Tamper-respondent assemblies with enclosure-to-board protection
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G08B-021/00
H05K-001/02
H05K-003/22
G08B-013/12
출원번호
US-0193525
(2016-06-27)
등록번호
US-9661747
(2017-05-23)
발명자
/ 주소
Brodsky, William L.
Busby, James A.
Cohen, Edward N.
Dragone, Silvio
Fisher, Michael J.
Long, David C.
Peets, Michael T.
Santiago-Fernandez, William
Weiss, Thomas
출원인 / 주소
INTERNATIONAL BUSINESS MACHINES CORPORATION
대리인 / 주소
McNamara, Esq., Margaret A.
인용정보
피인용 횟수 :
15인용 특허 :
119
초록▼
Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component w
Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.
대표청구항▼
1. A tamper-respondent assembly comprising: a circuit board;an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume;a tamper-respondent electronic circuit structure facilitating defining the secure volume, the tamper-re
1. A tamper-respondent assembly comprising: a circuit board;an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume;a tamper-respondent electronic circuit structure facilitating defining the secure volume, the tamper-respondent electronic circuit structure comprising a tamper-respondent circuit;an adhesive securing, in part, the electronic enclosure to the circuit board, the adhesive contacting, at least in part, the tamper-respondent circuit of the tamper-respondent electronic circuit structure, wherein separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, thereby facilitating detection of the separation; andwherein the circuit board comprises a multilayer circuit board, and wherein the tamper-respondent electronic circuit structure further includes an embedded tamper-respondent sensor within the multilayer circuit board, the embedded tamper-respondent sensor facilitating defining, at least in part, the secure volume. 2. The tamper-respondent assembly of claim 1, wherein the adhesive covers, at least in part, the tamper-respondent circuit. 3. The tamper-respondent assembly of claim 2, wherein the adhesive is disposed at an inner periphery of an enclosure-to-board interface where the electronic enclosure mounts to the circuit board. 4. The tamper-respondent assembly of claim 1, wherein the tamper-respondent electric circuit structure further comprises an inner-sidewall tamper-respondent sensor disposed over an inner sidewall of the electronic enclosure, and facilitating defining the secure volume, the adhesive further contacting, at least in part, the inner-sidewall tamper-respondent sensor. 5. The tamper-respondent assembly of claim 1, wherein the tamper-respondent assembly further comprises an electrically conductive encapsulant, the electrically conductive encapsulant being disposed at a periphery of the enclosure-to-board interface, where the electronic enclosure mounts to the circuit board, to facilitate electrical connection between the electronic enclosure and a ground plane of the circuit board. 6. The tamper-respondent assembly of claim 1, wherein the tamper-respondent assembly further comprises a plurality of electrical contacts between the circuit board and electronic enclosure, and spaced about a periphery of the enclosure-to-board interface, where the electronic enclosure mounts to the circuit board, the plurality of electrical contacts facilitating electrical connection of the electronic enclosure to the circuit board to suppress, at least in part, electromagnetic interference (EMI) at the enclosure-to-board interface. 7. The tamper-respondent assembly of claim 6, wherein the plurality of electrical contacts comprise a plurality of electromagnetic compatibility (EMC) springs disposed between the electronic enclosure and the circuit board along the periphery of the enclosure-to-board interface. 8. The tamper-respondent assembly of claim 1, wherein the tamper-respondent electronic circuit structure further comprises a monitor circuit powered by a power source, the monitor circuit identifying an intrusion event upon loss of power from the power source, and wherein the tamper-respondent circuit electrically connects, at least in part, the power source to the monitor circuit so that breaking of the tamper-respondent circuit results in loss of power to the monitor circuit, and thereby detection of the intrusion event. 9. A tamper-respondent assembly comprising: a circuit board;at least one electronic component associated with the circuit board;an electronic enclosure mounted to the circuit board and facilitating enclosing the at least one electronic component within a secure volume;a tamper-respondent electronic circuit structure facilitating defining the secure volume, the tamper-respondent electronic circuit structure comprising a tamper-respondent circuit;an adhesive disposed between the electronic enclosure and the circuit board at an inner periphery of the electronic enclosure, the adhesive contacting, at least in part, the tamper-respondent circuit of the tamper-respondent electronic circuit structure, wherein separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, thereby facilitating detection of the separation; andwherein the circuit board comprises a multilayer circuit board, and wherein the tamper-respondent electronic circuit structure further includes an embedded tamper-respondent sensor within the multilayer circuit board, the embedded tamper-respondent sensor facilitating defining, at least in part, the secure volume. 10. The tamper-respondent assembly of claim 9, wherein the circuit board includes a groove sized to receive an edge of the electronic enclosure where the electronic enclosure mounts to the circuit board, and wherein the tamper-respondent circuit is disposed on an upper surface of the circuit board within the secure volume at an inner periphery of the enclosure-to-board interface, where the electronic enclosure mounts to the circuit board. 11. The tamper-respondent assembly of claim 9, wherein the tamper-respondent assembly further comprises an electrically conductive encapsulant, the electrically conductive encapsulant being disposed at a periphery of the enclosure-to-board interface, where the electronic enclosure mounts to the circuit board, to facilitate electrical connection between the electronic enclosure and a ground plane of the circuit board. 12. The tamper-respondent assembly of claim 9, wherein the tamper-respondent assembly further comprises a plurality of electrical contacts between the circuit board and the electronic enclosure, and spaced about a periphery of the enclosure-to-board interface, where the electronic enclosure mounts to the circuit board, the plurality of electrical contacts facilitating electrical connection of the electronic enclosure to the circuit board to suppress, at least in part, electromagnetic interference (EMI) at the enclosure-to-board interface. 13. The tamper-respondent assembly of claim 12, wherein the plurality of electrical contacts comprise a plurality of electromagnetic compatibility (EMC) springs disposed between the electronic enclosure and the circuit board along the periphery of the enclosure-to-board interface. 14. The tamper-respondent assembly of claim 9, wherein the tamper-respondent electronic circuit structure further comprises a monitor circuit powered by a power source, the monitor circuit identifying an intrusion event upon loss of power from the power source, and wherein the tamper-respondent circuit electrically connects, at least in part, the power source to the monitor circuit so that breaking of the tamper-respondent circuit, and thereby detection of the intrusion event. 15. A fabrication method comprising: fabricating a tamper-respondent assembly, the fabricating comprising: providing a circuit board;providing an electronic enclosure to mount to the circuit board and enclose at least one electronic component within a secure volume;providing a tamper-respondent electronic circuit structure facilitating defining the secure volume, the tamper-respondent electronic circuit structure comprising a tamper-respondent circuit;providing an adhesive securing, in part, the electronic enclosure to the circuit board, the adhesive contacting, at least in part, the tamper-respondent circuit of the tamper-respondent electronic circuit structure, wherein separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, thereby facilitating detection of the separation; andwherein the circuit board comprises a multilayer circuit board, and wherein the tamper-respondent electronic circuit structure further includes an embedded tamper-respondent sensor within the multilayer circuit board, the embedded tamper-respondent sensor facilitating defining, at least in part, the secure volume.
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