Three-dimensional processing system having at least one layer with circuitry dedicated to scan testing and system state checkpointing of other system layers
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G01R-031/00
G01R-031/3185
G01R-031/26
G11C-029/32
G01R-031/3177
출원번호
US-0084553
(2016-03-30)
등록번호
US-9696379
(2017-07-04)
발명자
/ 주소
Buyuktosunoglu, Alper
Emma, Philip G.
Hartstein, Allan M.
Healy, Michael B.
Kailas, Krishnan K.
출원인 / 주소
International Business Machines Corporation
대리인 / 주소
Davis, Jennifer R.
인용정보
피인용 횟수 :
0인용 특허 :
27
초록▼
A method is provided for maintaining system state in semiconductor device having a first chip and a second chip, which are physically conjoined to form a stacked structure, wherein the first chip includes functional circuitry, and the second chip includes control circuitry for capturing and restorin
A method is provided for maintaining system state in semiconductor device having a first chip and a second chip, which are physically conjoined to form a stacked structure, wherein the first chip includes functional circuitry, and the second chip includes control circuitry for capturing and restoring a microarchitecture state of the functional circuitry of the first chip. The method includes initializing a system state of the semiconductor device and entering a wait state for a state capture triggering event. In response to an occurrence of a state capture triggering event, state data representing a current system state of the functional circuitry on the first chip is captured. The captured state data is transferred to the second chip through a system state I/O (input/output) interface of the second chip under control of the control circuitry on the second chip. A copy of the captured state data is then stored in a memory.
대표청구항▼
1. A semiconductor device, comprising: a first chip and a second chip, which are physically conjoined to form a vertically stacked structure with vertical connections between the first and second chips;wherein the first chip comprises functional circuitry and memory elements to store system state da
1. A semiconductor device, comprising: a first chip and a second chip, which are physically conjoined to form a vertically stacked structure with vertical connections between the first and second chips;wherein the first chip comprises functional circuitry and memory elements to store system state data which represents a microarchitecture of the functional circuitry;wherein the second chip comprises control circuitry for accessing and restoring system state data in the memory elements on the first chip; andwherein in response to an occurrence of a state capture triggering event, the control circuitry of the second chip is configured to: capture current state data stored in one or more of the memory elements on the first chip, which represents a current microarchitecture state of the functional circuitry on the first chip, wherein the state capturing triggering event comprises a checkpoint command that is initiated while a process is being executed by the functional circuitry of the first chip to commence a checkpoint operation, wherein execution of the process continues after commencement of the checkpoint operation;transfer the captured state data to the second chip through a system state I/O (input/output) interface of the second chip under control of the control circuitry on the second chip; andstore a copy of the captured state data in a memory;wherein the functional circuitry on the first chip comprises a plurality of scan cells comprising scannable flip-flops and latches;wherein the second chip further comprises scan testing circuitry, and a scan testing I/O (input/output) interface, wherein the scan cells of the first chip are connected to the scan testing I/O interface, and wherein the scan testing circuitry on the second chip operates to dynamically configure electrical connections between the scan cells on the first chip to form scan chains or scan rings for testing portions of the functional circuitry;wherein the scan testing circuitry on the second chip comprises:demultiplexer circuits;multiplexer circuits; andscan chain configuration and testing control circuitry,wherein each demultiplexer circuit has an input that is connected to an output of a scan cell on the first chip through the scan testing I/O interface, and two or more outputs that are connected to inputs of different multiplexer circuits;wherein each multiplexer circuit has an output that is connected to an input of a scan cell on the first chip through the scan testing I/O interface, and two or more inputs that are connected to outputs of different demultiplexer circuits;wherein the scan chain configuration and testing control circuitry generates control signals to control the demultiplexer and multiplexer circuits to dynamically configure the electrical connections between outputs and inputs of the scan cells on the first chip to form the scan chains or scan rings. 2. The semiconductor device of claim 1, wherein the state capturing triggering event comprises a sequence of one or more checkpoint commands that are initiated by the process being executed by the functional circuitry of the first chip to commence two or more different checkpoint operations in time sequence during execution of the process by the functional circuitry of the first chip. 3. The semiconductor device of claim 1, wherein the state capturing triggering event further comprises expiration of a period of time. 4. The semiconductor device of claim 1, wherein the state capturing triggering event further comprises a context switching event that triggers a switching between contexts of different applications being executed by the functional circuitry on the first chip. 5. The semiconductor device of claim 1, wherein the memory resides on the second chip. 6. The semiconductor device of claim 1, wherein in response to an occurrence of a state restore triggering event, the control circuitry of the second chip is further configured to: access a copy of state data associated with a target system state, which is stored in the memory;transfer the accessed copy of state data to the first chip through the system state I/O interface of the second chip under control of the control circuitry on the second chip; andrestore the target system state of the functional circuitry on the first chip using the accessed copy of state data transferred to the first chip. 7. The semiconductor device of claim 6, wherein the state restore triggering event comprises a power failure or a recoverable system error. 8. The semiconductor device of claim 6, wherein the state restore triggering event comprises a context switching event that triggers a switching between contexts of different applications being executed by the functional circuitry on the first chip. 9. The semiconductor device of claim 1, wherein the first chip comprises computer processor circuitry. 10. The semiconductor device of claim 1, wherein each scan cell comprises a data input, a scan input, and data output, and a scan-enable input, wherein the data outputs of one or more scan cells on the first chip are connected to inputs of the demultiplexer circuits on the second chip through the scan testing I/O interface, wherein the scan inputs of one or more scan cells are connected to outputs of the multiplexer circuits on the second chip through the scan testing I/O interface, and wherein the scan-enable inputs of the scan cells are connected to the scan chain configuration and testing control circuitry, and wherein the scan chain configuration and testing control signal generates a scan enable signal to place the scan cells into scan mode.
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이 특허에 인용된 특허 (27)
Pan, Yu-Tang; Wu, Cheng-Ting; Chou, Shih-Wen; Liu, Hui-Ping, Chip package without core and stacked chip package structure.
Zhou, Qing A; Lu, Daoqiang; Shi, Wei; He, Jiangqi, Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture.
Chakraborty, Tapan J.; Chiang, Chen-Huan; Goyal, Suresh; Portolan, Michele; Van Treuren, Bradford Gene, Method and apparatus for describing components adapted for dynamically modifying a scan path for system-on-chip testing.
Tanguay ; Jr. Armand R. (Fullerton CA) Jenkins B. Keith (Long Beach CA), Modulator-based photonic chip-to-chip interconnections for dense three-dimensional multichip module integration.
Crouch Alfred L. (Austin TX) Pressly Matthew D. (Austin TX) Circello Joseph C. (Phoenix AZ) Duerden Richard (Scottsdale AZ), Serial scan chain architecture for a data processing system and method of operation.
Carson John C. (Corona del Mar CA) DeCaro Robert E. (San Juan Capistrano CA) Hsu Ying (Huntington Beach CA) Miyake Michael K. (Westminster CA), Stackable modules and multimodular assemblies.
Segelken John M. (Morristown NJ) Shively Richard R. (Convent Station NJ) Stanziola Christopher A. (Hyde Park NY) Wu Lesley J. (Denville NJ), Stacked board assembly for computing machines, including routing boards.
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