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A method for manufacturing an SOI substrate in which crystal defects of a single crystal semiconductor layer are reduced even if a single crystal semiconductor substrate including crystal defects is used. A first oxide film is formed on a single crystal semiconductor substrate; the first oxide film

A method for manufacturing an SOI substrate in which crystal defects of a single crystal semiconductor layer are reduced even if a single crystal semiconductor substrate including crystal defects is used. A first oxide film is formed on a single crystal semiconductor substrate; the first oxide film is removed; a surface of the single crystal semiconductor substrate from which the first oxide film is removed is irradiated with laser light; a second oxide film is formed on the single crystal semiconductor substrate; an embrittled region is formed in the single crystal semiconductor substrate by irradiating the single crystal semiconductor substrate with ions through the second oxide film; bonding the second oxide film and the semiconductor substrate so as to face each other; and the single crystal semiconductor substrate is separated at the embrittled region by heat treatment to obtain a single crystal semiconductor layer bonded to the semiconductor substrate.

대표청구항 ▼

1. A method for manufacturing a semiconductor device comprising the steps of: forming a first oxide film on a surface of a first semiconductor substrate by performing thermal oxidation treatment on the first semiconductor substrate;forming a second oxide film over the first oxide film on the first s

1. A method for manufacturing a semiconductor device comprising the steps of: forming a first oxide film on a surface of a first semiconductor substrate by performing thermal oxidation treatment on the first semiconductor substrate;forming a second oxide film over the first oxide film on the first semiconductor substrate by a chemical vapor deposition method with use of TEOS gas;forming an embrittled region in the first semiconductor substrate by irradiating the first semiconductor substrate with hydrogen ions through the first oxide film and the second oxide film;forming a third oxide film on a surface of a second semiconductor substrate by performing thermal oxidation treatment on the second semiconductor substrate; andbonding the second semiconductor substrate and the first semiconductor substrate so as to face each other with the first oxide film, the second oxide film and the third oxide film interposed therebetween,wherein a first surface of the second oxide film is in contact with the first oxide film,wherein a second surface of the second oxide film is in contact with the third oxide film,wherein the second surface is an opposite side of the first surface,wherein the hydrogen ions include H+, H2+ and H3+, andwherein the proportion of H3+ in the hydrogen ions is higher or equal to 50%. 2. The method for manufacturing a semiconductor device according to claim 1, wherein the first oxide film contains silicon oxide as its main component. 3. The method for manufacturing a semiconductor device according to claim 1, wherein the thermal oxidation treatment is a thermal oxidation in an atmosphere containing chlorine. 4. The method for manufacturing a semiconductor device according to claim 1, wherein the second semiconductor substrate is one selected from the group consisting of a single crystal silicon substrate, a polycrystalline silicon substrate, and a solar grade silicon substrate. 5. A method for manufacturing a semiconductor device, comprising the steps of: forming a first oxide film on a surface of a first semiconductor substrate by performing thermal oxidation treatment on the first semiconductor substrate;forming a second oxide film over the first oxide film on the first semiconductor substrate by a chemical vapor deposition method with use of TEOS gas;forming an embrittled region in the first semiconductor substrate by irradiating the first semiconductor substrate with hydrogen ions through the first oxide film and the second oxide film;forming a third oxide film on a surface of a second semiconductor substrate by performing thermal oxidation treatment on the second semiconductor substrate; andbonding the second semiconductor substrate and the first semiconductor substrate so as to face each other with the first oxide film, the second oxide film and the third oxide film interposed therebetween,wherein a first surface of the second oxide film is in contact with the first oxide film,wherein a second surface of the second oxide film is in contact with the third oxide film,wherein the second surface is an opposite side of the first surface,wherein the hydrogen ions include H+, H2+ and H3+,wherein the proportion of H3+ in the hydrogen is higher or equal to 50%, andwherein a thickness of the third oxide film is greater than or equal to 10 nm to smaller than or equal to 1000 nm. 6. The method for manufacturing a semiconductor device according to claim 5, wherein the first oxide film contains silicon oxide as its main component. 7. The method for manufacturing a semiconductor device according to claim 5, wherein the thermal oxidation treatment is a thermal oxidation in an atmosphere containing chlorine. 8. The method for manufacturing a semiconductor device according to claim 5, wherein the second semiconductor substrate is one selected from the group consisting of a single crystal silicon substrate, a polycrystalline silicon substrate, and a solar grade silicon substrate.