|국가/구분||United States(US) Patent 등록|
|국제특허분류(IPC7판)||F22B-001/02 F28D-015/02 F24H-001/12 F16L-053/00|
|§371/§102 date||20141020 (20141020)|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 0 인용 특허 : 10|
A heat transfer device that can improve temperature uniformity along the entire length of a pipe line housed in the heat transfer device is provided. The heat transfer device transferring heat to the pipe line in which a fluid flows includes: a heat transfer block of high heat conductivity, surrounding the pipe line, a heat pipe formed in the heat transfer block, along an extending direction of the pipe line, and a heater applying heat to the heat pipe. The heat transfer block includes a plurality of divided blocks dividable along the extending direction...
1. A heat transfer device transferring heat to a pipe line in which a fluid flows, comprising: a heat transfer block of high heat conductivity, surrounding said pipe line,a heat pipe formed in said heat transfer block, along an extending direction of said pipe line, anda heater applying heat to said heat pipe,said heat transfer block including a plurality of divided blocks dividable along the extending direction of said pipe line,a proximity portion where said heat transfer block is in proximity to said pipe line being provided at both ends of said heat ...