Articles having a multilayer structure including undercut features interlocked with an adhesive, and methods of making same
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B29C-065/00
B29C-065/48
B32B-027/32
B32B-007/12
B32B-037/12
B29C-037/00
B32B-003/30
B32B-009/04
B32B-015/085
B32B-021/08
B32B-025/08
B32B-027/06
B32B-027/08
B32B-027/10
B32B-027/12
B29K-023/00
B29L-009/00
출원번호
US-0915675
(2014-09-03)
등록번호
US-9694538
(2017-07-04)
국제출원번호
PCT/US2014/053831
(2014-09-03)
국제공개번호
WO2015/041844
(2015-03-26)
발명자
/ 주소
Rule, Joseph D.
Perez, Mario A.
Lewandowski, Kevin M.
Follensbee, Robert A.
출원인 / 주소
3M Innovative Properties Company
대리인 / 주소
Pishko, Adrian L.
인용정보
피인용 횟수 :
0인용 특허 :
19
초록▼
Articles are provided, having a multilayer structure including (a) a first layer formed from polyolefin and including undercut features formed on and extending from an integral backing; (b) a second layer including an adhesive having a Shore D hardness of greater than 59 when cured; and (c) a third
Articles are provided, having a multilayer structure including (a) a first layer formed from polyolefin and including undercut features formed on and extending from an integral backing; (b) a second layer including an adhesive having a Shore D hardness of greater than 59 when cured; and (c) a third layer including a substrate. The second layer is interlocked with the undercut features, the third layer is adhered to the adhesive, and the second layer is disposed between the first layer and the third layer. A method is also provided including (a) depositing a polyolefin resin into a mold cavity to form a first layer including undercut features; (b) demolding the first layer from the mold cavity at a rate of at least 150 millimeters per minute; (c) applying a curable adhesive to the undercut features to form a second layer attached to the first layer; and (d) attaching a third layer including a substrate to the second layer.
대표청구항▼
1. An article comprising a multilayer structure, the multilayer structure comprising: (a) a first layer comprising a plurality of undercut features formed on and extending from an integral backing, wherein the first layer is formed of a polyolefin;(b) a second layer comprising an adhesive having a S
1. An article comprising a multilayer structure, the multilayer structure comprising: (a) a first layer comprising a plurality of undercut features formed on and extending from an integral backing, wherein the first layer is formed of a polyolefin;(b) a second layer comprising an adhesive having a Shore D hardness of greater than 59 when cured, wherein the second layer is interlocked with the plurality of undercut features; and(c) a third layer comprising a substrate, wherein the third layer is adhered to the adhesive and wherein the second layer is disposed between the first layer and the third layer;wherein the article exhibits a peak load of at least 150 N as determined by a 180° peel test. 2. The article of claim 1, wherein each of the plurality of undercut features comprises a stem extending from the integral backing. 3. The article of claim 2, wherein the stem comprises a backdrafted shape. 4. The article of claim 2, wherein the stems of the plurality of undercut features all extend from the integral backing at the same angle. 5. The article of claim 2, wherein each of the plurality of undercut features comprises a head formed on the stem, the head located distal to the integral backing. 6. The article of claim 5, wherein the head of each of the plurality of undercut features comprises a cross-sectional area greater than a cross-sectional area of the stem, and each head extends radially from the stem in at least three directions. 7. The article of claim 1, wherein the plurality of undercut features comprises a nail shape, a mushroom shape, or a combination thereof. 8. The article of claim 1, wherein 50% to 100% of the undercut features comprise the same geometry. 9. The article of claim 1, wherein at least 90% of the plurality of undercut features extend from the integral backing a distance that is within 20% of the average distance of all of the undercut features. 10. The article of claim 1, wherein each of the plurality of undercut features extends from the integral backing a distance between 0.001 inch (in) (0.0254 millimeters (mm)) and 0.25 in (6.35 mm). 11. The article of claim 1, wherein the polyolefin comprises polypropylene or polyethylene. 12. The article of claim 1, wherein the adhesive comprises an epoxy, a polyurea, an acrylic, a cyanoacrylate, a polyamide, a phenolic, a polyimide, or a polyurethane. 13. A method of forming an article comprising a multilayer structure, comprising: (a) depositing a polyolefin resin into a mold cavity to form a first layer comprising a plurality of undercut features on and extending from an integral backing;(b) demolding the first layer from the mold cavity at a rate of at least 150 millimeters per minute (mm/min);(c) applying a curable adhesive to the plurality of undercut features to form a second layer attached to the first layer, the curable adhesive having a Shore D hardness of greater than 59 when cured; and(d) attaching a third layer comprising a substrate to the second layer, wherein the second layer is disposed between the first layer and the third layer,wherein the article exhibits a peak load of at least 150 N as determined by a 180° peel test. 14. The method of claim 13, further comprising heating the resin to a temperature above the melting temperature (Tm) of the polyolefin resin prior to depositing the polyolefin resin into the mold cavity. 15. The method of claim 13, further comprising cooling the polyolefin resin in the mold cavity by maintaining the temperature of the mold cavity at between 25° C. and below the Tm of the polyolefin resin, prior to demolding the first layer from the mold cavity. 16. The method of claim 13, wherein the second layer is attached to the first layer via interlocking of the adhesive with the plurality of undercut features. 17. The method of claim 13, wherein when the demolding is performed the temperature of the mold cavity is maintained at a temperature between the Tm of the polyolefin resin and 30° C. below the Tm of the polyolefin resin. 18. The method of claim 13, wherein the polyolefin comprises a melt index between 0.1 and 10 grams per 10 minutes (g/10 min). 19. The method of claim 13, comprising demolding the first layer from the mold cavity at a rate of at least 250 mm/min.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (19)
Fujiki Nobuo (Shiga JPX), Apparatus and method for producing floor mat carrying flat-tipped projections.
Benioff B. Richard (Lambertville NJ) Frazer John S. (Long Beach Township ; Ocean County NJ) Yaffa Richard A. (Harrison NY) Szczurek Tadeusz (Oceanport NJ), Dispensing package for a pourable material having a bottle, a pour-back spout and a closure.
Miller Philip (Eagan MN) Melbye William L. (Woodbury MN) Nestegard Susan K. (Woodbury MN) Wood Leigh E. (Woodbury MN) Lindseth Marvin D. (Prescott WI) Bychinski Dale A. (Woodbury MN), Method for making a mushroom-type hook strip for a mechanical fastener.
Melbye William L. ; Nestegard Susan K. ; Wood Leigh E. ; Lindseth Marvin D. ; Bychinski Dale A., Method of making a mushroom-type hook strip for a mechanical fastener.
Lacey Thomas G. ; Provost George A. ; Filion Scott M. ; Kaparis Evangelos ; Dowd Clinton ; Van Stumpf James ; Condon Mark Joseph ; Pollard Samuel White ; Jens Stephen C. ; Grulke Peter E., Molding of fastening hooks and other devices.
Melbye William L. (Maplewood MN) Nestegard Susan K. (Woodbury MN) Wood Leigh E. (Woodbury MN) Lindseth Marvin D. (Prescott MN) Bychinski Dale A. (Fairmont MN), Mushroom-type hook strip for a mechanical fastener.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.