초록 ▼

In one example a electronic device comprises a housing, at least one heat generating component disposed within the housing, at least one internal heat dissipation device positioned proximate the at least one heat generating component, and a thermal interface defined in at least a portion of the hous

In one example a electronic device comprises a housing, at least one heat generating component disposed within the housing, at least one internal heat dissipation device positioned proximate the at least one heat generating component, and a thermal interface defined in at least a portion of the housing to allow direct thermal contact between the heat dissipation device and an external heat dissipation device. Other examples may be described.

대표청구항 ▼

1. An electronic device, comprising: a housing;at least one heat generating component comprising at least one processor disposed within the housing;at least one internal heat dissipation device comprising a heat spreader positioned proximate the at least one heat generating component; anda thermal i

1. An electronic device, comprising: a housing;at least one heat generating component comprising at least one processor disposed within the housing;at least one internal heat dissipation device comprising a heat spreader positioned proximate the at least one heat generating component; anda thermal interface defined in at least a portion of the housing to allow direct thermal contact between the internal heat dissipation device and an external heat dissipation device, wherein the thermal interface comprises an aperture having a structured surface comprising a plurality of ribs configured to mate with a corresponding structured surface comprising a plurality of ribs thermally coupled to the external heat dissipation device. 2. The electronic device of claim 1, further comprising: a sensor to detect when the internal heat dissipation device is thermally coupled to the external heat dissipation device. 3. The electronic device of claim 2, further comprising: an operating mode management unit comprising logic, at least partly including hardware logic, to: receive a signal from the sensor indicating that the internal heat dissipation device is thermally coupled to the external heat dissipation device; andin response to the signal, to modify a thermal platform operating point (TDP) by modifying a thermal management algorithm for the electronic device. 4. The electronic device of claim 3, wherein the operating mode management unit further comprises logic, at least partially including hardware logic, to: measure at least one thermal characteristic of the electronic device; anduse the at least one thermal characteristic to modify the thermal platform operating point (TDP) by modifying a thermal management algorithm for the electronic device. 5. The electronic device of claim 3, wherein the operating mode management unit further comprises logic, at least partially including hardware logic, to: receive a signal from the sensor indicating that the internal heat dissipation device has been thermally decoupled from the external heat dissipation device; andin response to the signal, to modify a thermal platform operating point (TDP) by modifying a thermal management algorithm for the electronic device. 6. The electronic device of claim 3, wherein the operating mode management unit further comprises logic, at least partially including hardware logic, to: measure at least one thermal characteristic of the electronic device; anduse the at least one thermal characteristic to modify the thermal platform operating point (TDP) by modifying a thermal management algorithm for the electronic device. 7. A chassis for an electronic device, comprising: a housing;at least one heat generating component comprising at least one processor disposed within the housing;at least one internal heat dissipation device comprising a heat spreader positioned proximate the at least one heat generating component; anda thermal interface defined in at least a portion of the housing to allow direct thermal contact between the internal heat dissipation device and an external heat dissipation device, wherein the thermal interface comprises an aperture having a structured surface comprising a plurality of ribs configured to mate with a corresponding structured surface comprising a plurality of ribs thermally coupled to the external heat dissipation device.