IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
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| 국제특허분류(IPC7판) |
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| 출원번호 |
US-0945176
(2013-07-18)
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| 등록번호 |
US-9695494
(2017-07-04)
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발명자
/ 주소 |
- Schroers, Jan
- Peker, Atakan
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| 출원인 / 주소 |
- Crucible Intellectual Property, LLC
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| 대리인 / 주소 |
Brownstein Hyatt Farber Schreck, LLP
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| 인용정보 |
피인용 횟수 :
0 인용 특허 :
65 |
초록
▼
Compositions for forming Au-based bulk-solidifying amorphous alloys are provided. The Au-based bulk-solidifying amorphous alloys of the current invention are based on ternary Au—Cu—Si alloys, and the extension of this ternary system to higher order alloys by the addition of one or more alloying elem
Compositions for forming Au-based bulk-solidifying amorphous alloys are provided. The Au-based bulk-solidifying amorphous alloys of the current invention are based on ternary Au—Cu—Si alloys, and the extension of this ternary system to higher order alloys by the addition of one or more alloying elements. Additional substitute elements are also provided, which allow for the tailoring of the physical properties of the Au-base bulk-solidifying amorphous alloys of the current invention.
대표청구항
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1. A bulk-solidifying amorphous alloy comprising Au from 25 to 75 atomic percent, Cu from 13 to 45 atomic percent, and Si from 12 to less than 20 atomic percent, wherein the bulk-solidifying amorphous alloy has a minimum thickness of about 1 mm. 2. The bulk-solidifying amorphous alloy of claim 1, co
1. A bulk-solidifying amorphous alloy comprising Au from 25 to 75 atomic percent, Cu from 13 to 45 atomic percent, and Si from 12 to less than 20 atomic percent, wherein the bulk-solidifying amorphous alloy has a minimum thickness of about 1 mm. 2. The bulk-solidifying amorphous alloy of claim 1, comprising Au from 30 to 67 atomic percent, Cu from 19 to 40 atomic percent, and Si from 14 to less than 20 atomic percent. 3. The bulk-solidifying amorphous alloy of claim 1, comprising Au from 40 to 60 atomic percent, Cu from 24 to 36 atomic percent, and Si from 16 to less than 20 atomic percent. 4. The bulk-solidifying amorphous alloy of claim 1, further comprising Ag. 5. The bulk-solidifying amorphous alloy of claim 4, wherein the atomic ratio of Ag to Au is up to 0.3. 6. The bulk-solidifying amorphous alloy of claim 1, further comprising Pd. 7. The bulk-solidifying amorphous alloy of claim 6, wherein the atomic ratio of Pd to Au is up to 0.3. 8. The bulk-solidifying amorphous alloy of claim 1, further comprising Ni. 9. The bulk-solidifying amorphous alloy of claim 8, wherein the atomic ratio of Ni to Cu is up to 0.3. 10. The bulk-solidifying amorphous alloy of claim 1, further comprising P. 11. The bulk-solidifying amorphous alloy of claim 10, wherein the atomic ratio of P to Si is up to 1. 12. The bulk-solidifying amorphous alloy of claim 1, further comprising Be. 13. The bulk-solidifying amorphous alloy of claim 12, wherein the atomic ratio of Be to the sum of Si and any P is up to 1. 14. The bulk-solidifying amorphous alloy of claim 1, further comprising one or more elements selected from a group consisting of Ge, Al, Sn, Sb, Y, and Er. 15. A bulk-solidifying amorphous alloy, wherein the bulk-solidifying amorphous alloy comprises a 14 karat, 18 karat, or 20 karat gold alloy Au from 25 to 75 atomic percent, Cu from 13 to 45 atomic percent, and Si from 12 to less than 20 atomic percent, and wherein the bulk-solidifying amorphous alloy has a minimum thickness of about 1 mm. 16. The bulk-solidifying amorphous alloy of claim 15, further comprising one or more elements selected from a group consisting of Ge, Al, Sn, Sb, Y, Zr, Hf, Ag, Pd, Ni, P, Be and Er. 17. A bulk-solidifying amorphous alloy comprising Au from 25 to 75 atomic percent, Cu from 13 to 45 atomic percent, and Si from 12 to less than 20 atomic percent, and one or more elements selected from a group consisting of Zr, Hf, Er, and Y wherein the bulk-solidifying amorphous alloy has a minimum thickness of about 1 mm. 18. The bulk-solidifying amorphous alloy of claim 17, comprising Au from 30 to 67 atomic percent, Cu from 19 to 40 atomic percent, and Si from 14 to less than 20 atomic percent. 19. The bulk-solidifying amorphous alloy of claim 17, comprising Au from 40 to 60 atomic percent, Cu from 24 to 36 atomic percent, and Si from 16 to less than 20 atomic percent.
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