Discrete pressure sensor with cantilevered force centralizers
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G01L-001/26
G01L-005/00
G06F-003/041
H03K-017/96
출원번호
US-0779820
(2014-08-26)
등록번호
US-9645023
(2017-05-09)
국제출원번호
PCT/CN2014/085168
(2014-08-26)
국제공개번호
WO2016/029354
(2016-03-03)
발명자
/ 주소
Li, Hao
출원인 / 주소
SHENZHEN NEW DEGREE TECHNOLOGY CO., LTD.
대리인 / 주소
Nixon & Vanderhye PC
인용정보
피인용 횟수 :
0인용 특허 :
5
초록▼
The present invention relates to the field of pressure sensor technologies, and discloses a discrete pressure sensor and an electronic device. The pressure sensor includes a pressure sensing chip and a force centralization sensing board component that is bonded onto the pressure sensing chip. The fo
The present invention relates to the field of pressure sensor technologies, and discloses a discrete pressure sensor and an electronic device. The pressure sensor includes a pressure sensing chip and a force centralization sensing board component that is bonded onto the pressure sensing chip. The force centralization sensing board component has a hollowed area, the hollowed area has a force centralization position for centralizing force applied on the force centralization sensing board component, and the force centralization position is disposed against the pressure sensing chip. After pressure is applied in the hollowed area of the force centralization sensing board component, force is centralized to the force centralization position, conveyed to the pressure sensing chip in a centralized manner, and converted into control information to control an external electronic device through a circuit or the like of the electronic device. The discrete pressure sensor has a simple structure, and does not have a high requirement on assembly precision. In an actual application, the discrete pressure sensor is directly bonded onto an inner side of a front panel of the electronic device, and a user may control the electronic device through the discrete pressure sensor by touching and pressing positions in the hollowed area corresponding to the front panel. The discrete pressure sensor has a low requirement on installation, and is applicable in a wide scope.
대표청구항▼
1. A discrete pressure sensor, comprising: a pressure sensing chip, anda force centralization sensing board component that is bonded onto the pressure sensing chip, the force centralization sensing board component comprising a sheet having a cutout pattern defining at least first and second cantilev
1. A discrete pressure sensor, comprising: a pressure sensing chip, anda force centralization sensing board component that is bonded onto the pressure sensing chip, the force centralization sensing board component comprising a sheet having a cutout pattern defining at least first and second cantilevered structures arranged in a symmetrical configuration, the first cantilevered structure having a first attaching portion and a first distal portion, the second cantilevered structure having a second attaching portion and a second distal portion, the first and second cantilevered structures directing force applied on the force centralization sensing board component toward the pressure sensing chip at a force centralization position defined between the first distal portion of the first cantilevered structure and the second distal portion of the second cantilevered structure. 2. The discrete pressure sensor according to claim 1, wherein the cutout pattern includes a plurality of vacant areas, at least some of the vacant areas being bar-shaped. 3. The discrete pressure sensor according to claim 1, wherein the cutout pattern includes a plurality of vacant areas, at least some of the vacant areas being arc-shaped. 4. The discrete pressure sensor according to claim 1, wherein the force centralization sensing board component includes one or more edges extending from the sheet toward a side of the force centralization sensing board component. 5. The discrete pressure sensor according to claim 1, wherein the force centralization sensing board component and the pressure sensing chip are bonded with a first adhesive. 6. The discrete pressure sensor according to claim 1, wherein the discrete pressure sensor further comprises a detection circuit electrically connected to the pressure sensing chip. 7. The discrete pressure sensor according to claim 1, wherein the discrete pressure sensor further comprises a front panel, wherein the front panel is bonded to the force centralization sensing board component. 8. The discrete pressure sensor according to claim 7, wherein the force centralization sensing board component and the front panel are bonded with a second adhesive. 9. The discrete pressure sensor according to claim 7, wherein the front panel is deformable. 10. The discrete pressure sensor according to claim 7, wherein a marking pattern is disposed on the front panel at a location aligned with the cutout pattern in the force centralization sensing board. 11. The discrete pressure sensor according to claim 1, wherein the pressure sensing chip comprises a substrate and a sensing component disposed on the substrate, the sensing component being disposed at a location in alignment with the cutout pattern. 12. The discrete pressure sensor according to claim 1, wherein the force centralization sensing board component comprises a substantially planar board having no protruding structure disposed at periphery thereof, and substantially uniform thickness. 13. An electronic device, comprising the discrete pressure sensor according to claim 1, the discrete pressure sensor being connected to control at least one circuit. 14. The electronic device according to claim 13, wherein the discrete pressure sensor is directly bonded onto an inner side of the front panel, the front panel being bonded to an upper surface of the force centralization sensing board component. 15. The electronic device according to claim 13, wherein the front panel and the force centralization sensing board component deform together. 16. A control panel comprising: a panel having markings thereon;a pressure sensor, anda force centralizer sheet having a cutout pattern defining plural symmetrically-arranged deformable cantilevered structures each having an attaching portion and a distal portion, the force centralizer sheet being bonded between the pressure sensor and the panel so the plural cantilevered structures are disposed in registry with the markings and the pressure sensor is disposed at a force centralization position defined between the distal portions of the plural cantilevered structures, the plural cantilevered structures deforming in response to deformation of the panel to centralize force toward the pressure sensor. 17. The control panel of claim 16, wherein the panel includes an unperforated steel planar portion having first and second sides, the markings being disposed on the first side of the steel planar portion, the force centralizer sheet being bonded to the second side of the steel planar portion.
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이 특허에 인용된 특허 (5)
Chalpin Blair R. (San Diego CA), Method and apparatus for precise measurement of differential pressures.
Sooriakumar K. (Scottsdale AZ) Monk David J. (Mesa AZ) Chan Wendy K. (Scottsdale AZ) Goldman Kenneth G. (Chandler AZ), Vertically integrated sensor structure and method.
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