A semiconductor device includes a gate electrode, a gate insulating film which includes oxidized material containing silicon and covers the gate electrode, an oxide semiconductor film provided to be in contact with the gate insulating film and overlap with at least the gate electrode, and a source e
A semiconductor device includes a gate electrode, a gate insulating film which includes oxidized material containing silicon and covers the gate electrode, an oxide semiconductor film provided to be in contact with the gate insulating film and overlap with at least the gate electrode, and a source electrode and a drain electrode electrically connected to the oxide semiconductor film. In the oxide semiconductor film, a first region which is provided to be in contact with the gate insulating film and have a thickness less than or equal to 5 nm has a silicon concentration lower than or equal to 1.0 at. %, and a region in the oxide semiconductor film other than the first region has lower silicon concentration than the first region. At least the first region includes a crystal portion.
대표청구항▼
1. A semiconductor device comprising: a gate insulating film; andan oxide semiconductor film in direct contact with the gate insulating film,wherein the gate insulating film includes silicon and oxygen,wherein the oxide semiconductor film includes a first region in direct contact with the gate insul
1. A semiconductor device comprising: a gate insulating film; andan oxide semiconductor film in direct contact with the gate insulating film,wherein the gate insulating film includes silicon and oxygen,wherein the oxide semiconductor film includes a first region in direct contact with the gate insulating film,wherein the first region includes silicon,wherein a concentration of silicon in the first region is lower than or equal to 1.0 at. %, andwherein a concentration of silicon included in a region of the oxide semiconductor film other than the first region is lower than the concentration of silicon included in the first region. 2. The semiconductor device according to claim 1, wherein the first region has a thickness less than or equal to 5 nm. 3. The semiconductor device according to claim 1, wherein the concentration of silicon included in the first region is lower than or equal to 0.1 at. %. 4. The semiconductor device according to claim 1, wherein the gate insulating film includes carbon, andwherein a concentration of carbon in the first region is lower than or equal to 1.0×1020 atoms/cm3. 5. The semiconductor device according to claim 1, wherein the oxide semiconductor film comprises indium and zinc. 6. The semiconductor device according to claim 1, wherein at least the first region includes a crystal portion. 7. The semiconductor device according to claim 6, wherein a c-axis in the crystal portion is aligned in a direction perpendicular to an interface between the oxide semiconductor film and the gate insulating film. 8. The semiconductor device according to claim 1, wherein the gate insulating film is an inorganic film including carbon, andwherein a concentration of carbon in the first region is lower than or equal to 1.0×1020 atoms/cm3. 9. A semiconductor device comprising: a gate insulating film;an oxide semiconductor film in direct contact with the gate insulating film; andan insulating film in contact with the oxide semiconductor film,wherein the gate insulating film includes silicon and oxygen,wherein the oxide semiconductor film includes a first region in direct contact with the gate insulating film,wherein the first region includes silicon,wherein a concentration of silicon in the first region is lower than or equal to 1.0 at. %, andwherein a concentration of silicon included in a region of the oxide semiconductor film other than the first region is lower than the concentration of silicon included in the first region. 10. The semiconductor device according to claim 9, wherein the first region has a thickness less than or equal to 5 nm. 11. The semiconductor device according to claim 9, wherein the concentration of silicon included in the first region is lower than or equal to 0.1 at. %. 12. The semiconductor device according to claim 9, wherein the gate insulating film includes carbon, andwherein a concentration of carbon in the first region is lower than or equal to 1.0×1020 atoms/cm3. 13. The semiconductor device according to claim 9, wherein the oxide semiconductor film comprises indium and zinc. 14. The semiconductor device according to claim 9, wherein at least the first region includes a crystal portion. 15. The semiconductor device according to claim 14, wherein a c-axis in the crystal portion is aligned in a direction perpendicular to an interface between the oxide semiconductor film and the gate insulating film. 16. The semiconductor device according to claim 9, wherein the gate insulating film is an inorganic film including carbon, andwherein a concentration of carbon in the first region is lower than or equal to 1.0×1020 atoms/cm3. 17. A semiconductor device comprising: a gate insulating film;an oxide semiconductor film in direct contact with the gate insulating film; andan insulating film in contact with the oxide semiconductor film,wherein each of the gate insulating film and the insulating film includes silicon and oxygen,wherein the oxide semiconductor film includes a first region in direct contact with the gate insulating film,wherein the oxide semiconductor film includes a second region in contact with the insulating film,wherein each of the first region and the second region includes silicon,wherein a concentration of silicon in the first region is lower than or equal to 1.0 at. %,wherein a concentration of silicon in the second region is lower than or equal to 1.0 at. %, andwherein a concentration of silicon included in a region of the oxide semiconductor film other than the first region and the second region is lower than the concentrations of silicon included in the first region and the second region. 18. The semiconductor device according to claim 17, wherein the first region has a thickness less than or equal to 5 nm, andwherein the second region has a thickness less than or equal to 5 nm. 19. The semiconductor device according to claim 17, wherein the concentration of silicon included in the first region and the second region is lower than or equal to 0.1 at. %. 20. The semiconductor device according to claim 17, wherein the gate insulating film includes carbon, andwherein a concentration of carbon in the first region is lower than or equal to 1.0×1020 atoms/cm3. 21. The semiconductor device according to claim 17, wherein the oxide semiconductor film comprises indium and zinc. 22. The semiconductor device according to claim 17, wherein at least the first region and the second region include a crystal portion. 23. The semiconductor device according to claim 22, wherein a c-axis in the crystal portion is aligned in a direction perpendicular to an interface between the oxide semiconductor film and the gate insulating film. 24. The semiconductor device according to claim 17, wherein the gate insulating film is an inorganic film including carbon, andwherein a concentration of carbon in the first region is lower than or equal to 1.0×1020 atoms/cm3.
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