초록 ▼

Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass ar

Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass article being comprised of two end sections, and at least one lateral surface disposed lengthwise between the end sections. The method further comprises laser cutting at least one perforation line onto the lateral surface of the glass article while there is relative motion between the glass article and the pulsed laser and separating the glass article along the at least one perforation line to yield a laser cut glass article.

대표청구항 ▼

1. A system for laser cutting at least one glass article comprising: a glass synthesis station operable to form at least one glass article comprised of two end sections, and at least one lateral surface disposed lengthwise between the two end sections;a glass cutting station comprising a pulsed lase

1. A system for laser cutting at least one glass article comprising: a glass synthesis station operable to form at least one glass article comprised of two end sections, and at least one lateral surface disposed lengthwise between the two end sections;a glass cutting station comprising a pulsed laser assembly operable to laser cut at least one perforation line in the at least one glass article received from the glass synthesis station, and a glass support assembly comprising a conveyor configured to support the at least one glass article during laser cutting with the pulsed laser assembly, wherein the pulsed laser assembly and the glass support assembly are moveable relative to one another, and wherein the pulsed laser assembly comprises a pulsed laser,a rotational arm configured to rotate about the at least one glass article; andan optical assembly positioned in a beam path of the pulsed laser to transform the pulsed laser into a laser beam focal line, the laser beam focal line having a length in a range of between 0.1 mm and 100 mm,wherein the pulsed laser is oriented to induce absorption within the at least one glass article, generating the at least one perforation line comprising a plurality of non-ablated defects in the at least one glass article along the laser beam focal line onto the lateral surface of the at least one glass article while the at least one glass article and the pulsed laser assembly move relative to each other, wherein the at least one glass article is transparent to a wavelength of the pulsed laser, and wherein each non-ablated defect comprises a size of less than 500 nm; anda glass separation station downstream of the glass cutting station and configured to remove a portion of the at least one glass article about the perforation line to produce a laser cut glass article;wherein the conveyor of the glass support assembly is operable to move the at least one glass article as the rotational arm rotates about the at least one glass article. 2. The system of claim 1 wherein the optical assembly comprises a focusing optical element configured to generate the laser beam focal line. 3. The system of claim 1 wherein the conveyor is disposed between the glass cutting station and the glass synthesis station. 4. The system of claim 1 further comprising a cutting station upstream of the pulsed laser assembly. 5. The system of claim 1 wherein the glass separation station includes a thermal shock device, a mechanical stressing component, or combinations thereof. 6. The system of claim 5 wherein the thermal shock device includes a heating element selected from the group consisting of a hydrogen/oxygen burner, a CO2 laser, and combinations thereof. 7. The system of claim 6 wherein the thermal shock device comprises a cooling element downstream of the heating element. 8. The system of claim 1 wherein the glass support assembly comprises a polymeric gripping material in contact with the at least one glass article. 9. The system of claim 8 wherein the polymeric gripping material is rubber. 10. The system of claim 1 wherein the glass support assembly comprises a non-contact support. 11. The system of claim 10 wherein the non-contact support is a horizontal air bearing. 12. The system of claim 1 wherein the glass support assembly comprises a rotatable spindle chuck assembly configured to rotate the at least one glass article. 13. The system of claim 1 wherein the pulsed laser assembly comprises one or more mirrors coupled to and rotatable with the rotational arm. 14. The system of claim 1 wherein the pulsed laser and the optical assembly are coupled to and rotatable with the rotational arm. 15. The system of claim 1 wherein the optical assembly is coupled to and rotatable with the rotational arm, while the pulsed laser is stationary but in communication with the optical assembly. 16. The system of claim 1 wherein the glass synthesis station comprises a Vello downdraw apparatus, a Danner glass forming apparatus, or a ribbon glass blowing apparatus. 17. The system of claim 1 wherein the pulsed laser has an average laser energy of less than about 500 μJ. 18. The system of claim 1 wherein the pulsed laser has a pulse duration of between about 10 picoseconds and about 100 picoseconds. 19. The system of claim 1 wherein the pulsed laser has a pulse duration less than 10 picoseconds. 20. The system of claim 1 wherein the pulsed laser has a pulse repetition frequency of between 10 kHz and 1000 kHz. 21. A system for laser cutting at least one glass article comprising: a glass synthesis station operable to form at least one glass article comprised of two end sections, and at least one lateral surface disposed lengthwise between the two end sections;a glass cutting station comprising a pulsed laser assembly operable to laser cut at least one perforation line in the at least one glass article received from the glass synthesis station, and a glass support assembly comprising a conveyor configured to support the at least one glass article during laser cutting with the pulsed laser assembly, wherein the pulsed laser assembly and the glass support assembly are moveable relative to one another, and wherein the pulsed laser assembly comprises a pulsed laser,a rotational arm configured to rotate about the at least one glass article; andan optical assembly positioned in a beam path of the pulsed laser to transform the pulsed laser into a laser beam focal line, the laser beam focal line having a length in a range of between 0.1 mm and 100 mm,wherein the pulsed laser is oriented to induce the at least one perforation line in the at least one glass article along the laser beam focal line onto the lateral surface of the at least one glass article while the at least one glass article and the pulsed laser assembly move relative to each other, and wherein the at least one glass article is transparent to a wavelength of the pulsed laser; anda glass separation station downstream of the glass cutting station and configured to remove a portion of the at least one glass article about the perforation line to produce a laser cut glass article;wherein the conveyor of the glass support assembly is operable to move the at least one glass article as the rotational arm rotates about the at least one glass article. 22. The system of claim 21, wherein the optical assembly comprises a focusing optical element configured to generate the laser beam focal line. 23. The system of claim 21, wherein the glass synthesis station comprises a Vello downdraw apparatus, a Danner glass forming apparatus, or a ribbon glass blowing apparatus. 24. The system of claim 21, wherein the pulsed laser has an average laser energy of less than about 500 μJ. 25. The system of claim 21, wherein the pulsed laser has a pulse duration of between about 10 picoseconds and about 100 picoseconds. 26. The system of claim 21, wherein the pulsed laser has a pulse duration less than 10 picoseconds. 27. The system of claim 21, wherein the pulsed laser has a pulse repetition frequency of between 10 kHz and 1000 kHz. 28. A system for laser cutting at least one glass article comprising: a glass synthesis station operable to form at least one glass article comprised of two end sections, and at least one lateral surface disposed lengthwise between the two end sections;a glass cutting station comprising a pulsed laser assembly operable to laser cut at least one perforation line in the at least one glass article received from the glass synthesis station, and a glass support assembly that comprises a non-contact support configured to support the at least one glass article during laser cutting with the pulsed laser assembly, wherein the pulsed laser assembly and the glass support assembly are moveable relative to one another, and wherein the pulsed laser assembly comprises a pulsed laser,an optical assembly positioned in a beam path of the pulsed laser to transform the pulsed laser into a laser beam focal line, the laser beam focal line having a length in a range of between 0.1 mm and 100 mm,wherein the pulsed laser is oriented to induce the at least one perforation line in the at least one glass article along the laser beam focal line onto the lateral surface of the at least one glass article while the at least one glass article and the pulsed laser assembly move relative to each other, wherein the at least one glass article is transparent to a wavelength of the pulsed laser; anda glass separation station downstream of the glass cutting station and configured to remove a portion of the at least one glass article about the perforation line to produce a laser cut glass article. 29. The system of claim 28, wherein the non-contact support is a horizontal air bearing. 30. The system of claim 28, wherein the pulsed laser has an average laser energy of less than about 500 μJ. 31. The system of claim 28, wherein the pulsed laser has a pulse duration of between about 10 picoseconds and about 100 picoseconds. 32. The system of claim 28 wherein the pulsed laser has a pulse repetition frequency of between 10 kHz and 1000 kHz.