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Optical measuring method and measuring device having a measuring head for capturing a surface topography by calibrating the orientation of the measuring head

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01B-009/02
  • G01B-011/02
  • G01B-011/24
출원번호 US-0713150 (2015-05-15)
등록번호 US-9677871 (2017-06-13)
우선권정보 DE-10 2012 111 008 (2012-11-15)
발명자 / 주소
  • Schönleber, Martin
  • Michelt, Berthold
  • Kunkel, Matthias
출원인 / 주소
  • Precitec Optronik Gmbh
대리인 / 주소
    Taylor English Duma LLP
인용정보 피인용 횟수 : 2  인용 특허 : 32

초록

The invention relates to an optical measuring process for acquiring a surface topography of a measurement object. To this end, a measuring device with a measuring head in a measuring head guide device is provided for chromatic confocal acquisition of the surface topography or for spectral interferom

대표청구항

1. An optical measuring process for acquiring a surface topography of a measurement object comprising the following steps: providing a measuring device with a plurality of measurement channels, i being a value equal to a total number of measurement channels of the plurality of measurement channels,

이 특허에 인용된 특허 (32)

  1. Schönleber, Martin, Apparatus and method for determining a depth of a region having a high aspect ratio that protrudes into a surface of a semiconductor wafer.
  2. Halle Scott D. (Hopewell Junction NY) Hobbs Philip Charles Danby (Briarcliff Manor NY) Mitsui Tadashi (Wappingers Falls NY) van Kessel Theodore G. (Millbrook NY) Wickramasinghe Hemantha Kumar (Chappa, Assembly for measuring a trench depth parameter of a workpiece.
  3. Knopp Carl F. ; Fountain William D. ; Orkiszewski Jerzy ; Persiantsev Michael ; Sklar H. Alfred ; Wysopal Jan, Automated laser workstation for high precision surgical and industrial interventions.
  4. Jasapara,Jayesh; Yablon,Andrew D., Characterization of optical fiber using Fourier domain optical coherence tomography.
  5. Fettig, Rabi; Sinha, Jaydeep Kumar, Curvature-based edge bump quantification.
  6. Bois Emmanuel (Massy FRX) Huard Serge (Aubagne FRX) Boisde Gilbert (Bures sur Yvette FRX), Displacement transducer with staggered optical fibres.
  7. Subramanian, Ramkumar; Lyons, Christopher F., Dual damascene trench depth monitoring.
  8. Vogtmann, Michael; Vepa, Krishna; Wisnieski, Michael, Eccentric abrasive wheel for wafer processing.
  9. Lian, Lei; Davis, Matthew F, Interferometric endpoint determination in a substrate etching process.
  10. Lian,Lei; Davis,Matthew F., Interferometric endpoint determination in a substrate etching process.
  11. Schönleber, Martin; Kogel-Hollacher, Markus, Material-working device with in-situ measurement of the working distance.
  12. Sawabe,Taiki; Nomaru,Keiji, Measuring instrument and laser beam machine for wafer.
  13. Barbee Steven G. (Dover Plains NY) Heinz Tony F. (Chappaqua NY) Hfer Ulrich (Munich NY DEX) Li Leping (Poughkeepsie NY) Silvestri Victor J. (Hopewell Junction NY), Method and apparatus for real-time, in-situ endpoint detection and closed loop etch process control.
  14. Czerkas, Slawomir, Method for correcting measured values resulting from the bending of a substrate.
  15. Hecht,Thomas; Schr철der,Uwe; Mantz,Ulrich; Jakschik,Stefan; Orth,Andreas, Method for determining the depth of a buried structure.
  16. Uehara, Shin ichi; Sato, Yuko; Sumiyoshi, Ken; Kaneko, Setsuo; Matsushima, Jin, Method for forming finely-structured parts, finely-structured parts formed thereby, and product using such finely-structured part.
  17. Johs, Blaine D.; Hale, Jeffrey S., Method of determining substrate etch depth.
  18. Ohno, Takao; Meguro, Koichi; Kamada, Shigeru; Fukuda, Keisuke; Shimobeppu, Yuzo, Method of manufacturing semiconductor device using heated conveyance member.
  19. Dusemund, Claus; Schoenleber, Martin; Michelt, Berthold; Dietz, Christoph, Monitoring apparatus and method for in-situ measurement of wafer thicknesses for monitoring the thinning of semiconductor wafers and thinning apparatus comprising a wet etching apparatus and a monitoring apparatus.
  20. Clifford, Jr., George M.; Gong, William, Optical measurement for measuring a small space through a transparent surface.
  21. Michelt, Berthold; Kunkel, Matthias, Optical measuring device and method for acquiring in situ a stage height between a support and an edge region of an object.
  22. Popovic Radivoje (Zug CHX) Hlg Beat (Cham CHX), Process for automatic calibration or re-calibration of measurements of a physical variable.
  23. Li Ming-Chiang, Sample inspection using interference and/or correlation of scattered superbroad radiation.
  24. Tearney, Guillermo J.; Bouma, Brett Eugene; Shishkov, Milen Stefanov; Rosen, Jonathan Jay, Spectrally encoded miniature endoscopic imaging probe.
  25. Kipman Yair Y. (West Newton MA) McDonald Paul A. (North Billerica MA) Schuchatowitz Robert D. (Brighton MA), System and method for aligning a first surface with respect to a second surface.
  26. Schönleber, Martin; Michelt, Berthold, Test device for testing a bonding layer between wafer-shaped samples and test process for testing the bonding layer.
  27. Takahashi, Teruo; Watanabe, Motoyuki, Thickness measuring apparatus, thickness measuring method, and wet etching apparatus and wet etching method utilizing them.
  28. Takahashi, Teruo; Watanabe, Motoyuki; Takahashi, Hidenori, Thickness measuring apparatus, thickness measuring method, and wet etching apparatus and wet etching method utilizing them.
  29. David C. MacPherson ; Jon G. Dishler, Topographer for real time ablation feedback having synthetic wavelength generators.
  30. Marx,David S.; Grant,David L., Trench measurement system employing a chromatic confocal height sensor and a microscope.
  31. Marx, David S.; Grant, David L.; Mahoney, Michael A.; Chan, Tsan Yuen, Wafer measurement system and apparatus.
  32. Brouillette, Donald W.; Ference, Thomas G.; Linde, Harold G.; Hibbs, Michael S.; Mendelson, Ronald L., Wafer thickness control during backside grind.

이 특허를 인용한 특허 (2)

  1. Schönleber, Martin; Michelt, Berthold; Kunkel, Matthias, Optical measuring method and measuring device having a measuring head for capturing a surface topography by calibrating the orientation of the measuring head.
  2. Jensen, Thomas; Ilg, Patrick; Chardonnens, Julien; Leimgruber, Lorenz; Nardulli, Alessandro, Optical sensor having variable measuring channels.
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