(2012-02-06)
등록번호
US-9631874
(2017-04-25)
발명자
/ 주소
Kroliczek, Edward J.
Nikitkin, Michael
Wolf, Sr., David A.
출원인 / 주소
Orbital ATK, Inc.
대리인 / 주소
TraskBritt
인용정보
피인용 횟수 :
0인용 특허 :
89
초록▼
A thermodynamic system includes a cyclical heat exchange system and a heat transfer system coupled to the cyclical heat exchange system to cool a portion of the cyclical heat exchange system. The heat transfer system includes an evaporator. The evaporator includes a wall configured to be coupled to
A thermodynamic system includes a cyclical heat exchange system and a heat transfer system coupled to the cyclical heat exchange system to cool a portion of the cyclical heat exchange system. The heat transfer system includes an evaporator. The evaporator includes a wall configured to be coupled to a portion of the cyclical heat exchange system and a primary wick coupled to the wall. The heat transfer system further includes a condenser coupled to the evaporator to form a closed loop that houses a working fluid.
대표청구항▼
1. A thermodynamic system, comprising: a heat transfer system, comprising: an evaporator, the evaporator comprising: a heated wall;a wick coupled to the heated wall;a liquid barrier wall, wherein the wick is positioned between the heated wall and the liquid barrier wall and wherein the heated wall a
1. A thermodynamic system, comprising: a heat transfer system, comprising: an evaporator, the evaporator comprising: a heated wall;a wick coupled to the heated wall;a liquid barrier wall, wherein the wick is positioned between the heated wall and the liquid barrier wall and wherein the heated wall and the liquid barrier wall are configured to contain a working fluid between the heated wall and the liquid barrier wall;at least one vapor removal channel located at an interface between the wick and the heated wall, the at least one vapor removal channel extending to a vapor outlet;at least one liquid flow channel located between the liquid barrier wall and the wick, the at least one liquid flow channel for receiving liquid from a liquid inlet; anda condenser coupled to the evaporator to form a closed loop that houses a working fluid; anda cyclical heat exchange system, wherein the heat transfer system is thermally coupled by the heated wall to the cyclical heat exchange system to cool a portion of the cyclical heat exchange system. 2. The thermodynamic system of claim 1, wherein the condenser comprises a vapor inlet and a liquid outlet and the evaporator comprises a liquid inlet and a vapor outlet. 3. The thermodynamic system of claim 2, further comprising: a vapor line providing fluid communication between the vapor outlet of the evaporator and the vapor inlet of the condenser; anda liquid return line providing fluid communication between the liquid outlet of the condenser and the liquid inlet of the evaporator. 4. The thermodynamic system of claim 3, further comprising an additional evaporator coupled to the vapor line. 5. The thermodynamic system of claim 4, wherein the wick is configured to move the working fluid through the heat transfer system. 6. The thermodynamic system of claim 1, wherein the heat transfer system is configured to move the working fluid through the heat transfer system passively. 7. The thermodynamic system of claim 6, wherein the heat transfer system is configured to move the working fluid through the heat transfer system without the use a pump. 8. The thermodynamic system of claim 1, further comprising a reservoir in fluid communication with at least one of the at least one liquid flow channel and the at least one vapor removal channel, wherein the thermodynamic system is configured to vent at least one vapor bubble from the at least one of the at least one liquid flow channel and the at least one vapor removal channel into the reservoir. 9. The thermodynamic system of claim 8, wherein the reservoir is formed in a portion of the evaporator above the wick. 10. The thermodynamic system of claim 1, further comprising fins coupled to the condenser. 11. The thermodynamic system of claim 1, wherein the wick, the heated wall, and the liquid barrier wall of the evaporator are annular. 12. The thermodynamic system of claim 1, wherein the wick, the heated wall, and the liquid barrier wall of the evaporator are substantially coplanar. 13. The thermodynamic system of claim 1, wherein the evaporator is integral with the cyclical heat exchange system. 14. The thermodynamic system of claim 1, wherein the cyclical heat exchange system includes a Stirling heat exchange system. 15. The thermodynamic system of claim 1, wherein the cyclical heat exchange system includes a refrigeration system. 16. The thermodynamic system of claim 1, wherein the heat transfer system is coupled to one of a hot side of the cyclical heat exchange system and a cold side of the cyclical heat exchange system. 17. A thermodynamic system, comprising: a heat transfer system, comprising: an evaporator, the evaporator comprising: a heated wall;a wick coupled to the heated wall;a liquid barrier wall, wherein the wick is positioned between the heated wall and the liquid barrier wall and wherein the heated wall and the liquid barrier wall are configured to contain a working fluid between the heated wall and the liquid barrier wall;at least one vapor removal channel located at an interface between the wick and the heated wall, the at least one vapor removal channel extending to a vapor outlet; andat least one liquid flow channel located between the liquid barrier wall and the wick, the at least one liquid flow channel for receiving liquid from a liquid inlet;a condenser coupled to the evaporator to form a closed loop that houses a working fluid; anda cryocooler thermally coupled to the condenser. 18. A thermodynamic system, comprising: a heat transfer system, comprising: an evaporator, the evaporator comprising: a heated wall for receiving heat from a heat source;a liquid barrier wall adjacent the heated wall, the liquid barrier wall and the heated wall being configured to contain working fluid between the heated wall and the liquid barrier wall;a wick positioned between the heated wall and the liquid barrier wall, wherein the heated wall is positioned inside the wick and the wick is positioned inside the liquid barrier wall;at least one vapor removal channel located at an interface between the wick and the heated wall; andat least one liquid flow channel located between the liquid barrier wall and the wick; anda condenser coupled to the evaporator to form a closed loop that houses a working fluid. 19. The thermodynamic system of claim 18, wherein the wick, the heated wall, and the liquid barrier wall are substantially coplanar. 20. The thermodynamic system of claim 18, wherein the wick has a thermal conductivity configured to prevent the formation of vapor bubbles in the at least one liquid flow channel caused by leakage of heat from the heated wall, through the wick, toward the liquid barrier wall. 21. The thermodynamic system of claim 18, wherein the heated wall is defined so as to accommodate the at least one vapor removal channel. 22. The thermodynamic system of claim 18, wherein the interface between the wick and the heated wall is defined to accommodate the at least one vapor removal channel. 23. The thermodynamic system of claim 18, wherein a cross section of the at least one vapor removal channel is sufficient to maintain a pressure difference between the at least one vapor removal channel and the at least one liquid flow channel across the wick. 24. The thermodynamic system of claim 18, wherein the heated wall directly contacts the wick. 25. The thermodynamic system of claim 18, wherein a thickness of the heated wall is configured to provide complete vaporization at the interface between the wick and the heated wall. 26. The thermodynamic system of claim 18, wherein the at least one liquid flow channel is operably coupled to supply the wick with liquid from a liquid inlet. 27. The thermodynamic system of claim 26, wherein the at least one liquid flow channel is configured to supply the wick with enough liquid to offset liquid vaporized at the interface between the wick and the heated wall and liquid vaporized at the liquid barrier wall. 28. The thermodynamic system of claim 18, wherein the wick, the heated wall, and the liquid barrier wall are annular and coaxial such that the heated wall is inside the wick and the wick is inside the liquid barrier wall. 29. The thermodynamic system of claim 18, wherein the evaporator comprises an opening configured to sweep at least one vapor bubble formed within at least one of the at least one vapor removal channel and the at least one liquid flow channel from the at least one of the at least one vapor removal channel and the at least one liquid flow channel and into the opening.
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