|국가/구분||United States(US) Patent 등록|
|국제특허분류(IPC7판)||H05K-007/00 H01L-039/04 H05K-013/04 H01L-039/24 H01L-039/02|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 0 인용 특허 : 153|
An electrical module having electrically interconnecting substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting module, is provided. A liquid curable adhesive is provided over the set of contacts of a first substrate, and the set of electrical contacts of the second substrate is aligned with the set of electrical contacts of the first substrate. The sets of electrical contacts of the first and second substrate are compressed to displace the liquid curable adhesive f...
1. An electrical module, comprising: a pair of electrically interconnected substrates, each having corresponding sets of electrical contacts in mutual contact, at least one of the substrates having a set of electrical contacts formed of a deformable metal which are deformed but not fused to the corresponding set of electrical contacts of the other substrate at an intercontact region;a solid matrix adhered to the pair of electrically interconnected substrates except between the corresponding sets of electrical contacts, formed from a curable liquid adhesi...