Light-emitting device package and electronic device including light-emitting device
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05B-033/08
H01L-025/075
H01L-025/16
H01L-023/00
H01L-033/38
H01L-033/48
출원번호
US-0969191
(2015-12-15)
등록번호
US-9681509
(2017-06-13)
우선권정보
KR-10-2015-0031961 (2015-03-06)
발명자
/ 주소
Park, In-soo
출원인 / 주소
SAMSUNG ELECTRONICS CO., LTD.
대리인 / 주소
Sughrue Mion, PLLC
인용정보
피인용 횟수 :
0인용 특허 :
44
초록▼
A light-emitting device package includes a substrate; a light-emitting device provided on the substrate and configured to be driven by an AC power supply; and a capacitor connected in series with the light-emitting device, where a capacitance of the capacitor varies so that a current flowing through
A light-emitting device package includes a substrate; a light-emitting device provided on the substrate and configured to be driven by an AC power supply; and a capacitor connected in series with the light-emitting device, where a capacitance of the capacitor varies so that a current flowing through the light-emitting device and flowing through the capacitor is maintained at a constant value according to a variation in temperatures of the light-emitting device and the capacitor.
대표청구항▼
1. A light-emitting device package comprising: a substrate;a light-emitting device provided on the substrate and configured to be driven by an AC power supply; anda capacitor connected in series with the light-emitting device, the capacitor comprising a dielectric formed of a material different from
1. A light-emitting device package comprising: a substrate;a light-emitting device provided on the substrate and configured to be driven by an AC power supply; anda capacitor connected in series with the light-emitting device, the capacitor comprising a dielectric formed of a material different from a material of the substrate and a first plate contacting a surface of the light-emitting device;wherein a capacitance of the capacitor varies according to a variation in temperatures of the light-emitting device and the capacitor, so that a current flowing through the light-emitting device and flowing through the capacitor is maintained at a constant value; andwherein a width of the dielectric is less than a width of the light-emitting device, the width of the dielectric and the width of the light-emitting device being parallel to the surface of the light-emitting device. 2. The light-emitting device package of claim 1, wherein a variation in the capacitance of the capacitor for a charging time tc of the capacitor satisfies the following formula: ΔC=[C2ΔV(tc)CΔV(tc)+I0tc]where I0 is the current that flows through the light-emitting device and flows through the capacitor and is measured at an initial temperature T0, C is an initial capacitance of the capacitor, ΔV(tc) is a variation in a voltage of the light-emitting device, and tc is the charging time of the capacitor. 3. The light-emitting device package of claim 1, wherein the capacitor further comprises a second plate, the dielectric is provided between the first plate and the second plate, and in order for the capacitor to vary so that the current flowing through the light-emitting device and flowing through the capacitor is maintained at the constant value, a cross-sectional area S of the capacitor, a distance d between the first plate and the second plate, and a variation ⅆɛTⅆT in a dielectric constant of the dielectric with respect to temperature are determined based on the following formula: ΔC=ⅆCⅆT=(ɛ0SD)ⅆɛrⅆTwhere ∈0 is a permittivity in free space and ∈r is a relative permittivity. 4. The light-emitting device package of claim 1, wherein the dielectric penetrates the substrate;the first plate contacts a top surface of the dielectric; andthe capacitor further comprises a second plate that contacts a bottom surface of the dielectric. 5. The light-emitting device package of claim 4, wherein the light-emitting device is provided on the first plate to overlap the dielectric in a direction perpendicular to a surface of the light-emitting device. 6. The light-emitting device package of claim 5, wherein an overlapping cross-sectional area of the light-emitting device and the dielectric is substantially equal to a cross-sectional area of the dielectric. 7. The light-emitting device package of claim 5, wherein the light-emitting device is of a plurality of light-emitting devices,the capacitor is of a plurality of capacitors,the plurality of capacitors comprises a plurality of dielectrics that penetrate the substrate, and a plurality of first plates that respectively come into contact with top surfaces of the plurality of dielectrics, andthe plurality of light-emitting devices are respectively provided on the plurality of first plates so as to overlap the plurality of dielectrics. 8. The light-emitting device package of claim 7, wherein the plurality of capacitors are connected in parallel to one another. 9. The light-emitting device package of claim 4, wherein the light-emitting device is of a plurality of light-emitting devices, and one of the plurality of light-emitting devices is provided on the first plate so as to overlap the dielectric in a direction perpendicular to a surface of the light-emitting device. 10. The light-emitting device package of claim 1, wherein the light-emitting device package is configured to control a direction of a driving current flowing through the light-emitting device independently from using an LED driver. 11. The light-emitting device package of claim 1, wherein the light-emitting device is thermally coupled to the capacitor. 12. The light-emitting device package of claim 1, wherein the dielectric constant of the dielectric is reduced according to an increase in a temperature of the dielectric. 13. An electronic device comprising: a substrate;a light-emitting device package provided on the substrate, the light-emitting device package comprising a light-emitting device driven by an AC power supply; anda capacitor connected in series with the light-emitting device, the capacitor comprising a dielectric formed of a material different from a material of the substrate and a first plate contacting a surface of the light-emitting device,wherein the capacitor is configured to have a capacitance which decreases according to an increase in a temperature of the capacitor, andwherein a width of the dielectric is less than a width of the light-emitting device, the width of the dielectric and the width of the light-emitting device being parallel to the surface of the light-emitting device. 14. The electronic device of claim 13, wherein the capacitor is embedded in the substrate. 15. The electronic device of claim 13, wherein the capacitor is provided in parallel to the light-emitting device package on the substrate. 16. An electronic device, comprising: a substrate;a light emitting device provided on the substrate, the light emitting device configured to emit light and thereby generate heat, the light emitting device comprising a first surface; anda capacitor comprising a second surface which contacts the first surface of the light emitting device, the capacitor and the light emitting device being electrically insulated from each other and configured to exchange the generated heat between the first and second surfaces, the capacitor comprising a material having a capacitance which decreases according to an increase in the exchanged heat so that a current flowing through the light emitting device and flowing through the capacitor is maintained at a constant value,wherein the capacitor further comprises a dielectric formed of a material different from a material of the substrate, andwherein a width of the dielectric is less than a width of the light-emitting device, the width of the dielectric and the width of the light-emitting device being parallel to the first surface. 17. The electronic device of claim 16, wherein the capacitor comprises: a first plate comprising the second surface;a second plate provided opposite the first plate; andthe dielectric provided between the first plate and the second plate. 18. The electronic device of claim 17, wherein the light emitting device further comprises: a third surface opposite the first surface; anda lateral light-emitting device structure comprising: a first-conductivity-type semiconductor layer formed on the third surface, anda second-conductivity-type semiconductor layer formed on the third surface. 19. The electronic device of claim 18, wherein the capacitor protrudes inside of the substrate. 20. The light-emitting device package of claim 7, wherein at least two of the plurality of light-emitting devices are connected in anti-parallel to each other so that the light-emitting device package continuously provides light.
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