Systems and assemblies for cooling server racks
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
G06F-001/20
출원번호
US-0216005
(2014-03-17)
등록번호
US-9648784
(2017-05-09)
발명자
/ 주소
Keisling, Earl
Costakis, John
McDonnell, Gerald
Welch, Michael
출원인 / 주소
INERTECH IP LLC
대리인 / 주소
Carter, DeLuca, Farrell & Schmidt, LLP
인용정보
피인용 횟수 :
5인용 특허 :
29
초록▼
A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one
A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.
대표청구항▼
1. A cooling assembly for cooling server racks comprising: a first server rack enclosure sub-assembly comprising: one or more first panel members defining a volume for receiving one or more first server racks having a front portion and a rear portion, at least one of the one or more first panel memb
1. A cooling assembly for cooling server racks comprising: a first server rack enclosure sub-assembly comprising: one or more first panel members defining a volume for receiving one or more first server racks having a front portion and a rear portion, at least one of the one or more first panel members being a rear panel member; andat least one frame member defining an opening for receiving the rear portion of the one or more first server racks to form a first hot space between the rear panel member and the combination of the at least one frame member and the rear portion of the one or more first server racks; anda first cooling sub-assembly disposed in thermal communication with the first hot space to enable cooling of at least one first server supported in the at least one first server rack, the first cooling sub-assembly comprising a chassis configured to receive at least one first heat exchange member for exchanging heat between a first fluid flowing through the at least one first heat exchange member and a second fluid flowing through the first hot space that has been heated by the at least one first server,wherein the at least one frame member includes a selectively permeable material, and wherein the selectively permeable material includes a brush assembly. 2. The cooling assembly according to claim 1, wherein the at least one frame member includes one or more horizontal frame members, one or more vertical frame members, or both. 3. The cooling assembly according to claim 2, wherein at least one of the one or more horizontal frame members is supported by one or more of the one or more vertical frame members. 4. The cooling assembly according to claim 2, wherein one or more of the one or more vertical frame members or one or more of the one or more horizontal members or both the one or more of the one or more vertical frame members and the one or more of the one or more horizontal frame members further comprises a sealing member to form a seal between the respective frame member and the rear portion of the at least one first server rack. 5. The cooling assembly according to claim 1, wherein the rear panel member includes at least one door to enable access to the rear portion of the one or more first server racks. 6. The cooling assembly according to claim 1, wherein the chassis comprises a set of one or more structural members configured and disposed to support the at least one first heat exchange member, the set of one or more structural members supporting the at least one first heat exchange member to enable the thermal communication with the at least one first server rack enclosure sub-assembly for the cooling of the at least one server. 7. The cooling assembly according to claim 6, wherein the first fluid is a refrigerant, and wherein the set of one or more structural members of the chassis is configured and disposed to support at least one refrigerant fluid supply line and at least one refrigerant fluid return line, the at least one refrigerant fluid supply line and the at least one refrigerant fluid return line in thermal and fluid communication with the at least one first heat exchange member. 8. The cooling assembly according to claim 6, wherein the set of one or more structural members of the chassis is configured and disposed to support at least one forced convection cooling member in fluid communication with the at least one first heat exchange member to enable the cooling of the at least one first server. 9. The cooling assembly according to claim 8, wherein the at least one forced convection cooling member includes a plurality of fans that are disposed to draw the second fluid flowing in the first hot space through the at least one first heat exchange member and over the top of the first cooling sub-assembly. 10. The cooling assembly according to claim 1, wherein the cooling assembly further comprises: a second server rack enclosure sub-assembly, the second server rack enclosure sub-assembly configured to receive one or more second server racks configured to support at least one second server, the second server rack enclosure sub-assembly defining a frontal position with respect to the at least one second server rack and a rear position with respect to the at least one second server rack,the second server rack enclosure sub-assembly comprising at least one second panel member configured and disposed to selectively seal the rear position of the second server rack enclosure sub-assembly;a second cooling sub-assembly disposed in thermal communication with the second server rack enclosure sub-assembly to enable cooling of the at least one second server when the at least one second server is supported in the at least one second server rack,the second server rack enclosure sub-assembly and the second cooling sub-assembly defining a second confined hot space disposed between the at least one second panel member configured and disposed to selectively seal the rear position of the second server rack enclosure sub- assembly and the rear position of the one or more second server racks enclosed therein,wherein the second cooling sub-assembly comprises a structure configured to receive at least one second heat exchange member for exchanging heat between the first fluid flowing through the at least one second heat exchange member and the second fluid that removes heat from the at least one second server and which flows through the second confined hot space, andwherein the first cooling sub-assembly and the second cooling sub-assembly each comprise at least one respective heat exchange member of the at least one first heat exchange member and the second at least one heat exchange member for exchanging heat between the first fluid flowing through the at least one respective heat exchange member and the second fluid that removes heat from at least one respective server of the at least one first server and the at least one second server,wherein the first cooling sub-assembly and the second cooling sub-assembly comprise a first fluid section and a second fluid section, respectively, configured to enable fluid and thermal communication with the at least one respective heat exchange member and define a first fluid section end and a second fluid section end, each of the first and second fluid section ends enabling the thermal communication, the first fluid section end of the second fluid section of the second cooling sub-assembly configured to couple in series with the second fluid section end of the first fluid section of the first cooling sub-assembly to form a chain of cooling sub-assemblies. 11. The cooling assembly according to claim 10, wherein the first fluid section and the second fluid section each further defines respective electrical sections having first and second electrical section ends, the first electrical section end of the second electrical section configured to enable electrical communication with the second electrical section end of the first electrical section. 12. A cooling sub-assembly for a cooling assembly for cooling server racks, wherein the cooling assembly comprises a server rack enclosure sub-assembly, the server rack enclosure sub-assembly configured to receive one or more server racks configured to support at least one server, the server rack enclosure sub-assembly defining a frontal position with respect to the at least one server rack and a rear position with respect to the at least one server rack,the server rack enclosure sub-assembly comprising at least one panel member configured and disposed to selectively seal the rear position of the at least one server rack enclosure sub-assembly,the cooling sub-assembly disposed in thermal communication with the server rack enclosure sub-assembly to enable cooling of the at least one server when the at least one server is supported in the at least one server rack,the server rack enclosure sub-assembly and the cooling sub-assembly defining a confined hot space disposed between the at least one panel member configured and disposed to selectively seal the rear position of the at least one server rack enclosure sub-assembly and the rear position of the one or more server racks,the cooling sub-assembly comprising structure configured to receive at least one heat exchange member for exchanging heat between a first fluid flowing through the at least one heat exchange member and a second fluid that removes heat from at least one server, andwherein the structure of the cooling sub-assembly is configured and disposed to support at least one forced convection cooling member in fluid communication with the at least one heat exchange member to enable the cooling of the at least one server when the at least one server is supported in the at least one server rack. 13. The cooling sub-assembly according to claim 12, wherein the structure of the cooling sub-assembly comprises a set of one or more frame members configured and disposed to retain the at least one heat exchange member, the set of one or more frame members supporting the at least one heat exchange member to enable the thermal communication with the at least one server rack enclosure sub-assembly for the cooling of the at least one server when the at least one server is supported in the at least one server rack. 14. The cooling sub-assembly according to claim 13, wherein the first fluid is a refrigerant, and wherein the set of one or more frame members is configured and disposed to support at least one refrigerant fluid supply line and at least one refrigerant fluid return line, the at least one refrigerant fluid supply line and the at least one refrigerant fluid return line in thermal and fluid communication with the at least one heat exchange member. 15. The cooling sub-assembly according to claim 14, wherein the set of one or more frame members is configured and disposed to support at least one forced convection cooling member in fluid communication with the at least one heat exchange member to enable the cooling of the at least one server when the at least one server is supported in the at least one server rack. 16. A system for cooling server racks comprising: a cooling assembly comprising:a first server rack enclosure sub-assembly, the first server rack enclosure sub-assembly configured to receive one or more first server racks configured to support at least one first server, the first server rack enclosure sub-assembly defining a front portion with respect to the at least one first server rack and a rear portion with respect to the at least one first server rack,the first server rack enclosure sub-assembly comprising at least one first panel member configured and disposed to selectively seal the rear portion of the at least one first server rack enclosure sub-assembly; anda first cooling sub-assembly disposed in thermal communication with the first server rack enclosure sub-assembly to enable cooling of the at least one first server when the at least one first server is supported in the at least one first server rack,the first server rack enclosure sub-assembly and the first cooling sub-assembly defining a first confined hot space disposed between the at least one first panel member configured and disposed to selectively seal a rear position of the at least one server rack enclosure sub-assembly and the rear portion of the one or more first server racks,wherein the first cooling sub-assembly comprises: a structure configured to receive at least one first heat exchange member for exchanging heat between a first fluid flowing through the at least one first heat exchange member and a second fluid that removes heat from the at least one first server and which flows through the first confined hot space; anda central cooling circuit in thermal communication with the at least one first heat exchanger of the first cooling sub-assembly, the central cooling circuit configured to remove heat transferred to the first fluid. 17. The system according to claim 16, wherein the structure of the cooling sub-assembly comprises a set of one or more frame members configured and disposed to retain the at least one first heat exchange member, the set of one or more frame members supporting the at least one first heat exchange member to enable the thermal communication with the at least one first server rack enclosure sub-assembly for the cooling of the at least one first server when the at least one first server is supported in the at least one first server rack. 18. The system according to claim 17, wherein the first fluid is a refrigerant and the second fluid is air or a gas, and wherein the set of one or more frame members is configured and disposed to support at least one refrigerant fluid supply line and at least one refrigerant fluid return line, the at least one first heat exchange member in fluid and thermal communication with the central cooling circuit via the at least one refrigerant fluid supply line and the at least one refrigerant fluid return line. 19. The system according to claim 18, wherein the set of one or more frame members is configured and disposed to support at least one forced convection cooling member in fluid communication with the at least one first heat exchange member to enable the cooling of the at least one first server when the at least one first server is supported in the at least one first server rack. 20. The system according to claim 19, further comprising: a second server rack enclosure sub-assembly, the second server rack enclosure sub-assembly configured to receive one or more second server racks configured to support at least one second server, the second server rack enclosure sub-assembly defining a frontal position with respect to the at least one second server rack and a rear position with respect to the at least one second server rack,the second server rack enclosure sub-assembly comprising at least one second panel member configured and disposed to selectively seal the rear position of the second server rack enclosure sub-assembly; anda second cooling sub-assembly disposed in thermal communication with the second server rack enclosure sub-assembly to enable cooling of the at least one second server when the at least one second server is supported in the at least one second server rack,the second server rack enclosure sub-assembly and the second cooling sub-assembly defining a second confined hot space disposed between the at least one second panel member configured and disposed to selectively seal the rear position of the second server rack enclosure sub- assembly and the rear position of the one or more second server racks enclosed therein,wherein the second cooling sub-assembly comprises a structure configured to receive at least one second heat exchange member for exchanging heat between the first fluid flowing through the at least one second heat exchange member and the second fluid that removes heat from the at least one second server and which flows through the confined second hot space,wherein the first cooling sub-assembly and the second cooling sub-assembly each comprise at least one respective heat exchange member of the at least one first heat exchange member and the at least one second heat exchange member for exchanging heat between the first fluid flowing through the at least one respective heat exchange member and the second fluid that removes heat from at least one respective server of the at least one first server and the at least one second server, andwherein the first cooling sub-assembly and the second cooling sub-assembly comprise a first fluid section and a second fluid section, respectively, configured to enable fluid and thermal communication with the at least one respective heat exchange member and define a first fluid section end and a second fluid section end, each of the first and second fluid section ends enabling the thermal communication, the first fluid section end of the second fluid section of the second cooling sub-assembly configured to couple in series with the second fluid section end of the first fluid section of the first cooling sub-assembly to form a chain of cooling sub-assemblies. 21. The system according to claim 20, wherein the first fluid section and the second fluid section each further define respective electrical sections having first and second electrical section ends, the first electrical section end of the second electrical section configured to enable electrical communication with the second electrical section end of the first electrical section. the first electrical section.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (29)
Hillis,W. Daniel; Duttweiler,Mark; Salter,Kenneth D.; Yates,Randall A., Balanced chilled fluid cooling system for a data center in a shipping container.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack.
Miller David Jonathan,GBX ; Sams Ian James,GBX ; Holland Michael James,GBX ; Fields Simon David,GBX, Cooling system for use in cooling electronic equipment.
Hall,Shawn A.; Tian,Shurong; Coteus,Paul W.; Karidis,John P.; Colgan,Evan G.; Guernsey, Jr.,Robert W., Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling.
Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Method and system for cooling electronics racks using pre-cooled air.
Yates, Randall A.; Ferren, Bran; Hillis, W. Daniel; Khanlian, Luke W.; Salter, Kenneth D., Server rack service utilities for a data center in a shipping container.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.