$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Apparatus for cooling a computer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
  • G06F-001/20
출원번호 US-0945755 (2013-07-18)
등록번호 US-9639126 (2017-05-02)
발명자 / 주소
  • Senyk, Borys S.
  • Moresco, Larry L.
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman LLP
인용정보 피인용 횟수 : 3  인용 특허 : 74

초록

An apparatus including a tube to encase a fluid, a first portion of the tube disposed in a base portion of a mobile computing device, a second portion of the tube disposed in a display portion of the mobile computing device, the second portion of the tube including metal and a pump coupled to the tu

대표청구항

1. An apparatus, comprising: a tube to encase a fluid, a first portion of the tube disposed in a base portion of a mobile computing device, a second portion of the tube disposed in a display portion of the mobile computing device, wherein the second portion of the tube is comprised of a metal;a pump

이 특허에 인용된 특허 (74)

  1. Bhatia Rakesh, Airflow heat exchanger for a portable computing device and docking station.
  2. Bhatia Rakesh, Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station.
  3. Broder Damon ; Hood ; III Charles D., Apparatus for cooling a heat generating component in a computer.
  4. Tsuji Hiroyuki,JPX ; Kato Keiichi,JPX, Apparatus for radiating heat for use in computer system.
  5. Cipolla Thomas Mario ; Mok Lawrence Shungwei, Arrangement and method for transferring heat from a portable personal computer.
  6. Chien Chuan-Fu,TWX, CPU cooling system.
  7. Phillips Richard J. (Alachua FL) Larson Ralph I. (Bolton MA), Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in sec.
  8. Macias Jose Javier ; Silva Rogelio Hernandez, Computer enclosure cooling unit.
  9. Montgomery, Stephen W.; Faneuf, Barrett M., Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface component.
  10. Mizuno Tsukasa (Tokyo JPX), Cooling abnormality detection system for electronic equipment.
  11. Goto Kazuhiko,JPX ; Mashiko Koichi,JPX ; Saito Yuji,JPX ; Nguyen Thang Toan,JPX ; Mochizuki Masataka,JPX ; Eguchi Katsuo,JPX ; Hasegawa Hitoshi,JPX, Cooling device for notebook personal computer.
  12. Fujisaki Akihiko (Kawasaki JPX) Katsumi Hideo (Kawasaki JPX), Cooling system for electronic device.
  13. O'Connor Michael ; Haley Kevin ; Bhatia Rakesh ; Adams Daniel Thomas ; Kast Michael Andrew, Cooling system for thin profile electronic and computer devices.
  14. Ohashi Shigeo,JPX ; Hatada Toshio,JPX ; Tanaka Shinji,JPX, Cooling unit for electronic equipment.
  15. Kikinis Dan (Saratoga CA) Dornier Pascal (Sunnyvale CA) Seiler William J. (Scotts Valley CA), Digital assistant system having a host computer with a docking bay and a moveable heat sink for cooling a docked module.
  16. Ueda, Akira; Suzuki, Masumi; Hirano, Minoru; Hamaguchi, Toyokazu; Hidesawa, Shigeru, Electronic apparatus having a heat dissipation member.
  17. Moore David A., Electronic apparatus with plug-in heat pipe module cooling system.
  18. Chiu George Liang-Tai ; Hougham Gareth Geoffrey ; Mok Lawrence Shungwei, Electronic component cooling using a heat transfer buffering capability.
  19. May Gregory J ; Sterner John R, Electronic device having external surface thermal feedback.
  20. Ohashi Shigeo (Tsuchiura JPX) Hatada Toshio (Tsuchiura JPX) Tanaka Takeo (Minori-machi JPX) Iwai Susumu (Hadano JPX), Electronic equipment and lap-top type electronic equipment.
  21. Christian L Belady, Field replaceable module with enhanced thermal interface.
  22. Altoz Frank E. (Catonsville MD), Flexible diaphragm cooling device for microwave antennas.
  23. Philpott, Michael I.; Shannon, Mark A.; Selby, John C., Flexible microchannel heat exchanger.
  24. Burward-Hoy Trevor (Cupertino CA), Heat exchanger for electronic equipment.
  25. Bhatia Rakesh, Heat exchanger system for cooling a hinged computing device.
  26. Cipolla Thomas Mario, Heat pipe arrangement for enhancing the cooling capacity of a laptop computer.
  27. Bhatia Rakesh (Sunnyvale CA) Haley Kevin (San Jose CA), Heat pipe exchanger system for cooling a hinged computing device.
  28. Bhatia Rakesh ; Haley Kevin, Heat pipe exchanger system for cooling a hinged computing device.
  29. Bhatia Rakesh, Heat pipe with pumping capabilities and use thereof in cooling a device.
  30. Ishida Yoshio (Osaka JPX), Heat radiating apparatus.
  31. Hood ; III Charles D. ; Liu Peter, Heat sink assembly with rotating heat pipe.
  32. Ohta Keiichiro,JPX ; Furukawa Yuichi,JPX, Heat sink device for electronic devices.
  33. Frankeny Richard F. (Elgin TX) Hermann Karl (Austin TX), Heat sink for utilization with high density integrated circuit substrates.
  34. Griffin Wayne L. (St. Joseph MI) Fuhs Eric D. (Stevensville MI) Kohtz Robert A. (St. Joseph MI) Ojeda Peter A. (St. Joseph MI), Heat-exchange panel for portable computer.
  35. Budelman Gerald A. (Aloha OR), High efficiency heat removal system for electric devices and the like.
  36. Fox Leslie (Boxboro MA) Wade Paul C. (Shirley MA), Hybird cooling system for electronic components.
  37. Atkinson Lee W., Increased processor performance comparable to a desktop computer from a docked portable computer.
  38. Kobayashi Takashi,JPX, Information processing apparatus and its heat spreading method.
  39. Chen Shiaw-Jong S. ; Hooey Roger J. ; Radke Robert E., Integrated active cooling device for board mounted electric components.
  40. Donahoe Daniel N. ; Gill Michael T., Liquid cooled computer apparatus and associated methods.
  41. Minamitani,Rintaro; Matsushita,Shinji, Liquid cooling system and an electronic apparatus applying the same therein.
  42. Minamitani, Rintaro; Ohashi, Shigeo; Naganawa, Takashi; Matsushita, Shinji; Oikawa, Hironori, Liquid cooling system and an electronic apparatus having the same therein.
  43. Minamitani, Rintaro; Kitano, Makoto; Ashiwake, Noriyuki; Ohashi, Shigeo; Kondo, Yoshihiro; Naganawa, Takashi; Yoshitomi, Yuji; Nakagawa, Tsuyoshi, Liquid cooling system and personal computer using thereof.
  44. Davis Alan Merle (Quincy IL) Blickhan Joseph David (Quincy IL), Liquid cooling system for high power solid state AM transmitter.
  45. Layton Wilbur T. (San Diego CA) Morange Blanquita O. (San Diego CA) Torres Angela M. (Vista CA), Liquid metal heat conducting member and integrated circuit package incorporating same.
  46. Booth Richard B. (Wappingers Falls) Grube Gary W. (Washingtonville) Gruber Peter A. (Mohegan Lake) Khandros Igor Y. (Peekskill) Zingher Arthur R. (White Plains NY), Liquid metal matrix thermal paste.
  47. Senyk, Borys S.; Moresco, Larry L., Method and an apparatus for cooling a computer.
  48. Senyk,Borys S.; Moresco,Larry L., Method and an apparatus for cooling a computer.
  49. Senyk,Borys S.; Moresco,Larry L., Method and an apparatus for cooling a computer.
  50. Young Bruce A. (Beaverton OR), Method and apparatus for reducing power consumption of a fan in a computer system.
  51. Noel, Thomas P., Method and thermally active convection apparatus and method for abstracting heat with circulation intermediate three dimensional-parity heat transfer elements in bi-phase heat exchanging composition.
  52. Komatsu, Atsushi; Okano, Masayuki; Imada, Katsumi; Ninomiya, Toru; Adachi, Yusuke, Miniature pump, cooling system and portable equipment.
  53. Moore David A., Molded heat exchanger structure for portable computer.
  54. Van Brocklin Andrew L. ; Bausch James F. ; Sterner John R., Multi-mode heat transfer using a thermal heat pipe valve.
  55. Donahoe Daniel N. (13416 Jones Rd. Spring TX) Mecredy ; III Henry E. (13416 Jones Rd. Houston TX 77070), PCMCIA card heat removal apparatus and methods.
  56. Aguilera Rafael E. (Simpsonville SC), Passive CPU cooling and LCD heating for a laptop computer.
  57. Nakanishi Tohru,JPX ; Nishio Toshihiko,JPX, Portable computer cooling method and computer holder.
  58. Mok,Lawrence Shungwei; Morris,Daniel Peter, Portable computer system with thermal enhancements and multiple power modes of operation.
  59. Progl Curtis L. ; Zhang Allen P., Portable computer with flexible heat spreader plate structure therein.
  60. Cathey David A., Portable computer with selectively operable cooling unit.
  61. Beckman Jerry L., Power adapter having a thermal cooling assembly for a digital information appliance.
  62. Bausch James F. ; Van Brocklin Andrew L ; Stryker Chadwick W, Proportional integral cooling device controller for electronic device.
  63. Maciaszek Thierry,FRX ; Huxtaix Herve,FRX ; Feuillatre Michel,FRX ; Mauduyt Jacques,FRX, System for transfer of energy between a hot source and a cold source.
  64. Moulene, Daniel; Gourdon, Pierre, Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support.
  65. Hunter Reginald, Temperature control system for semiconductor processing facilities.
  66. Hamilton Harold E. ; Tremmel Tom A., Temperature controlled high power burn-in board heat sinks.
  67. O'Connor Michael ; Haley Kevin J., Thermal connector for joining mobile electronic devices to docking stations.
  68. Altoz Frank E. (Catonsville MD), Thermal coupling to enhance heat transfer.
  69. Danielson Richard D. (Hastings MN) Hesselroth David A. (St. Paul Park MN) Stein ; Jr. Ralph J. (So. St. Paul MN), Thermal transfer bag.
  70. Janak G. Patel, Thermal transfer hinge for hinged mobile computing device and method of heat transfer.
  71. Kobayashi Takashi,JPX, Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus.
  72. Puckett John Christopher, Two-phase constant-pressure closed-loop water cooling system for a heat producing device.
  73. Larson Ralph I. (Bolton MA) Phillips Richard L. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for laptop computers.
  74. Cope Kenneth W. (Chantilly VA) Kent Leslie W. (Chantilly VA) Gardner Christopher W. (Reston VA), Ventilation system in a portable computer.

이 특허를 인용한 특허 (3)

  1. Bowers, Scott D.; Gault, Joseph B.; McCracken, Ivan; Hill, Andrew W., Electro-mechanical locking mechanism.
  2. Refai-Ahmed, Gamal; Ramalingam, Suresh; Philofsky, Brian D.; Torza, Anthony, Stacked silicon package having a thermal capacitance element.
  3. Eremenko, Paul; Fishman, David; Newburg, Seth; Knaian, Ara; Bober, Marisa, Systems and methods for thermal management of a chassis-coupled modular mobile electronic device.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로