이 특허에 인용된 특허 (64)

1. Takamoto,Naohide; Misumi,Sadahito; Matsumura,Takeshi; Amano,Yasuhiro, Adhesive film material for use in manufacturing semiconductors.

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2. Hasegawa Masaaki (No. 49-20 ; Higashi Mukojima 2 Sumida-ku ; Tokyo JPX), Adhesive sheet and method for manufacturing the same.

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3. Adam Brian D. (Sioux City IA) Adam Courtney L. (Sioux City IA), Air conditioner support.

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4. Sharma, Rajat; Felker, Andrew; Houck, William D., Array of triangular semiconductor dice.

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5. Sharma, Rajat; Felker, Andrew; Houck, William D., Array of triangular semiconductor dies.

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6. Fang, Luocheng, Big dot pattern wiper.

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7. O'Moore, Fergal; Schultz, Steve; Severson, Brian, CMP apparatuses with polishing assemblies that provide for the passive removal of slurry.

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8. Phan Dean Van ; Trokhan Paul Dennis, Cellulosic fibrous structures having at least three regions distinguished by intensive properties.

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9. Brown, Colin W.; Francis, Edward, Cleaning sheet with particle retaining cavities.

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10. McKnight, David A., Cloth.

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11. Hamilton Peter W. (Cincinnati OH) McGuire Kenneth S. (Wyoming OH), Composite material releasably sealable to a target surface when pressed thereagainst and method of making.

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12. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.

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13. Kuriki, Tadashi, Conductive sheet.

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14. Robert C. Kerr ; William O. Burke, lll, Cushioned rubber floor mat article comprising at least one integrated rubber protrusion and at least two layers of rubber.

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15. Saito Kazuo,JPX ; Mochizuki Yasushi,JPX ; Yamamoto Seiji,JPX, Dummy wafer.

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16. Yasaka Tatsuhiro,JPX ; Nishizawa Takashi,JPX ; Muramatsu Kazuo,JPX ; Watanabe Tsutomu,JPX, Dummy wafer.

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17. Feigenbaum Haim (Highland Park NJ) Pudick Sheldon (Sayreville NJ) Singh Rajindar (Ridgewood NJ), Edge seal for a porous gas distribution plate of a fuel cell.

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18. Cheng, Chiu-Fu, Fabric with decorative pattern.

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19. Suzuki, Akihito; Kerr, Robert C.; Streeton, Amy K., Flashless rubber floor mat and method.

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20. Sneed, Brett A., Floor covering.

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21. Teherani, Hadi, Floor covering with dot pattern.

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22. Blackford, Michael E., Heat reflective lining material.

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23. Bolt William S. (1010 Cuyahoga Dr. Bartlett IL 60103), Holding pallet for PC boards.

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24. Bolt William S. (1010 Cuyahoga Dr. Bartlett IL 60103), Holding pallet for PC boards.

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25. Lin Chii-Hsiung,TWX, Laminated ornamental glass.

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26. Howe, Leslie, Light fixture lens with elevated strip features.

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27. Kazanchian, Armen E., Module.

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28. Nygard James C. (Maplewood MN) Thompson Dorman N. (Woodbury MN) Aadland Lynette M. (Lakeville MN), Mounting laminate having recessed adhesive areas.

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29. Wong,Arthur; Flora,Jeffrey Lawrence, Multi-layer substrate for a premoistened wipe capable of controlled fluid release.

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30. Kauschke, Michael; Turi, Mordechai, Nonwoven with non-symmetrical bonding configuration.

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31. Sip, Kim-Yeung; Chu, Yung-Hung; Tang, Yu-Hao, PCB for arranging LED lights.

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32. McKnight, David A., Pad.

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33. Petsch, Carsten, Pad arrangement of a circuit module.

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34. Malik Mark ; Moshiri Mehrad, Personal identification number card.

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35. Huang, Shiuh Jer; He, Guang Ling; Lin, Shu Yi, Polishing apparatus and pad replacing method thereof.

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36. Li,Yicheng, Processing chamber for manufacturing semiconductors.

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37. Breault Richard D. (Coventry CT) Goller Glen J. (West Springfield MA), Ribbed electrode substrates.

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38. Shinkai, Jiro, Semiconductor device.

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39. Higashibata,Kazuaki, Semiconductor module.

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40. Nishiguchi, Taro; Sasaki, Makoto; Harada, Shin; Fujiwara, Shinsuke; Namikawa, Yasuo, Semiconductor substrate.

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41. Nishiguchi, Taro; Sasaki, Makoto; Harada, Shin; Fujiwara, Shinsuke; Namikawa, Yasuo, Semiconductor substrate.

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42. Nishiguchi, Taro; Sasaki, Makoto; Harada, Shin; Fujiwara, Shinsuke; Namikawa, Yasuo, Semiconductor substrate.

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43. Flynn, Greg; Richards, Benjamin C., Semiconductor wafer with dicing positions for solar cell fabrication.

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44. Lee, Ji-Yoon, Sheet for vehicle seats.

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45. Lee, Ji-Yoon, Sheet for vehicle seats.

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46. Nakamura,Akihiko; Miyanari,Atsushi; Inao,Yoshihiro, Supporting plate.

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47. Nakamura,Akihiko; Miyanari,Atsushi; Inao,Yoshihiro, Supporting plate.

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48. Remi Jean-Pierre (Bron FRX) Gehin Guy (Bron FRX), Thermally insulating slabs made of refractory fibers for the insulation of furnaces and the like.

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49. Johnston,Nik L.; Bardeen,John P., Two-dimensional sheet material.

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50. Nagasaka, Munetoshi; Ogasawara, Ikuo; Shinohara, Eiichi, Wafer attracting plate.

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51. Chang, Chung-Ying; Yang, Tzu-Ching, Wafer carrier.

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52. Chang, Chung-Ying; Yang, Tzu-Ching; Chang, Chia-Sheng, Wafer carrier.

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53. Gurary, Alexander I.; Moy, Keng; Chang, Chenghung Paul, Wafer carrier having pockets.

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54. Gurary, Alexander I.; Moy, Keng; Chang, Chenghung Paul, Wafer carrier having pockets.

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55. Gurary, Alexander I.; Moy, Keng; Chang, Paul, Wafer carrier having pockets.

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56. Krishnan, Sandeep; Moy, Keng, Wafer carrier having pockets.

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57. Yoshida,Shinji; Nagai,Osamu, Wafer grinding method.

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58. Morisaki, Eisuke; Machiyama, Wataru; Kobayashi, Hirokatsu; Harashima, Masayuki; Sano, Yukio, Wafer holder for manufacturing semiconductor.

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59. Tamaso, Hideto, Wafer holder for stepper.

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60. Nguyen, Phuong Van, Wafer polishing pad holder.

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61. Karasawa Wataru (Yokohama JPX), Wafer probe plate holder.

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62. Sibley Thomas (5439 McCommas Dallas TX 75206), Wafer support fixtures for rapid thermal processing.

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63. Kleman Mark R. ; Merckx Kathleen A. ; Stielow Richard C., Watermark on a paper.

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64. Shields Rodney M., Window painting apparatus and method.

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