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Slurry supply and/or chemical blend supply apparatuses, processes, methods of use and methods of manufacture 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-057/00
  • B24B-057/02
출원번호 US-0218578 (2014-03-18)
등록번호 US-9770804 (2017-09-26)
발명자 / 주소
  • Byers, Gary Allen
  • Derecskei, Bela
  • Bayer, Benjamin Patrick
출원인 / 주소
  • VERSUM MATERIALS US, LLC
대리인 / 주소
    Kiernan, Anne B.
인용정보 피인용 횟수 : 0  인용 특허 : 112

초록

A slurry and/or chemical blend supply apparatus suitable for providing slurry and/or chemical blend to chemical mechanical planarization (CMP) tools or other tools in a semiconductor fabrication facility, related processes, methods of use and methods of manufacture. The slurry and/or chemical blend

대표청구항

1. A slurry and/or chemical blend supply apparatus comprising a bend module and a distribution module, said bend module and said distribution module being in fluid communication, said blend module comprises at least one blend train comprising at least three component pipes, each component pipe for f

이 특허에 인용된 특허 (112)

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