TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
대리인 / 주소
Oblon, McClelland, Maier & Neustadt, L.L.P.
인용정보
피인용 횟수 :
0인용 특허 :
10
초록▼
A heat transfer device that can improve temperature uniformity along the entire length of a pipe line housed in the heat transfer device is provided. The heat transfer device transferring heat to the pipe line in which a fluid flows includes: a heat transfer block of high heat conductivity, surround
A heat transfer device that can improve temperature uniformity along the entire length of a pipe line housed in the heat transfer device is provided. The heat transfer device transferring heat to the pipe line in which a fluid flows includes: a heat transfer block of high heat conductivity, surrounding the pipe line, a heat pipe formed in the heat transfer block, along an extending direction of the pipe line, and a heater applying heat to the heat pipe. The heat transfer block includes a plurality of divided blocks dividable along the extending direction of the pipe line. There is provided a proximity portion where the heat transfer block is in proximate to the pipe line at both ends of the heat transfer block in the extending direction of the pipe line.
대표청구항▼
1. A heat transfer device transferring heat to a pipe line in which a fluid flows, comprising: a heat transfer block of high heat conductivity, surrounding said pipe line,a heat pipe formed in said heat transfer block, along an extending direction of said pipe line, anda heater applying heat to said
1. A heat transfer device transferring heat to a pipe line in which a fluid flows, comprising: a heat transfer block of high heat conductivity, surrounding said pipe line,a heat pipe formed in said heat transfer block, along an extending direction of said pipe line, anda heater applying heat to said heat pipe,said heat transfer block including a plurality of divided blocks dividable along the extending direction of said pipe line,a proximity portion where said heat transfer block is in proximity to said pipe line being provided at both ends of said heat transfer block in the extending direction of said pipe line. 2. The heat transfer device according to claim 1, wherein an extending length of said proximity portion in the extending direction of said pipe line is less than or equal to an outer diameter of said pipe line at said proximity portion. 3. The heat transfer device according to claim 1, wherein said heat transfer block includes a first divided block and a second divided block,said heat pipe is formed at only said first divided block, among the plurality of divided blocks,said first divided block and said second divided block are in surface contact. 4. The heat transfer device according to claim 3, wherein said heat transfer block includes an intermediate member between said divided block and said pipe line, at said proximity portion,said intermediate member is in thermal contact with said divided block. 5. The heat transfer device according to claim 4, wherein a small gap is provided between said intermediate member and said pipe line. 6. The heat transfer device according to claim 3, wherein said proximity portion is formed by reducing an inner diameter of said divided block at said proximity portion. 7. The heat transfer device according to claim 6, wherein a small gap is provided between said divided block and said pipe line at said proximity portion. 8. The heat transfer device according to claim 3, comprising a biasing member pushing said pipe line at said proximity portion towards said first divided block side. 9. The heat transfer device according to claim 8, comprising a sphere attached to a leading end of said biasing member, said sphere being in contact with an outer circumferential face of said pipe line. 10. The heat transfer device according to claim 1, wherein said heat transfer block includes a first divided block and a second divided block, said first divided block facing said second divided block with a small gap therebetween. 11. The heat transfer device according to claim 10, wherein said heat transfer block includes an intermediate member between said divided block and said pipe line, at said proximity portion, said intermediate member being in thermal contact with said divided block. 12. The heat transfer device according to claim 11, wherein said intermediate member is in contact with said pipe line. 13. The heat transfer device according to claim 10, wherein said proximity portion is formed by reducing an inner diameter of said divided block at said proximity portion. 14. The heat transfer device according to claim 13, wherein said divided block is in contact with said pipe line at said proximity portion.
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