Heat exchanger plate and a plate heat exchanger with insulated sensor internal to heat exchange area
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B60H-001/00
F28F-027/00
F28F-003/10
G01M-003/40
G01M-003/18
F28F-003/00
F28F-003/08
출원번호
US-0880855
(2011-10-03)
등록번호
US-9739546
(2017-08-22)
우선권정보
SE-1051102 (2010-10-22)
국제출원번호
PCT/SE2011/051177
(2011-10-03)
§371/§102 date
20130422
(20130422)
국제공개번호
WO2012/053958
(2012-04-26)
발명자
/ 주소
Bertilsson, Klas
Nyander, Anders
Johansson, Christer
Krozer, Anatol
출원인 / 주소
ALFA LAVAL CORPORATE AB
대리인 / 주소
Buchanan Ingersoll & Rooney PC
인용정보
피인용 횟수 :
0인용 특허 :
19
초록▼
A plate heat exchanger includes a heat exchanger plate having a heat transfer area and an edge area, extending around the heat transfer area. The heat exchanger plate is a double wall plate formed by two adjoining plates compressed to be in contact with each other. A sensor configured to sense at le
A plate heat exchanger includes a heat exchanger plate having a heat transfer area and an edge area, extending around the heat transfer area. The heat exchanger plate is a double wall plate formed by two adjoining plates compressed to be in contact with each other. A sensor configured to sense at least one parameter and to produce a signal depending on the parameter includes a sensor probe that is provided between the adjoining plates.
대표청구항▼
1. A double wall heat exchanger plate, comprising a heat transfer area, andan edge area, which extends around and outside the heat transfer area,wherein the double wall heat exchanger plate is formed by two adjoining plates compressed to be in contact with each other,wherein the double wall heat exc
1. A double wall heat exchanger plate, comprising a heat transfer area, andan edge area, which extends around and outside the heat transfer area,wherein the double wall heat exchanger plate is formed by two adjoining plates compressed to be in contact with each other,wherein the double wall heat exchanger plate comprises a sensor which is located in the heat transfer area and is configured to sense at least one parameter and to produce a signal depending on the parameter and that the sensor comprises a sensor probe that is provided between the adjoining plates of the double wall heat exchanger plate, said parameter comprising the capacitance,wherein the double wall heat exchanger plate is configured to be included in a plate heat exchanger having a plurality of the double wall heat exchanger plates being arranged beside each other to define a plurality of first plate interspaces for a first medium and a plurality of second plate interspaces for a second medium,wherein the sensor comprises an insulation which insulates the sensor probe from electric contact with the adjoining plates, andwherein the sensor is configured to be disposed in one of the first or second interspaces. 2. The double wall heat exchanger plate according to claim 1, wherein the sensor probe is made of an electrically conducting material in the shape of at least a wire, a strip or a foil. 3. The double wall heat exchanger plate according to claim 2, wherein the sensor probe is configured to sense the parameter between the electrically conducting material of the sensor probe and the adjoining plates. 4. The double wall heat exchanger plate according to claim 1, comprising a gasket area, which extends around the heat transfer area between the heat transfer area and the edge area and on which a gasket extends. 5. The double wall heat exchanger plate according to claim 4, wherein at least one of the adjoining plates in the gasket area comprises a depression extending along the gasket area in parallel with the edge area, thereby forming a gap between the adjoining plates along the gasket area, and wherein a further gasket is provided in the gap. 6. The double wall heat exchanger plate according to claim 5, wherein the sensor probe is at least partly located in the gap, and wherein the sensor probe is provided beside the further gasket towards the heat transfer area. 7. The double wall heat exchanger plate according to claim 1, wherein the sensor extends to a connection point provided in the edge area. 8. The double wall heat exchanger plate according to claim 7, comprising a gasket area, which extends around the heat transfer area between the heat transfer area and the edge area and on which a gasket extends, wherein a connection part of the sensor, which extends to the connection point, has a foil shape at least at the gasket area. 9. The double wall heat exchanger plate according to claim 8, wherein one of the adjoining plates has a cut-out in the edge area exposing the connection part. 10. The double wall heat exchanger plate according to claim 7, wherein the sensor extends to a further connection point provided in the edge area. 11. The double wall heat exchanger plate according to claim 1, comprising a communication module, which comprises an electronic circuit and communicates with the sensor. 12. The double wall heat exchanger plate according to claim 11, wherein the sensor extends to a connection point provided in the edge area and wherein the communication module is connected to the sensor at the connection point. 13. The double wall heat exchanger plate according to claim 12, wherein the sensor extends to a further connection point provided in the edge area, wherein the sensor comprises a further connection part and wherein the communication module is connected to the further connection part at the further connection point. 14. A plate heat exchanger comprising a plurality of double wall heat exchanger plates according to claim 1, the double wall heat exchanger plates being arranged beside each other to define a plurality of first plate interspaces for a first medium and a plurality of second plate interspaces for a second medium. 15. A plate heat exchanger according to claim 14, comprising a master unit configured to receive and process the signal from a plurality of sensor probes of all the double wall heat exchanger plates, wherein each double wall heat exchanger plate comprises a communication module, which comprises an electronic circuit and communicates with the sensor, and wherein each communication module is comprised by a communication bus which communicates with the master unit.
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